Thin & Thick Film Metrology, Measurement, Characterization & Analysis Equipment

Product Descriptions

the unique design by Angstrom Sun Technologies’, users can employ digital imaging capabilites in Microspectrophotometers (MSP series) with live video, powerful digital editing, measurement tools for reflection, transmission, absorption spectra. Data acquisition only takes milliseconds. TFProbe software allows user to set up heating stage or cooling stage for kinetic study in real time for optical property changes such as reflectance, transmittance, coating thickness, refractive index (optical constants) etc. Automatic mapping function is also available in various microspectrophotometer models with motorized X-Y stage or Rho-Theta Stage and also motorized focus function using Joystick. Wavelength range usually is an important factor for user to consider. Angstrom’s microspectrophotometer covers from deep-ultraviolet (DUV) to near-infrared (NIR) ranges. Which range should be considered will depend on several factors such as what are thickness ranges for thin film or thick coating, what is typical wavelength range of interest for reflectance or transmittance. The MSP series can measure the film thickness and refractive index on up to 5 layers over a micron size region.

 

Angstrom Sun Technologies Inc.

Acton, MA

www.angstec.com

Tel: 1-978-263-6678

E-mail:  info@angstec.com

 

 

Production Line Thin Film Composition and Thickness Monitor

 

The Axic Precision P-1000 readily analyzes compound thin films utilized in semiconductor, superconductor, magnetic and applications. This fully automatic system provides rapid composition and thickness analysis of films in the production environment. In process development, the Precision P-1000 is utilized to characterize the effect of variables on the film deposition process. Once the process is defined, the Precision P-1000 is utilized as a quality control monitor to insure the composition and thickness of the production films. It utilizes a helium environment spectrometer, thus eliminating the vacuum requirement and greatly improving system reliability. Most analyses are performed using the wavelength dispersive spectrometer (WDS), giving high precision measurements. For some applications, the energy dispersive (EDS) spectrometer is used simultaneously with WDS to optimize analysis time e.g. thick silver films (20,000Å to 30,000Å) on Ti-Ni. The Precision 1000-B® system is employed for the precise rapid measurement of thin films for composition and thickness non-destructively. The system is compact in design, easily operated and convenient in operation.

 

 

 

 

AXIC Inc.

Santa Clara, CA

www.axic.com

Tel: 1-408-980-0240

E-mail:  info@axic.com

 

 

Fully Tested and Warranted Vacuum Equipment

 

Bid Service LLC has been supplying fully tested and warranted equipment to the semiconductor and scientific community for over 30 years. Our 30-day money back policy has become the standard of the industry. Our reputation for quality and integrity is second to none.

 

Bid-Service LLC

Freehold, NJ

www.bidservice.com

Tel: 1-732-863-9500

E-mail:  sales@bidservice.com

 

 

BWS-LRI-PS Laser Reflectance Interferometer

 

The BWS Laser Reflectance Interferometer is a versatile tool for monitoring the growth of optical films. The Blue Wave written LABView program provides in-situ information on optical film growth. The BWS Laser Reflectance Interferometer is a tool designed to give real time information into the growth of thin films. The machine is designed to work with BWS HFCVD and PLD, though it can be configured to work with any deposition system with sight lines to the substrate. The tool is designed to work with diamond, oxides, and other optical thin films. Applications include in-situ film thickness measurements, real analysis of film quality and determination of start of film growth

 

 

 

Blue Wave Semiconductors, Inc.

Baltimore MD

www.bluewavesemi.com

Tel: 1-301-706-8833

E-mail:  rd@bluewavesemi.com

 

 

NPFLEX™ 3D Surface Metrology System

 

The Bruker NPFLEX™ provides a flexible, non-contact, 3D areal surface characterization for such large samples. It also provides data density, resolution, and repeatability beyond what is possible with contact instrumentation, making it suitable as both a complementary technology or as a stand-alone metrology solution. The NPFLEX enables superior flexibility, accuracy, and throughput for precision manufacturing, providing an easy path to tighter tolerances, more efficient processes and better end products. Based on white light interferometry, this non-contact system offers many benefits beyond such traditional contact measurement technologies as coordinate measuring machines (CMMs) and industrial stylus profilers. These benefits include three-dimensional (3D) images, rapid data-rich acquisition, and greater insight into part performance and functionality. The culmination of decades of expertise in interferometric technology and large-sample instrument design, the NPFLEX is the first optical metrology system to handle micro to macro features effortlessly on samples of widely varying sizes. Each measurement contains complete surface information for multiple analyses. Interferometry provides sub-nanometer vertical resolution at every pixel. The white light interferometric technique of the NPFLEX provides a 3D, non-contact means of measuring virtually any surface feature, while providing accessibility to areas of an object that simply can’t be reached with a touch probe or other profilometer.

