Thin-Film Thickness, Flatness and Hardness Metrology Equipment Suppliers

Product Descriptions

legacy of innovation and industry leadership. Through a powerful combination of industry firsts including a unique single-arch design and smart electronics for unmatched repeatability and performance, HD true color camera for enhanced image resolution and clarity, and a 64-bit parallel processing software architecture for accelerated analysis and best-in-class ease-of-use, DektakXT delivers ultimate performance and efficiency to accelerate advances in materials research and product quality. The remarkable breakthroughs incorporated in this tenth-generation Dektak system enable the critical nanometer-level film, step and surface measurements that will power future advances in the microelectronics, semiconductor, solar, high-brightness LED, medical, scientific and materials science markets. Request a personal demo using your samples, upgrade from your old Dektak, or let us help you find the best solution for your metrology needs. Features include single-arch design provides breakthrough platform stability and leading-edge "smart electronics" that establish a new lownoise benchmark. The new hardware configuration offers 40% shorter collection times than prior generations along with unprecedented efficiency and ease of use Intuitive Vision64™ user interface workflow simplifies operation. The single sensor design enables the widest range of capabilities in a single platform and self-aligning styli enables effortless tip exchange.

 

 

InSight-450 3DAFM for Measuring Roughness, Depth and CD

 

Based on the production-proven InSight 3DAFM platform for 300mm, the Bruker InSight-450 3DAFM is ideally suited for a broad range of roughness, depth and CD applications. Capabilities include bare wafer process validation, roughness characterization and pit/bump/scratch defect metrology; incoming substrate qualification; thin film and epitaxial deposition performance with micro/nano roughness and angstrom-level step height precision; etch depth metrology for process development and control, in-line resist profile measurements of CD, SWA, and LER with full TEM-like profiles; and CMP flatness performance to monitor dishing and erosion. The flexibility of the InSight 450mm AFM means all of these applications are available in a single tool, thus reducing overall cost for metrology. The InSight-450 3DAFM provides this capability with no modeling required, full NIST traceability and no material or wafer damage, making it the ideal tool to provide early learning in 450mm process development with scalability to 450mm production. Bruker Corporation is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for industrial and applied analysis. Contact: Bruker Nano Surfaces Division, Stephen Hopkins, Marketing Communications, Tel: 1-520-741-1044 Ext.1022 or e-mail at  steve.hopkins@bruker-nano.com

 

 

Dektak 150 Surface Profiler: Industry-Best 4-Angstrom Step Height Measurement Repeatability

 

Bruker AXS Inc.’s Dektak® 150 Surface Profiler delivers increased resolution for measuring thin films to 10 nanometers and higher to meet the evolving requirements of today's deposition and etch applications. Veeco has been a leader in film process control for over 40 years The Dektak is a superb tool to monitor thin films as well as critical surface roughness, which is key for optimal process control. The new robust design of the Dektak 150 incorporates a cast-aluminum frame and several vibration and noise reduction features to provide the lowest possible noise floor for measuring extremely thin films. In addition, the Dektak 150 is able to measure thin film stress with longer scan lengths up to 55 millimeters and a larger vertical range up to 1 millimeter. The thin film stress measurement software automatically calculates compressive or tensile stress. The Dektak 150 offers 3D imaging capabilities to map a user-defined surface area to perform in-depth analysis of surface defects and area roughness with Veeco’s exclusive Vision® 3D analysis software.

 

Bruker AXS Inc.

Billerica, MA

www.bruker-axs.com

Contact: Mrs. Sandy Fortunato

Tel: 1-978-663-3660 Ext. 1043

E-mail:  sandy.fortunato@bruker-axs.com

 

 

UV Optical Monitor Model 590

 

The newest thin-film optical monitor from Dyn-Optics, the Model 590, incorporates a deuterium lamp source and photomultiplier receiver along with the standard tungsten halogen source and visible and IR receivers to extend operation down into the UV as low as 180 nm. The UV source is co-aligned with the VIS/NIR source and no re-alignment is necessary to switch between channels or wavelengths for fast, trouble-free setups. The Model 590-UV operates over a full spectrum range from 180 nm up to 2500 nm. With a solid, field-proven design, the 590-series has earned the reputation as being bullet proof and the workhorse of the coating industry. Through continuous, real-time measurements of reflectance and/or transmission of each layer during deposition the 590 Optical Monitor provides a more accurate measurement of each layer as its being deposited than conventional crystal monitoring. With improvements in coating tolerances as much as an order of magnitude, optical monitoring is essential for today’s advanced multi-layer coating designs. Dyn-Optics offers a full line of accessories to compliment the optical monitor including vacuum windows, gimbal mounts, and chip changers. In additional to our standard line, our engineers are available to support your custom and OEM requirements.