 

 

Dektak 150 Surface Profiler for 4-Angstrom Step Height Measurement Repeatability

 

Bruker AXS Inc.’s Dektak® 150 Surface Profiler delivers increased resolution for measuring thin films to 10 nanometers and higher to meet the evolving requirements of today’s deposition and etch applications. Veeco has been a leader in film process control for over 40 years The Dektak is a superb tool to monitor thin films as well as critical surface roughness, which is key for optimal process control. The robust design of the Dektak 150 incorporates a cast-aluminum frame and several vibration and noise reduction features to provide the lowest possible noise floor for measuring extremely thin films. In addition, the Dektak 150 is able to measure thin film stress with longer scan lengths up to 55 millimeters and a larger vertical range up to 1 millimeter. The thin film stress measurement software automatically calculates compressive or tensile stress. The Dektak 150 offers 3D imaging capabilities to map a user-defined surface area to perform in-depth analysis of surface defects and area roughness with Veeco’s exclusive Vision® 3D analysis software.

 

 

Bruker Nano Surfaces Division

Tucson, AZ

www.bruker-nano.com

Contact: Stephen Hopkins, Marketing Communications

Tel: 1-520-741-1044 Ext. 1022

E-mail:  steve.hopkins@bruker-nano.com

 

 

20/20 PV™ Microspectrophotometer for Measuring Thickness of Thin Films and Imaging

 

The 20/20 PV™ microspectrophotometer from CRAIC Technologies incorporates the latest technological advances in optics, spectroscopy and software to deliver the superior performance with speed and advanced capabilities. Featuring the ease-of-use, this instrument uses cutting edge UV-visible-NIR and Raman microspectroscopy. The 20/20 PV™ combines the latest technologies to allow the user to measure UV-visible-NIR range transmission, absorbance, reflectance, Raman, emission and fluorescence spectra of sample areas smaller than a micron across. The thickness of thin films and color spaces may be determined. And while microspectra are being acquired, the sample may be viewed with high-resolution digital imaging in the deep UV, in color or in the near infrared. Ease of use features also add to the power of the 20/20 PV™ system and include everything from improvements in the instruments ergonomics to software to automation. The 20/20 PV is simple to use, the measurements are non-destructive and the spectral data is unmatched. Features include permanently calibrated measurement areas on the micron scale, superior imaging both with eyepieces and digital imaging and full manual or automatic operation.

 

CRAIC Technologies, Inc.

San Dimas, CA

www.microspectra.com

Tel: 1-877-882-7242

E-mail:  sales@microspectra.com

 

 

New Nano-Hardness Tester (NHT) for Characterization of MoS2 Thin Films

 

The CSM Instruments’ NHT is especially suited to providing quantitative data on the hardness and modulus of sub-micron thin films and coatings, using an indentation method where a tip of known geometry is driven into the sample surface. The instrument itself can be seen in Fig.1 and features automated optical microscopic inspection before and after indentation. The force on the indentor (all geometries can be used) is applied by an electromagnetic actuator, whilst the displacement is measured via a capacitive system, giving a force resolution of 10µN and displacement resolution <1nm. The NHT has several advantageous features, in particular its differential measurement of the sample surface, made possible by a sapphire reference ring which allows exact relative positioning of the indentor tip. Thus the elasticity of the sample and holder is compensated, as is thermal drift during measurement. Full automation, together with optical observation make this an ideal instrument for better characterisation of thin films and coatings.

 

 

 

 

Scratch Testers

 

CSM Scratch Testers are dedicated instruments for characterizing the surface mechanical properties of thin films and coatings, e.g. adhesion, fracture and deformation. The scratch tester’s ability to characterize the film-substrate system and to quantify parameters such as friction and adhesive strength, using a variety of complementary methods, makes it an invaluable tool for research, development and quality control. This technique involves generating a controlled scratch with a sharp tip on a selected area. The tip material (commonly diamond or hard metal (WC)) is drawn across the coated surface under constant, incremental or progressive load. At a certain critical load the coating will start to fail. The critical loads are very precisely detected by means of an acoustic sensor (MST & RST) attached to the load arm but can also be confirmed and collated with observations from a built-in optical microscope. The critical load data is used to quantify the adhesive properties of different film - substrate combinations. In addition to acoustic emission, the Scratch Testers measure the applied normal force, the tangential (friction) force and the penetration depth. These parameters, together with the acoustic emission data, provide the mechanical signature of the coating system.

 

CSM Instruments Inc., Bureau CSM AUX USA

Framingham, MA

www.csm-instruments.com

Tel: 1-508-620-5374

E-mail:  usinfo@csm-instruments.com

 

 

Model 590 Thin Film Optical Monitor for Real Time Monitoring of Thin Film Coatings

 

The Dyn-Optics Model 590 Optical Monitor has a solid, field-proven design, earning a reputation as being bullet proof and the workhorse of the coating industry. By continuously measuring the reflectance and/or transmission of each coating optically, the 590 Optical Monitor provides a more accurate measurement of each layer as its being deposited than with conventional crystal monitoring. With improvements in coating tolerances as much as an order of magnitude optical monitoring is essential for advanced multi-layer coating designs. An optional PC interface (USB or RS-232) allows remote control of the 590 as well as an End of Layer termination signal to communicate with the coating system process controller. The 590 features extended operation into the UV and IR spectrum. Dyn-Optics offers a full line of accessories to compliment the optical monitor including vacuum windows, gimbal mounts, and chip changers. In additional to our standard line, our engineers are available to support custom and OEM requirements.

 

 

Dyn-Optics

Sparta, NJ

www.dyn-optics.com

Tel: 1-973-944-3996

E-mail:  sales@dyn-optics.com

 

 

SQM-180 Rate/Thickness Monitor for Precision Mass & Film Thickness Measurement

 

Fil-Tech’s SQM-180 Rate/Thickness Monitor is a precision mass and film thickness measurement instrument for use in thin film deposition processes and other quartz crystal microbalance applications. The SQM-180 has proven very tough and reliable and is easy to set up and use. Fil-Tech SQM-200 Rate/Thickness Monitor is the next generation monitor with 8 programmable digital outputs and 4 analog outputs. The SQM-200 can manage simple single sensor processes and complicated co-deposition mode allowing it to function as two separate monitors. The SQM-200 has temporal and spatial averaging for superior accuracy. The SQM-200 is perfect for semi-automatic deposition control and monitoring controller power at a low cost. Fil-Tech also supplies 6MHz and 5MHz Quality Quartz Crystals, sensor heads, feedthroughs and custom made hardware. Fil-Tech also supplies electron beam gun replacement parts including filaments, insulators, beam formers, anodes, electromagnetic coils, and OFHC copper crucibles and covers. Fil-Tech also supplies, ion source parts for Veeco and Ion Tech, fluids for pumps, and Alcatel and Varian style leak detector filaments. Contact Fil-Tech at 1-800-743-1743 or visit www.filtech.com for cross referencing and pricing information.

 

Fil-Tech, Inc.

Boston, MA

www.filtech.com

Contact: G. Paul Becker

Tel: 1-617-227-1133 or toll free 1-800-743-1743

E-mail:  paul@filtech.com

 

 

F50 Automated Thin-Film Thickness Mapping System

 

Filmetrics’ F50 measures thin-film thickness and n and k are mapped quickly and easily based upon our advanced spectral reflectance system. The motorized R-Theta• stage moves automatically to selected measurement points and provides thickness measurements in seconds. Choose one of the dozens of predefined polar, rectangular, or linear map patterns, or create your own with no limit on the number of measurement points. The entire desktop system is set up in minutes and easily used by anyone with basic computer skills.

 

 

 

 

aRTie Spectral Reflectometer for Film Thickness and More

 

Measure film thickness and much more with Filmetrics’ new aRTie spectral reflectometer. Options included simultaneous transmittance measurement and refractive index measurement. On-board reflectance calibration and wavelength calibration are standard. The 380-1050nm wavelength version is USB-powered and has an internal 40k-hour light source. Versions covering up to 200-1700nm wavelengths are also available.

 

 

 

 

Measure AR Coatings and Other Films with the F10-ARc

 

Filmetrics’ new F10-ARc measures reflectance, color, and anti-reflection qualities of lenses and other small samples. It also measures film thickness and refractive index with convenient software upgrades. This easily-portable system is USB-powered and measures without sample backside prep due to our proprietary backside-rejection technology. On-board reflectance and wavelength calibration are standard, as are a 40k-hour light source.

 

 

 

Filmetrics, Inc.

San Diego, CA 92123

www.filmetrics.com

Tel: 1-858-573-9300

E-mail:  info@filmetrics.com

 

 

IL540 Optical Monitors

 

4Wave, Inc. IL540 optical thickness monitors operate on substrates on rotating workholders, ensuring accurate and repeatable measurements of thin films during deposition. The optical thickness monitors use a single wavelength transmission or reflection method as well as sophisticated data modeling and filter techniques to determine the thickness of a deposited film. The IL540 can be equipped with either a white light source and an automated monochromator, or with a narrow band IR laser for DWDM applications. All DWDM optical monitors come with a detector module, industrial computer, color monitor, keyboard, mouse, and control software. The IL540 also provides for data capture on rapidly rotating substrates. Features include a white light source and the IL540 is suitable for a variety of box coaters and smaller vacuum chambers. Layer thicknesses are automatically terminated and the instrument can deal with complex multilayer structures. The standard wavelength range is 350 to 800 nm. The typical mechanical arrangement is for reflectance, but the source can be moved to a third port to provide transmitted light. Layer thickness termination accuracy is under 1 percent of the wavelength in use. With an IR laser source centered on 1550 nm, the IL540 is the unsurpassed solution for accurate, in-process measurement of film thickness during the production of DWDM optical filters. It measures filters with passbands as narrow as 25 GHz. The following design features make this possible: fiber optic interfacing to the process chamber; state-of-theart detection circuitry that provides outstanding noise immunity of 160 dB/decade and 126 dB of gain; automatic gain and offset adjustment; 16 position filter wheel or a monochromator option for automatic wavelength selection during the process; a unique sample and hold facility for rotating substrates; a fully implemented communications interface that provides access to all facilities, including gains and offsets, for turnkey installation with a CPU; and a Windows 98 interface.