 

Dyn-Optics

Sparta, NJ

www.dyn-optics.com

Tel: 1- 973-944-3996

E-mail:  info@dyn-optics.com

 

 

SQM-180 Rate/Thickness Monitor Instrument for Precision Mass and Film Thickness Measurements for Thin Film Deposition Processes

 

Fil-Tech’s SQM-180 Rate/Thickness Monitor is a precision mass and film thickness measurement instrument for thin film deposition processes and other quartz crystal microbalance applications. The SQM-180 has proven reliability and is easy to set up and use. Fil-Tech’s SQM-200 Rate/Thickness Monitor, the next generation monitor, with 8 programmable digital outputs and 4 analog outputs. The SQM-200 manages simple single sensor processes and complicated co-deposition modes allowing function as two separate monitors. The SQM-200 has temporal and spatial averaging for superior accuracy. Fil-Tech also manufactures Quality Crystals® in 6MHz and 5MHz styles with Gold, Longer Life Gold®, Stress Relieving Alloy® , and Advanced Adhesion Alloy™ coating. Gold offers low contact resistance and high chemical stability, Alloy dissipates the stress from deposited dielectric materials to offer longer, steadier, jump free oscillation and Longer Life Gold offers low contact resistance and stress relieving qualities of alloy. Fil-Tech offers sensor head hardware including single and dual feedthroughs, single and dual sensor heads, and sputter heads. Fil-Tech’s single and dual feedthroughs can be mounted on a 1" bolt or 2 3/4" conflat flange. Fil-Tech also supplies electron beam gun replacement parts, ion source parts, and fluids for pumps.

 

Fil-Tech, Inc.

Boston, MA

www.filtech.com

Contact: G. Paul Becker

Tel: 1-617-227-1133 or 1-800-743-1743

E-mail:  paul@filtech.com

 

 

F50 Automated Thin-Film Thickness Mapping System

 

Filmetrics’F50 measures thin-film thickness and n and k are mapped quickly and easily based upon our advanced spectral reflectance system. The motorized R-• stage moves automatically to selected measurement points and provides thickness measurements in seconds. Choose one of the dozens of predefined polar, rectangular, or linear map patterns, or create your own with no limit on the number of measurement points. The entire desktop system is set up in minutes and easily used by anyone with basic computer skills.

 

 

 

F40 Thickness and Optical Constants Measurement System

 

Filmetrics’ F40 converts your microscope into a Thin Film Thickness Measuring Tool. Film thicknesses are measured quickly and easily with this Filmetrics advanced spectrometry systems. Spectral analysis of reflections from the top and bottom of the thin film provides thickness in seconds. For measurements on patterned surfaces and other applications that require a spot size as small as 10 µm, just add the model F40 to the microscope. For common microscopes, the F40 is a simple bolt-on attachment, complete with a c-mount and a CCD camera.

 

Filmetrics, Inc.

San Diego, CA 92123

www.filmetrics.com

Tel: 1-858-573-9300

E-mail:  info@filmetrics.com

 

 

Auto SE™: Thin Film Analysis in One Push of a Button

 

HORIBA Jobin Yvon introduces the Auto SE™, a new and innovative thin film analysis tool that allows characterization of single and multi layers thin films in one push of a button. Within a second, the Auto SE provides accurate film thicknesses and optical constants by acquiring hundreds of wavelengths over a spectral range of 440 nm to 850 nm. As soon as you press the START button, the Auto SE automatically adjusts the height of your sample, maps the entire surface of your wafer for uniformity check and displays the results in a simple way. With a spot size as small as 25 µm × 60 µm and its patented MyAutoView™ color vision system, the Auto SE is the perfect thin film metrology tool for devices characterization and QC analysis of your thin films. For more information go to www.autose.org

 

 

 

 

Adding Reflectometry to Spectroscopic Ellipsometry Simplifies Characterization of Transparent Materials

 

HORIBA Jobin Yvon extends the capabilities of its UVISEL spectroscopic ellipsometer with the addition of an add-on normal incidence reflectometer. Reflectometry offers much simpler and faster (though less comprehensive) characterization of film thickness and index of refraction of transparent materials. Therefore, film thickness for common materials, such as thermal grown oxide or stochiometric nitride, can now be quickly measured by the UVISEL RM in the push of a button. The new reflectometer collects normal incidence reflectance spectra over a broad spectral range of 210 nm to 2100 nm, with a spot size of 200µm. For more complex or absorbing materials such as doped semiconductors or metals, optical constants can first be determined by the UVISEL RM in spectroscopic ellipsometry mode and then fed into the reflectometer for fast thickness uniformity measurements. By combining reflectometry and ellipsometry measurements, the UVISEL RM extends the range of measurable film thickness and provides a unique tool that fulfils both engineering and production needs. For more information go to www.jobinyvon.com/UVISEL

 

 

MM-16 Liquid Crystal Modulation Spectroscopic Ellipsometer for Real Time Thin-Film Deposition Monitoring

 