 

 

In-Situ Process Monitoring

 

4Wave Inc. provides in-situ process monitoring in various ion beam and thin-film processes. We are highly experienced in the integration of these systems for the automatic control of process gas mixing, etch endpoint control, and deposition endpoint control. Our experience with integration of in-situ optical monitoring in ion beam systems includes optical instrumentation systems based on optical interference: As the North American agent for Intellemetrics, 4Wave has integrated a reflective optical monitoring system used for laser bar facet coatings. Etch endpointing by secondary ion mass spectrometry (SIMS): 4Wave employees integrated the first SIMS units into production IBE systems. The SIMS units monitor the composition of the flux sputtered from the etching film. This technique can be used to reliably endpoint an etch terminating at or near the interface of almost any two dissimilar materials, with better than 2 angstrom accuracy (in an open area of only 2 percent). Multi-step, multi-interface endpointing is also possible. This is an extremely reliable, sensitive and versatile endpointing technology. Etch endpointing is by optical emission spectroscopy (OES). 4Wave employees have integrated optical emission spectrometers into IBE systems. These systems measure the optical spectrum of the photons emitted at the etching film surface. Materials of different composition have correspondingly different spectra. Hence, this technique can be used to reliably endpoint at the interfaces of many dissimilar materials. Partial pressure control by residual gas analysis (RGA) uses partial pressure control in reactive deposition and etch systems by actively monitoring partial pressure with an RGA and controlling the gas flows into the chamber to meet established target partial pressures and deposition thickness monitoring by quartz crystal oscillators: 4Wave employees have extensive ex- perience in the use of quartz crystal oscillators to monitor and control deposition thickness..

 

4Wave, Inc.

Sterling, VA

www.4waveinc.com

Contact: Trey Middleton

Tel: 1-703-787-9283

Email:  tmiddleton@4waveinc.com

 

 

TMC13 Quartz Thickness Monitor

 

The Henniker Scientific TMC13 six-channel quartz crystal thin film deposition rate/thickness rate controller is a touchscreen device for independent control of up to 6 (six) quartz crystal heads. It features shutter relays on each channel, two analogue inputs for connection of pressure gauges, and two re-transmission analogue outputs as standard. It is designed for repeatable, reliable and accurate control of vacuum based thin film deposition processes by providing a direct display and control of film thickness, deposition rate and frequency value. The TMC13 features an extensive and fully editable materials library, tooling factor parameters and large, easy to view display of average values of thickness, deposition rate and crystal frequency. The display screens can be easily customized to suit a particular operator preference, pressure readings for example can simply added to the main display if a suitable pressure gauge is connected. Film thickness and deposition rate can be controlled in manual or automatic mode, via thickness or time. The unit also incorporates an alarm list that will warn the operator about crystal frequency and lifetime. It provides simultaneous measurement of thickness, rate and frequency from 6 channels, independent relay outputs on each channel and user defined materials list and/or manual configuration of material density and acoustic impedance. Also, it has user-defined endpoint with tooling factors and primary sensor type, analogue inputs and outputs and store and recall of user defined configurations.

 

Henniker Scientific Ltd

Warrington, Cheshire, England

www.henniker-scientific.com

Tel: +44 (0) 1925 830771

E-mail:  info@henniker-scientific.com

 

 

Pulsed Plasma Characterization

 

The performance of the Hiden family of plasma diagnostic tools is advanced by integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully controllable within the MASsoft operating program. Two timers provide ‘gate open/close’ and ‘gate increment’ periodicity with sub-microsecond gating resolution to just 100 nanoseconds, phasing data acquisition precisely with each individual plasma pulse. Enabled instruments include the Hiden ESPion Langmuir-style probe for measurement of plasma ion and electron densities and energies, and the Hiden PSM and EQP quadrupole mass spectrometers for characterization of both positive and negative plasma ion species together with their abundance and their ion energies. All are supported by a comprehensive range of accessories with differential pumping options for processes operating up to 5 bar. The ESPion probe is available in versions for operation in both RF and DC plasma, at elevated temperatures and in diverse lengths in excess of 1000mm. Compatible bellows-sealed Zí-drives have up to 900mm translation. The EQP and compact PSM plasma monitors share similar software, the EQP system featuring a high-definition sector-field energy filter and energy range ±1000eV. The integral electron bombardment ion source is used for neutrals/radicals measurement and for studies of electronegative species by electron attachment.