HORIBA’s MM-16 is a highly accurate, sensitive and affordable spectroscopic ellipsometer that extends the capabilities of classical ellipsometry. The MM-16 provides real time monitoring of film thickness, optical constants and composition. It can be mounted on any PVD, ALD, and MBE vacuum chamber or can be used in conjunction with our electrochemical liquid cell or sample heating stage. The liquid crystal modulation technology delivers high accuracy for the ellipsometric angles across their full range in one measurement, without any dead spots. The full spectral range is acquired in < 2 seconds, at very high resolution. The liquid crystal modulators detect small polarization shifts without any mechanical movement. In addition to the ellipsometric measurements, the MM-16 can provide in one single acquisition, all 16 components of the Mueller matrix. This feature allows users to measure in real time, optical birefringence and depolarization effects and to quantify accurately variations as the film grows. These complex materials properties are widely used in optical coatings, display, biotechnology, packaging and semiconductor applications. The MM-16 covers the visible to NIR spectral range in just 1 second allowing extremely fast measurements necessary for in-situ applications. Combined with the embedded analysis software—DeltaPsi2© —the MM-16 is a spectroscopic ellipsometer for fast and accurate monitoring of deposition processes. The MM-16 can also be used as bench top configuration including automatic variable angle of incidence and X-Y mapping stage for quick films thickness uniformity measurements.

 

HORIBA Scientific

Edison, NJ

www.horiba.com/scientific

Tel: 1-732-494-8660

E-mail:  info.sci@horiba.com or  info@jobinyvon.net

 

 

The Best Measurement Precision Possible for OLED Applications

 

Cygnus 2 Thin Film Deposition Controller provides exceptional value by combining the proven performance of INFICON thin film controllers with unique features, all designed for you to achieve the most from your OLED process. Cygnus 2 uses our ModeLock frequency measurement system to provide stable, high-resolution rate and thickness measurement with an industry-leading rate resolution of 0.00433 A/s every 1/10 second. No other quartz crystal controller has the performance, quality, and features of Cygnus 2, allowing you to make excellence repeatable.

 

 

Feature-Rich IC6 Provides the Best Measurement Precision Possible

 

The INFICON IC6 Thin Film Deposition Controller combines the proven performance of INFICON thin film controllers with several enhanced features for maximizing throughput in optical applications. Continuing the tradition of earlier INFICON models, the IC6 provides exceptional quality and performance, along with unique features to easily maximize deposition processes. Optical processes, such as ophthalmic coatings, band-pass filter, reflective coatings, etc., benefit from high resolution and reliability along with the flexibility to accommodate 50 processes of 200 layers each. The IC6 has the ability to control up to six sources simultaneously for rate and thickness control. Twelve analog outputs are assignable for source control or for rate or thickness recording. Additionally, the color TFT LCD display and menu-driven navigation make operating the IC6 easy and intuitive. Logic and process control capabilities include 100 programmable logic statements, 20 counters and 20 timers. I/O capabilities provide up to 24 relay outputs, 28 TTL inputs, and 14 TTL outputs. Logic statements can be used in cooperation with external inputs or outputs; allowing the IC6 to perform functions that otherwise would require a PLC or other extra equipment. Each logic statement can include up to five functions and can be linked using Boolean logic.

 

 

SQM160 Multi-Film Rate/Thickness Monitor

 

The SQM160 uses proven INFICON quartz crystal sensor technology to measure rate and thickness in thin film deposition processes. Two sensor inputs are standard and four additional sensor inputs are optional. Two recorder outputs provide analog rate and thickness signals. Sensor inputs can be assigned to different materials, averaged for accurate deposition control in large sys- tems, or configured for a dual sensor. The rate-sampling mode allows a shuttered sensor to extend sensor life in high rate processes. Rate displays of 0.1Å/s or 0.01Å/s are user selectable. In addition, the display can be selected to show Frequency or Mass. Four relay outputs allow the SQM160 to control source or sensor shutters, signal time and thickness setpoints, and signal crystal failure. Digital inputs allow external signals to start/stop and zero readings.

 

INFICON

East Syracuse, NY

www.inficon.com

Tel: 1-315-434-1100

E-mail:  reachus@inficon.com

 

 

M-2000® Spectroscopic Ellipsometer

 

The M-2000® line of spectroscopic ellipsometers from J. A. Woollam Co., Inc. is engineered to meet the diverse demands of thin film characterization. An advanced optical design, wide spectral range, and fast data acquisition make it an extremely powerful and versatile tool. The primary application of ellipsometry is to characterize film thickness and optical constants. The M-2000 excels for both. It measures films from sub-nanometer thickness up to tens of microns and the optical properties from transparent to absorbing materials. It is a flexible instrument and can characterize any type of thin film: dielectrics, organics, semiconductors, metals, and more. Wide spectral range and variable angle allow the M-2000 to diagnose many multi-layered structures. The M-2000® delivers both speed and accuracy. Our patented RCE technology combines Rotating Compensator Ellipsometry with high-speed CCD detection to collect the entire spectrum (hundreds of wavelengths) in a fraction of a second with a wide array of configurations. The M-2000 is the first ellipsometer to truly excel at everything from insitu monitoring and process control to large-area uniformity mapping and general-purpose thin film characterization.