 

 

New SIMS System Family Trio for Thin Film Depth Profiling

 

Secondary ion mass spectrometry (SIMS) is a versatile, highly-sensitive technique for surface analysis and surface depth profiling of diverse materials. Hiden Analytical expands their primary system options to offer the choice of three initial equipment levels to suit a broad spread of budget capacities. All systems offer full UHV operation and expandability to the top-level specification. The dual-mode MAXIM mass spectrometer features operation both in the secondary ion mode and in the secondary neutral(SNMS) quantification mode. The Foundation SIMS System includes the IG20 fine-focus(50 micron) oxygen/argon ion gun, multiple sample holder and primary ion beam monitor. An uplifted version ñ the SIMS Workstation ñ is configured for higher throughput rates with the addition of a sample load lock and sample manipu- lator, together with charge-neutralising electron flood gun and system bakout facility. The SIMS Workstation Plus has the most comprehensive specification with the addition of the IG5C Caesium ion gun for electronegative species, having a spot size of just 20 micron. The MASsoft Professional SIMS PC data system provides automated measurement of positive and negative ions and of neutral species. It enables full control of the mass spectrometer and ion gun operating parameters and ion beam raster, with acquired data presented in real time. The ESM Lab-VIEW SIMS Imaging program acquires, stores and displays the data for presentation in the form of elemental surface maps with both 2D and 3D view capabilities.

 

 

Quadrupole Mass Spectrometers for UHV/XHV Materials Studies

 

Hiden Analytical introduce a family of quadrupole mass spectrometers designed specifically for UHV/XHV performance, evolved from the Hiden 3F-series concept and incorporating the proven triple-stage mass filter technology for optimum mass separation, ion transmission efficiency and contamination resistance. Pulse ion counting detection is common throughout this series for highest sensitivity and fastest response times, with choice of positive-ion-only or combined positive and negative ion detection. Quadrupole mean energy scanning is featured for systems configured for analysis of externally generated ions, enabling ion energy distribution measurement and optimisation for neutrals analysis. All systems feature the Windows-MASsoft Pro multi-mode control program with multi-parameter scanning for optimisation of operating parameters for each individual mass channel. Ion detection is by fast pulse counting with continuous 7-decade scaling from 1c/s to 10E+7c/s. Sampling rates exceed 500 measurements per second, with partial pressure detection down to 5x10E-15 mbar and trace level detection to 5ppb. A choice of ionisation sources enables system optimisation for varied applications including molecular beam, laser ablation, thermal desorption and general neutrals studies. All ion source parameters are software controlled with modes for electron attachment, ‘soft’ ionisation and appearance potential measurement.

 

Hiden Analytical Inc.

Livonia, MI

www.hidenanalytical.com

Contact: Mark Buckley, Vice President

Tel: 1-734-542-6666

E-mail:  info@hiden.co.uk

 

 

Smart SE Powerful and Cost Effective Spectroscopic Ellipsometer

 

The Smart SE from HORIBA Scientific is a versatile spectroscopic ellipsometer for fast and accurate thin film measurements. It characterizes thin film thickness from a few Angstroms to 20µm, optical constants (n, k), and thin film structure properties (such as roughness, optical graded and anisotropic layers, etc). The spectral range from 450 to 1000nm is measured in a few seconds and ellipsometric data are analyzed using the DeltaPsi2 software platform. The software integrates two levels of software to fulfill both routine analysis with predefined recipes and advanced analysis with state-of-the art ellipsometric modeling. The Smart SE ellipsometer is a cost effective thin film R&D tool with no compromise on features, and delivers research grade performance at an economical price. It provides an integrated vision system for accurate spot positioning, seven automated micro spots with size ranging down to a few tens of microns for measurement of small features, and the ability to measure the complete 16-element Mueller matrix in just a few seconds for the study of complex samples. The flexible design of the Smart SE enables full automation of the sample stage and goniometer as well as in-situ use on process chambers. It matches any application or budget for a wide variety of application areas including microelectronic, photovoltaic, display, optical coatings, surface treatments and organic compounds.

 

 

Reflectometry + Spectroscopic Ellipsometry Simplifies Characterization of Materials

 

HORIBA extends the capabilities of its UVISEL spectroscopic ellipsometer with the addition of an add-on normal incidence reflectometer. Reflectometry offers much simpler and faster (though less comprehensive) characterization of film thickness and index of refraction of transparent materials. Therefore, film thickness for common materials, such as thermal grown oxide or stochiometric nitride, can now be quickly measured by the UVISEL RM in the push of a button. The reflectometer collects normal incidence reflectance spectra over a broad spectral range of 210 nm to 2100 nm, with a spot size of 200µm. For more complex or absorbing materials such as doped semiconductors or metals, optical constants can first be determined by the UVISEL RM in spectroscopic ellipsometry mode and then fed into the reflectometer for fast thickness uniformity measurements. By combining reflectometry and ellipsometry measurements, the UVISEL RM extends the range of measurable film thickness and provides a unique tool that fulfils both engineering and production needs.

 

 

HORIBA Instruments Inc.