 

 

alpha-SE® Spectroscopic Ellipsometer

 

For routine measurements of thin film thickness and refractive index, the J.A. Woollam alpha-SE® is a great solution. Designed for ease-of-use: simply mount a sample, choose the model that matches your film, and press measure. You have results within seconds. Why an alpha-SE? It’s easy-to-use with push button operation and advanced software that takes care of the work for you. Its powerful and proven spectroscopic ellipsometer technology gives you both thickness and index with much higher certainty than other techniques. A flexible spectroscopic ellipsometer, it works with your materials—dielectrics, semiconductors, organics, and more. Now you have the power of spectroscopic ellipsometry at a reasonable price. It’s fast and handles hundreds of wavelengths simultaneously, collected in seconds with immediate results. Applications include qualifying dielectric films with fast measurement speed and push-button operation, the alpha-SE® is ideal for qualifying thin films. Singlelayer dielectrics on silicon or glass substrates can be measured in seconds. Log results for easy-to-use comparisons in both graphical and tabular formats. It also measures self-assembled monolayer phase information of a spectroscopic ellipsometry measurement is highly sensitive to very thin films (<10nm). Selfassembled monolayers can be assessed and quickly compared using the alpha-SE.

 

J. A. Woollam Co., Inc.

Lincoln, NE

www.jawoollam.com

Contact: Veronica Cockerill, Marketing Coordinator

Tel: 1-402-477-7501 Ext. 101

E-mail:  vcockerill@jawoollam.com or  sales@jawoollam.com

 

 

Aleris™ 8330 Film Low-Cost High-Throughput Production Metrology Tool

 

KLA-Tencor Corporation™ introduced the latest addition to the Aleris family of film metrology tools. The Aleris 8330 is a reliable, production worthy, low cost of ownership metrology solution for measuring thickness, refractive index and stress of noncritical* films at the 32nm node and beyond, complementing the existing Aleris 8350 system, which is designed to measure critical* films. The cost-effective Aleris 8330 and the high sensitivity Aleris 8350 form a comprehensive metrology solution for a broad range of film layers, helping fabs identify process issues and maintain high yield during production. The Aleris 8330 includes several features designed for cost-effective films process control: Patented Broadband Spectroscopic Ellipsometry (PBSE), white light reflectometry (WLR) and optional ultraviolet reflectometry (UVR) optics technologies built on an established platform are designed to produce the precision, stability and matching performance required for production monitoring of films; up to 1.85x throughput increase compared to KLA-Tencor's previous generation film metrology tool provides low cost-of-ownership film process control; recipe import from the previous generation platforms (ASET-F5x and SpectraFx™) and remote recipe management ease tool integration into production; recipe sharing among different Aleris tools facilitates a flexible process control strategy within a fab, covering both high-end and low-end film applications; optional StressMapper provides advanced stress measurement capability, helping chipmakers identify process issues that can lead to cracked or delaminated films or cause overlay errors; and reliable, extendible architecture protects fabs' capital investments. *Critical films, such as ultra-thin diffusion layers, typically have the smallest dimensions and narrowest process tolerances.

 

 

Surfscan® SP3 Defect and Surface Quality Inspection Systems for Substrate Manufacturing and IC Process Monitoring

 

The KLA-Tencor Corporation™ new generation in the Surfscan® family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination, the Surfscan SP3 systems feature dramatic advances in sensitivity and throughput over their industry-benchmark predecessor, the Surfscan SP2XP. The Surfscan SP3 platform is also designed for extension to the next wafer size: 450mm. The Surfscan SP3 system is designed to help develop and manufacture substrates for 28nm devices that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids or other defects that disrupt the electrical integrity of the transistor. Because these defects cannot be reliably detected by current-generation inspection systems at production speeds, substrate manufacturers have had difficulty achieving satisfactory yields with these top-grade, next-node wafers. KLA-Tencor’s engineers have built the Surfscan SP3 inspection system with the DUV sensitivity and throughput needed to reliably identify critical defects and surface quality issues inline during substrate manufacturing. In the IC fab, manufacturers must also be able to monitor rough and smooth unpatterned films after deposition and chemical mechanical polish (CMP) to ensure that process tools are not adding defects. The Surfscan SP3 leverages its unique DUV wavelength, special apertures and multiple illumination and collection channels to address stringent 28nm node requirements for defect detection and classification on blanket films at production speeds. The SP3 also offers a module that inspects the back side of wafers for defects that might deform the wafer shape during photolithography.

 

KLA-Tencor

Milpitas, CA

www.kla-tencor.com

Tel: 1-408-875-8733

E-mail:  info@kla-tencor.com

 

 

Thin Film Deposition Control and Measurement—e-Vap® CVS Source Control Modules

 

The MDC e-Vap® CVS Source Control Modules are designed for use with e-Vap® CVS Series Power Supplies. The source control module unit includes filament transformer assembly, hand held remote control and all necessary cables for hook-up with an e-Vap® CVS Power Supply. A maximum output current of 70 amperes assures sufficient power to drive virtually any commercially available electron beam source. e-Vap® CVS Source Control Modules are available in two installation packages, direct flange mount and remote cable mount. Direct flange mount packages are used on all MDC flange mounted evaporation systems. This package allows mounting of the filament transformer to a high voltage feedthrough fitted with a 2.75-inch Del-Seal™ CF flange. Filament transformer attachment is accomplished by bolting the transformer housing via two of the flanges .250-28 bolts positioned 180º apart. The remote cable mount package provides 36-inch of high voltage cable with OFE copper connector lugs and an acrylic high voltage shield. There are two versions of remote mount package typically used with modular source installations. The first version is used where high voltage electrical feedthroughs are fitted with 2-3/4 Del-Seal™ CF flanges, but limited space does not allow direct installation. The second version is used where high voltage feedthroughs are on separate 1-inch bolt feedthroughs. The source control module’s compact size occupies only half the width in a standard 19-inch electronics rack. To facilitate the installation into a standard 19-inch rack, the source controller comes supplied with mounting brackets. If the source control module is purchased in conjunction with an e-Vap® programmable X-Y sweep controller the two units can be fastened together to form the standard 19- inch rack width. MDC offers half-rack spacers if to complete the 19-inch rack mount if only one unit is purchased.

 

MDC Vacuum Products, LLC

Hayward, CA

www.mdcvacuum.com

Contact: Maarten Kramer, VP Sales & Marketing

Tel: 1-510-265-3500 or Toll Free 1-800-443-8817

E-mail:  sales@mdcvacuum.com or  mkramer@mdcvacuum.com

 

 

Layer Thickness Measurement Package

 

The m·u·t GmbH’s Layer Thickness Measurement Package consists of the TRISTAN® spectrometer, a special reading head and our new Software. The system is able to measure transparent layers with a thickness of 0.1 µm to 20 µm under the precondition where the base material is transparent or intense reflective. Then it is also able to detect up to three different layers on one sample. The reading head can be adopted to special customer needs (e.g. shape, handling, etc.). A special table for desktop measurements of layer thicknesses is available.

 

m·u·t GmbH

Wedel, Germany

www.mut-group.com

Tel.: +49-0-4103-9308-0

E-mail:  info@mut-gmbh.de or  judith-hein@gmx.de

 

 

1500 Series Analyzer Accurately Measures Thickness of Diamond-Like Coatings (DLC) On Perpendicular Recording Media for Next Generation Disk Drives

 

n&k Technology, Inc. has a software module that adds the capability to the n&k 1500-D Analyzer of characterizing DLC on perpendicular recording media. The software package enables the 1500-D user to effectively characterize the latest magnetic media that are substantially more complex than older generation media and allow much higher recording densities. The data storage industry is rapidly moving to significantly higher recording densities in response to competition from FLASH memory and an increased penetration of the consumer market with such products as game boxes, DVR, in-car navigation, and various music and video players. Combined with the n&k 1500-D Analyzer that is used to characterize the latest giant magnetoresistive (GMR) heads for next generation disk drive metrology.

 

 

n&k Technology, Inc.

San Jose, CA

www.nandk.com

Tel: 1-408-513-3800

E-mail:  sales@nandk.com

 

 

Atlas® Advanced Metrology System

 

The Nanometrics Atlas metrology system accommodates both 200- or 300-mm wafer metrology. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The Atlas also features robust pattern recognition, improved thickness reproducibility and superior SR (135 WPH for five-site measurement) and SE (90 WPH for five-site measurement) throughput. The N2000 software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. The NanoNet feature, a network component of Nanometrics’ N2000 Analysis Platform software provides system-to-system matching and seamless recipe transferability. The Nanometrics Atlas system can be configured with any combination of the following metrology modules: spectroscopic reflectometer (SR); spectroscopic ellipsometer (SE); optical critical dimension (OCD); diffraction based overlay (DBO) and wafer stress/bow. n&k Analyzer solutions are distinguished by an excellent signalto-noise ratio over the entire deep-UV to near-IR (190 to 1,000 nm) wavelength range. This is a result of our patented all-reflective optics design and is essential for many applications. Metrology tools with a limited wavelength range, or increased noise suffer in terms of capabilities and measurement stability.

 

Nanometrics Inc.

Milpitas, CA

www.nanometrics.com

Tel: 1-408-435-9600

E-mail:  sales@nanometrics.com

 

 

Deposition Monitors

 

Nor-Cal Products’ deposition monitors measure film thickness or rate using crystals as the sensor device. Independent channels monitor different films or average different sensors together to provide a more uniform deposition measurement. The CM-2 model will monitor one or two sensor inputs, while the CM-6 will monitor up to six sensor inputs. These monitors are Class 1 Equipment CE approved. Included are a RS-232 cable and Windows software. This software will allow you to change the monitor’s parameters, save process readings in Excel formatted files, and operate the monitor remotely. Mounting brackets are included and rack-mount extenders are available on request. Nor-Cal also provides crystal sensors, feedthroughs, cables, oscillators and replacement crystals to round out the product offering. Our complete product line includes vacuum chambers, isolation and pressure control valves and other components for the thin film deposition market.