Edison, NJ

www.horiba.com/us/en/semiconductor/

Tel: 1-732-494-8660

E-mail:  info.sci@horiba.com

 

 

Feature-Rich IC6 Provides he Best Measurement Precision Possible

 

The INFICON IC6 Thin Film Deposition Controller combines the proven performance of INFICON thin film controllers with several enhanced features for maximizing throughput in optical applications. Continuing the tradition of earlier INFICON models, the IC6 provides exceptional quality and performance, along with unique features to easily maximize deposition processes. Optical processes, such as ophthalmic coatings, bandpass filter, reflective coatings, etc., benefit from high resolution and reliability along with the flexibility to accommodate 50 processes of 200 layers each. The IC6 has the ability to control up to six sources simultaneously for rate and thickness control. Twelve analog outputs are assignable for source control or for rate or thickness recording. Additionally, the color TFT LCD display and menu-driven navigation make operating the IC6 easy and intuitive. Logic and process control capabilities include 100 programmable logic statements, 20 counters and 20 timers. I/O capabilities provide up to 24 relay outputs, 28 TTL inputs, and 14 TTL outputs. Logic statements can be used in cooperation with external inputs or outputs; allowing the IC6 to perform functions that otherwise would require a PLC or other extra equipment. Each logic statement can include up to five functions and can be linked using Boolean logic.

 

 

SQM160 Multi-Film Rate/Thickness Monitor

 

The SQM160 uses proven INFICON quartz crystal sensor technology to measure rate and thickness in thin film deposition processes. Two sensor inputs are standard and four additional sensor inputs are optional. Two recorder outputs provide analog rate and thickness signals. Sensor inputs can be assigned to different materials, averaged for accurate deposition control in large systems, or configured for a dual sensor. The rate-sampling mode allows a shuttered sensor to extend sensor life in high rate processes. Rate displays of 0.1Å/s or 0.01Å/s are user selectable. In addition, the display can be selected to show Frequency or Mass. Four relay outputs allow the SQM160 to control source or sensor shutters, signal time and thickness setpoints, and signal crystal failure. Digital inputs allow external signals to start/stop and zero readings.

 

INFICON

East Syracuse, NY

www.inficon.com

Tel: 1-315-434-1100

E-mail:  reachus@inficon.com

 

 

Optical and Crystal Monitoring Systems

 

Intellemetrics Ltd designs and manufactures a range of optical and crystal monitoring and control systems. These systems are integrated onto vacuum coating and plasma etch systems around the world. These monitors are used across a wide range of thin film coating and plasma etching applications to analyse and control the growth or removal of material, measuring in-situ real-time thickness variations during complex fabrication processes. Our products integrate onto our customer’s vacuum systems to give them the precision, accuracy and certainty they need to achieve their processing goals. Intellemetrics integrates advanced Windows® -based modelling and control software with sophisticated optoelectronic hardware that enables one to achieve higher precision and accuracy, higher performance products, higher yield processes, reduced process development times and reduced manufacturing costs.

Intellemetrics also undertakes research and development work aimed at providing customised process monitoring solutions. Intellemetrics brings together a team with many years experience in the design, build, testing and implimentation of optical and crystal process monitoring and instrumentation equipment for the thin film coating and plasma etching industries.

 

Intellemetrics Global Ltd

Renfrewshire, UK

www.intellemetrics.com

Tel: +44 (0) 141 889 0700

E-mail:  enquiries@intellemetrics.com or  411@appliedsi.com in USA

 

 

M-2000® Spectroscopic Ellipsometer

 

The M-2000® line of spectroscopic ellipsometers from J. A. Woollam Co., Inc. is engineered to meet the diverse demands of thin film characterization. An advanced optical design, wide spectral range, and fast data acquisition make it an extremely powerful and versatile tool. The primary application of ellipsometry is to characterize film thickness and optical constants. The M-2000 excels for both. It measures films from sub-nanometer thickness up to tens of microns and the optical properties from transparent to absorbing materials. It is a flexible instrument and can characterize any type of thin film: dielectrics, organics, semiconductors, metals, and more. Wide spectral range and variable angle allow the M-2000 to diagnose many multi-layered structures. The M-2000® delivers both speed and accuracy. Our patented RCE technology combines Rotating Compensator Ellipsometry with high-speed CCD detection to collect the entire spectrum (hundreds of wavelengths) in a fraction of a second with a wide array of configurations. The M-2000 is the first ellipsometer to truly excel at everything from in-situ monitoring and process control to large-area uniformity mapping and general-purpose thin film characterization.

 

 

 

alpha-SE® Spectroscopic Ellipsometer

 

For routine measurements of thin film thickness and refractive index, the J.A. Woollam alpha-SE® is a great solution. Designed for ease-of-use: simply mount a sample, choose the model that matches your film, and press measure. You have results within seconds. Why an alpha-SE? It’s easy-to-use with push button operation and advanced software that takes care of the work for you. Its powerful and proven spectroscopic ellipsometer technology gives you both thickness and index with much higher certainty than other techniques. A flexible spectroscopic ellipsometer, it works with your materials—dielectrics, semiconductors, organics, and more. Now you have the power of spectroscopic ellipsometry at a reasonable price. It’s fast and handles hundreds of wavelengths simultaneously, collected in seconds with immediate results. Applications include qualifying dielectric films with fast measurement speed and push-button operation, the alpha-SE± is ideal for qualifying thin films. Single-layer dielectrics on silicon or glass substrates can be measured in seconds. Log results for easy-touse comparisons in both graphical and tabular formats. It also measures self-assembled monolayer phase information of a spectroscopic ellipsometry measurement is highly sensitive to very thin films (<10nm). Self-assembled monolayers can be assessed and quickly compared using the alpha-SE.