 

 

 

Crystal Sensors and Feedthroughs

 

Nor-Cal Products offers the thin film coating market crystal sensors and feedthroughs, along with vacuum chambers, isolation and pressure control valves and other components. Sensors are either single, with or without water cooling, or dual with a pneumatically actuated shutter and water cooling. Single sensors are also available with an integrated 2.75 CF feedthrough flange or separate feedthroughs are available with 1 inch bolt, 1.33 CF or 2.75 CF flanges sizes. Nor-Cal also provides deposition monitors for up to six sensors to round out the product offering.

 

Nor-Cal Products, Inc.

Yreka, CA

www.n-c.com

Contact: Jacquie Daniel

Tel: 1-530-841-9153

E-mail:  jacquiedaniel@n-c.com

 

 

2830 ZT Wafer Analyzer Advanced Wavelength Dispersive XRF Analysis

 

The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical’s 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm. The 4 kW SST-mAX X-ray tube features groundbreaking ZETA technology which eliminates the effects of X-ray tube aging. ‘New tube’ performance is maintained throughout the tube’s lifetime. Together with high sensitivity, ZETA Technology ensures that rapid analysis and short measurement times are maintained across the lifetime of the tube. ZETA technology strongly reduces the need for drift correction and recalibration that increases productivity and uptime of the instrument. Key features for maximizing sensitivity and stability of 2830 ZT for light elements include a 4 kW output SST-mAX, operating at a high current of 160 mA; dedicated high-performance channels for light elements in the range from boron to magnesium; and dry (oil-free) pumps maintaining a clean, sub-Pascal vacuum within the measurement chamber. The 2830 ZT is supplied with PANalytical’s advanced SuperQ software, which includes FP Multi. The intuitive user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.

 

 

PANalytical, a Spectris Company

Almelo, The Netherlands

www.panalytical.com/semi

Contact: Jacqueline Toms, Manager, Corporate Marketing and Communications

Tel: +31 (0)546 534380

E-mail:  jacqueline.toms@panalytical.com

 

 

TMS-100 TopMap Metro.Lab for Large-Area Topography Measurement of Flatness, Parallelism and Step Height with 20 nm Resolution

 

The Polytec TMS-100 TopMap Metro.Lab is a telecentric inspection system that is ideal for the measurement of surface parameters such as flatness, parallelity or step height. The large vertical scan range of up to 70 mm allows surfaces to be measured that are separated by large steps or are deeply recessed, such as in drill holes. Fast, precise measurement of large areas make these interferometers the optimum tool for quality control, be it spot tests or in-line measurements. Thickness measurement: The chromatic confocal sensor’s highly innovative measuring principle allows thickness measurements of transparent materials with extremely high accuracy. The large height range of 70 mm allows measurements of flatness, parallelism and step height to be made on larger objects under test with 20 nm resolution. An excellent price/performance ratio makes the Metro.Lab attractive for companies with limited budgets, lower throughput requirements or fewer measurement applications. The instrument is designed for metrology lab precision and can even replace many tactile measurements or sit side-by-side with them while not negatively impacting a budget. As is the case with all TopMap systems, the open software architecture allows routine tasks or customized user interfaces to be easily programmed. It is a noncontact topography- measuring interferometer for measurements on surfaces near steep edges (e.g. drill holes) with its telecentric optics. It can handle large or small objects under test due to large 70 mm z-dynamic range with its fast measurement over large field of view and enhanced 80 mm × 80 mm field of view using simplified stitching (optional). Its new TopSens Optical Sensors allow precise Surface Profile and Layer Thickness measurements. These new sensors allow fast and efficient characterization of surfaces, the determination of micro/nano-topography and optical surface roughness, and the thickness measurement of transparent samples. The measuring heads have no moving parts and are therefore robust and maintenance free. The TopSens sensor systems measure any surface and any material, whether reflective, polished, rough, opaque or transparent.

 

Polytec, Inc.

Hopkinton, MA

www.polytec.com/us

Tel: 1-508-417-1040

E-mail:  info-east@polytec.com

 

 

MetaPULSE System for Advanced Packaging Metrology Applications

 

Dynamic growth in advanced packaging arena drives need for critical process characterization technologies. Rudolph Technologies offers the MetaPULSE® G Metrology System for advanced packaging process development applications. The MetaPULSE G System provides thin film metrology capability that is critical in the development and control of advanced wafer level packaging processes that use metal structures, such as redirect layers (RDL) and under bump metallization (UBM) to route signals from the chip to the package. In addition to providing the fast and accurate measurements of thickness, density and roughness, its small spot size and ability to measure structures directly on product wafers allow users to see pattern dependent variations that are not detectable with monitor wafers. The MetaPULSE G System delivers superior performance on all metal films, and is optimized for thin single and multilayer applications that are critical in advanced logic, memory and 3D packaging processes. Unlike optical and x-ray techniques, PULSE™ Technology can be used in active die without special test pads. Its 10 × 10 micron spot size assures measurement capability on product wafers in 30 × 30 micron or smaller test sites.

 

 

Rudolph Technologies, Inc.