 

J. A. Woollam Co.

Lincoln, NE

www.jawoollam.com

Tel: 1-402-477-7501

E-mail:  sales@jawoollam.com

 

 

Mass Spectrometers

 

Mass spectrometry (MS) is one of the fastest-growing areas in analytical instrumentation. JEOL magnetic sector and timeof-flight mass spectrometers have very high stability, sensitivity, and resolution. These instruments are used in both quantitative and qualitative analysis, including high-resolution accurate mass measurements for the determination of elemental compositions. The use of mass spectrometry in support of synthetic, organic, and pharmaceutical chemistry is well established. However, mass spectrometry is also used in materials science, environmental research, and forensic chemistry. It has also evolved into one of the core methods used in biotechnology. JEOL manufactures a wide range of magnetic sector mass spectrometers ranging from small bench top double-focusing magnetic sector mass spectrometers to larger tandem and hybrid mass spectrometers. JEOL also offers the new cost-effective high-performance AccuTOF™ APITOF LC/MS system for qualitative and quantitative analysis.

 

JEOL USA Inc.

Peabody, MA

www.jeolusa.com

Tel: 1-978-536-5900

E-mail:  salesinfo@jeol.com

 

 

Aleris™ 8330 Film Low-Cost High-Throughpu Production Metrology Tool

 

KLA-Tencor Corporation™ Aleris 8330 is a reliable, production worthy, low cost of ownership metrology solution for measuring thickness, refractive index and stress of non-critical* films at the 32nm node and beyond, complementing the existing Aleris 8350 system, which is designed to measure critical* films. The cost-effective Aleris 8330 and the high sensitivity Aleris 8350 form a comprehensive metrology solution for a broad range of film layers, helping fabs identify process issues and maintain high yield during production. The Aleris 8330 includes several features designed for cost-effective films process control: Patented Broadband Spectroscopic Ellipsometry (PBSE), white light reflectometry (WLR) and optional ultraviolet reflectometry (UVR) optics technologies built on an established platform are designed to produce the precision, stability and matching performance required for production monitoring of films; up to 1.85x throughput increase compared to KLA-Tencor’s previous generation film metrology tool provides low cost-of-ownership film process control; recipe import from the previous generation platforms (ASET-F5x and SpectraFx™ ) and remote recipe management ease tool integration into production; recipe sharing among different Aleris tools facilitates a flexible process control strategy within a fab, covering both high-end and low-end film applications; optional StressMapper provides advanced stress measurement capability, helping chipmakers identify process issues that can lead to cracked or delaminated films or cause overlay errors; and reliable, extendible architecture protects fabs’ capital investments. * Critical films, such as ultra-thin diffusion layers, typically have the smallest dimensions and narrowest process tolerances.

 

 

Alpha-Step IQ Surface Profiler

 

The KLA-Tencor Corporation™ Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Ã… (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor surface profiling processes. The Alpha-Step IQ provides advanced and customizable 2D surface profiling analysis capabilities and enables easy location of measurement features via saved site image with recipe.

It has excellent surface profiling process repeatability and reproducibility and it can precisely determine and analyze thin step heights, surface microroughness, and overall form error on thin film surface coatings. It also provides sufficient vertical range for large topography variations. It includes multiple language support for users with a worldwide presence and enables faster surface profiling analysis routines by applying saved sets of analysis instructions.

 

 

Surfscan® SP3 Defect & Surface Quality Inspection Systems for Substrate Manufacturing and IC Process Monitoring

 

The KLA-Tencor Corporation™ generation in the Surfscan® family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination, the Surfscan SP3 systems feature dramatic advances in sensitivity and throughput over their industry-benchmark predecessor, the Surfscan SP2XP. The Surfscan SP3 platform is also designed for extension to the next-generation wafer size: 450mm. The Surfscan SP3 system is designed to help develop and manufacture substrates for 28nm devices that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids or other defects that disrupt the electrical integrity of the transistor. Because these defects cannot be reliably detected by current-generation inspection systems at production speeds, substrate manufacturers have had difficulty achieving satisfactory yields with these top-grade, next-node wafers. The Surfscan SP3 inspection system has the DUV sensitivity and throughput needed to reliably identify critical defects and surface quality issues inline during substrate manufacturing. In the IC fab, manufacturers must also be able to monitor rough and smooth unpatterned films after deposition and chemical mechanical polish (CMP) to ensure that process tools are not adding defects. The Surfscan SP3 leverages its unique DUV wavelength, special apertures and multiple illumination and collection channels to address stringent 28nm node requirements for defect detection and classification on blanket films at production speeds. The SP3 also offers a module that inspects the backside of wafers for defects that might deform the wafer shape during photolithography.