Flanders, NJ

www.rudolphtech.com

Contact: Virginia Becker

Tel: 1-952-259-1647

E-mail:  virginia.becker@rudolphtech.com

 

 

SGVacuus Optical Monitor

 

Scalar Technologies Ltd, a developer and manufacturer of non-contact, thin film thickness measurement instrumentation and systems, introduced the SGVacuus, the newest addition to the Scalar family of products. SGVacuus is an in situ broadband optical monitoring system that provides precise measurement and control capabilities for single and multilayer vacuum deposited coating applications.

 

 

Scalar Technologies Limited

Livingston, West Lothian, UK

www.scalartechnologies.com

Tel: +44 1506 414 806

E-mail:  info@scalartechnologies.com

 

 

FilmTek 1000M Thin Film Measurement System at an Affordable Price

 

Scientific Computing International’s FilmTek 1000M is a microscope-based film characterization system that offers high accuracy and small spot size at a very affordable price. This system measures the reflection in the wavelength range of 400nm–1000nm, and uses SCI’s superior FilmTek film modeling algorithm to accurately determine thickness, index of refraction (vs. wavelength), extinction coefficient (vs. wavelength), and multi-layers. Typically, films from 20nm to 150µm in thickness can be routinely measured by FilmTek 1000M. The X-Y stage can handle substrates up to 200mm in diameter. The spot size can be controlled via the use of four available objective lenses, and can be made to be as small as 7µm. An upgrade option can provide for transmission measurements as well.

 

 

 

FilmTek 2000 Fiber-Optic Spectrophotometer with Revolutionary Material Modeling Software

 

Scientific Computing International’s FilmTek 2000 is a breakthrough in thin film metrology technology. FilmTek 2000 combines a fiber-optic spectrophotometer with revolutionary material modeling software to provide an affordable and reliable tool for the simultaneous measurement of film thickness, index of refraction (vs. wavelength), extinction coefficient (vs. wavelength), roughness, and energy bandgap. FilmTek 2000 provides unmatched accuracy, ease of use, and analytical power in a fully integrated package. It is available in manual and auto-stage formats for substrates at any size including large flat panel displays and solar panels. If requested, transmission capability can also be added to FilmTek 2000. This spectrophotometer is available as an in-line film thickness monitor.

 

 

 

FilmTek 2000SE Spectroscopic Ellipsometry with 0.03 Å Repeatability on Native Oxide

 

The Scientific Computing International FilmTek 2000SE is an affordable optical film metrology system that combines spectroscopic ellipsometry with normal angle spectroscopic reflectometry to make it ideally suited for full characterization of very thin to thick films. Thickness, index of refraction (vs. wavelength), extinction coefficient (vs. wavelength), energy band gap, roughness, crystalinity, constituents and void fraction, film gradient, and multi-layers can be measured. Basically, any unknown film from 1 angstrom to tens of microns in thickness can be measured by FilmTek 2000SE as long as light can travel through the film. Using a rotating compensator design, and benefiting from Multi-Angle Differential Polarimetry (MADP) technology, FilmTek 2000SE can measures film thickness and index of refraction independently from each other.

 

 

Scientific Computing International

Carlsbad, CA

www.sci-soft.com

Contact: Kambiz Farnaam, , Ph.D., V.P. of Marketing

Tel: 1-510-301-6128

E-mail:  kambiz@sci-soft.com

 

 

STM-2XM Next Generation Rate/Thickness Monitor

 

The STM-2XM is the next generation rate/thickness monitor from Sycon Instruments. Implementing features only available in more expensive and complicated controllers, the STM-2XM is the perfect instrument for semi-automatic deposition control and monitoring. The STM-2XM can manage simple “single sensor” processes as well as more complicated co-deposition and alloy processes. The STM-2XM features a high contrast LCD display and an intuitive scroll-box / spin-knob menuing system. The STM-2XM was designed to be user friendly, with features such as “on-line help”, context-specific menus, and “hints” on the operating screen. It features the same high speed, high accuracy measurement engine as our other controllers with temporal averaging for superior accuracy even at very low rates. Spatial averaging is used for superior accuracy in large chambers or while using planetary fixtures. The independent mode allows the STM-2XM to function as two completely separate monitors with shutter delay for precise control of film quality. Rate sampling is capable and greatly extends crystal life for thicker films. The advanced alloy mode includes linked shutter delay capability. The “Time/Power” feature allows films to complete even with a crystal failure. Rate, thickness, and rate deviation graphs are provided. The display’s units are in mass or thickness with 8 programmable digital inputs, 8 programmable digital outputs, and 4 analog outputs.

 

 

STC-2000A Deposition Rate Controller

 

The STC-2000A from Sycon Instruments has advanced electronics, LCD display, storage for 50 film programs, 9 process recipes and programmable input/output structure give the user versatility and performance. The STC-2000A uses the time-proven 6 MHz oscillating quartz crystal as the sensor device. The STC-2000A microprocessor technology enables the direct solution of the complex mathematical equation associated with the frequency shift versus mass loading characteristics of the quartz crystal sensor. Its computational power allows the measurement of the material accumulated on the sensor crystal to be accurately converted to film thickness using the exact equation; inaccuracies due to approximations and limited ranges of material constants do not contribute to thickness and rate errors. An innovative frequency measurement system allows the STC-2000A to acquire and display 10 measurements per second with 0.0088 Å/measurement rate resolution on each of the sensor input channels. The standard STC-2000A is equipped with 8 relays, 8 optocoupled inputs, a RS-232 computer interface, and high-resolution analog control and recorder outputs. A rack mount for half-rack mounting is also standard. Features include: multi sequence multi-film process control; a high resolution/high speed measurement engine; 10 measurements per second at 0.0088 Å/s rate resolution; RS232 (optional RS485) interface for serial communications; easy to read LCD display with touch panel interface; versatile I/O programming; and industry standard 6 MHz crystals. The high thickness resolution is 0.013 Angstrom per measurement (for aluminum). The High Rate Resolution is 0.0088 Angstrom per measurement rate. The high accuracy is ± 0.5% thickness + 1 count.

 

 

STM-100/MF Thin Film Deposition Thickness/Rate Monitor

 

The Model STM-100/MF Thickness/Rate Monitor from Sycon Instruments, Inc. is a precision mass and film thickness measurement instrument for thin film deposition processes and other quartz crystal microbalance applications. The STM-100/MF has proven very tough and reliable. Easy to setup and use, the STM-100/MF has a history that makes it the one to have for deposition monitoring. Features include Multi-Film Program Storage and with a high resolution and high-speed measurement engine. It has 1 Å thickness resolution with 0.1 Å/s rate resolution. It can make 4 measurements per second and has a multiple function high readability back-lit LCD. Analog output of rate or thickness is ±0 to 10V with 12 bit resolution. It has a low maintenance sensor design and an industry standard 6 MHz sensing crystal. The unit has a RS-232 Interface and a LabVIEW™ front panel interface. In Multi Mode Operation includes Thickness/Rate Monitor, Negative Thickness Monitor and Sensor Frequency Monitor. Its high speed makes four measurements per second. Resolution is 0.1Å per second. High Accuracy is ±0.5% thickness ±1 count and the measurement range is 500 kÅ aluminum equivalent. Relay Outputs are four 1.5 amp SPST N.O. contacts with Shutter Control, Thickness Set point, Timer Set point and Crystal Failure. Remote inputs include four TTL compatible inputs with Open Shutter, Close Shutter, Zero Thickness and Zero Time functions. Setpoints monitor End Thickness of 0.000 to 9999 kÅ and setpoint thickness of 0.000 to 9999 kÅ. A timer covers 00:00 to 99:59 minutes/seconds.

 

Sycon Instruments, Inc.

East Syracuse, NY

www.sycon.com

Tel: 1-315-463-5297

E-mail:  info@sycon.com

 

 

Nvision Thin Film Mapping and Characterization Instruments

 

Telemark’s Nvision Thin Film Mapping and Characterization instruments provide real-time, inline or off-line measurements of film thickness or transmission. Software modules are available for resist thickness measurements, actinic reflectance measurements for film stack optimization, thickness contour maps, and spectrum and color measurement on transmissive filters. Whether you need thickness, reflectance or transmittance measurements, Telemark can provide the solution.

 

 

 

 

 

Model 880 Deposition Controller

 

Telemark’s Model 880 Controller is based on a multi-microprocessor design, which provides the best combination of resolution (high) and update speed (fast) on the market. The unit has four slots for I/O cards that can house either an input card (8 optically isolated inputs) or an output card (8 form-C SPDT relays). The sensor-head/source-control modules provide two channels each for crystal frequency measurement and two separate, isolated, analog 0 to 10 volt (plus and minus) outputs for source control. The 880 can house four such modules, supporting up to eight channels of sensor input and 8 analog outputs, and enabling averaging and co-deposition functions. Advanced measurement technique provides high accuracy at constant 100 ms measurement period. RS232/485 interface standard, industrial fields busses optional. Flash memory removable module option for transferring process recipes, and for back-up in case of failure. Thickness display is 0.000 to 999.9 kÅ and the rate display is 0.0 to 999 Å/s. Source outputs are ±2.5, 5 or 10 volts @ 10 mA with 4 user definable function keys.

 

Telemark

Battle Ground, WA

www.telemark.com

Tel: 1-360-723-5360

E-mail:  sales@telemark.com

 

 

High Speed Compact Ellipsometer

 

The ULVAC UNECS-2000/UNECS-3000 Spectroscopic Ellipsometers measure thin film thickness and optical constants faster and more efficiently than conventional mechanically controlled rotating optical devices. The compact UNECS design with built-in light source and controller is simple and inexpensive to operate and maintain. The emitter and sensor heads are small with builtin light source and controller. UNECS comes with the computer control and analysis software. Using parallel measurement, the thickness of up to six individual film layers are measured simultaneously. Measurements at 20 ms/point permit fast inspection of samples. The UNECS-2000 motor stage can handle samples up to 200 mm in diameter. The UNECS-3000 features an automatic mapping function to measure thickness distribution across a 300 mm substrate.

 

 

ULVAC Technologies

Methuen, MA

www.ulvac.com

Tel: 1-978-686-7550

E-mail:  sales@ulvac.com