 

KLA-Tencor

Milpitas, CA

www.kla-tencor.com

Tel: 1-408-875-8733

E-mail:  info@kla-tencor.com

 

 

Exceptional High Performance UV Raman Triple Spectrometer

 

Enhanced ultraviolet response and good light throughput with a robust, open architecture set the Commander™ apart. This McPherson triple spectrometer for Raman works in the 185 to 2200 nanometer region with a selection of diffraction gratings. Operating at f/5 it has impressive light gathering power. It delivers edge rejection within 5cm-1 in the visible spectral region. This instrument is free from chromatic aberrations using mirrors throughout. In addition the aspheric mirrors correct and improve imaging performance for excellent signal levels at the detector, even with weakly emitting samples. The entrance slit width and intermediate aperture in the filter stage allow users to set slope of the edge rejection as well as the wavelength range at the detector. The primary spectrograph is vacuum compatible. The double-monochromator filter stage and sample area may be Nitrogen purged to eliminate water and oxygen absorption. Under ideal circumstances, this combination of environmental control allows work to wavelengths as short as 160nm. The Commander™ is ideal for research, development, and educators. The new system combines performance and delivers value like never before. The new and improved Commander™ features multiple ports for different experiments, UV Raman and Photoluminescence for example. Use simple computer controlled tuning for multiple laser wavelengths; cost effective considering investment in notch filters. The Commander™ is a wonderful example of a high tech power tool for Raman spectroscopy. With superb resolution, stray light suppression, excellent imaging and durability, the McPherson system will give you many years of stable performance.

 

McPherson

Chelmsford, MA

www.McPhersonInc.com

Contact: Erik Schoeffel

Tel: 1-978-256-4512

E-mail:  Erik.Schoeffel@McPhersonInc.com

 

 

Thin Film Deposition Control and Measurement—e-Vap™ Programmable Sweep, Source Control and Rate Control Modules

 

MeiVac Inc. acquired the e-Vap™ product line in 2012. Mei-Vac provides a complete line of thin film components including; controls for e-beam, thermal and sputter vacuum deposition. Our programmable sweep controller provides excellent control of your e-beam process. Simple to use yet extremely powerful you can maximize virtually any process. Prevent tunneling on dielectric materials, broaden the beam profile for smooth evaporation of low melting point metals or build your own pattern for preconditioning your melt from economical pellets or granules. Combine the sweep control with our programmable source control, crucible indexer or rate controller to automate your entire e-beam process. All MeiVac thin film controls work with MeiVac e-Vap™ , Re-Vap™ and MAK sputtering sources as well as most industry standard sources. Check with our experts for your application. Controllers are easy to rack mount and include mounting ears for standard enclosures. MeiVac also offer power supplies, e-beam sources, sputtering sources, resistive sources, substrate heaters, throttle valves plus a complete line of spare parts and accessories.

 

MeiVac Inc.

San Jose, CA

www.meivac.com

Te: 1-408-362-1000

E-mail:  support@meivac.com

 

 

Microvision 2 Residual Gas Analyzer (RGA)

 

MKS Instruments’ Microvision 2 is the latest innovation in RGA technology, designed to meet all of the traditional requirements for an RGA sensor but with data collection at speeds unachievable with previous generation technologies. The Microvision 2 collects data at millisecond speeds per data point even when measuring data over the full dynamic range of the RGA. This capability has been achieved without sacrificing the robustness, reliability and support which have made MKS the world leader in RGA products over the widest range of vacuum coating and deposition applications. The fast speed, high sensitivity and overall robustness of the Microvision 2 make it the ideal tool for a wide range of applications including semiconductor processing, thin film deposition and industrial coating.

 

 

 

HPQ3S High Pressure RGA Process Monitor

 

The HPQ3S RGA from MKS has the ability to operate well above the normal, pressure limits of conventional RGAs. With an operating pressure of 1.0 × 10-2 mbar, the HPQ3S RGA is able to monitor vacuum systems at pressures of up to two decades higher than the typical operational pressures of traditional RGAs. This eliminates the need and associated costs for differential pumping. The field proven technology of the HPQ analyzer, coupled with the latest innovative electronics platform derived from the MKS Microvision 2 family, provides data quality not pre- viously seen in this class of instrument. The resulting system is less complex, with reduced installation requirements, offering a higher level of reliability at a substantially lower cost. The HPQ3 and HPQ3S are suitable for a wide range of vacuum coating and deposition applications including vacuum diagnostics, pump down monitoring and process monitoring, vacuum diagnostics and leak detection.

 

 

 

Vision 2000-C™ and Vision 2000-E™ RGA

 

MKS Instruments’ Process Monitor products are innovative, in-situ process monitoring instruments that are fully integrated, application-specific packages, including component residual gas analyzers (RGAs), analytical equipment and control software. Process mass spectrometers are used in varied applications, including CVD, PVD and other thin film deposition processes. The MKS Spectra™ Products Vision 2000-C™ and Vision 2000-E™ are designed to track levels of various gas species during etch processes and the chamber clean, passivation sequences, and deposition steps for various CVD processes including Titanium nitride (from TDMAT), Tantalum oxide (from tantalum precursor), Copper (from CupraSelect® ), HDP of low-k dielectric films, Atomic Layer Deposition, Atomic Layer Epitaxy and MOCVD. Vision 2000-C™ and Vision 2000-E™ incorporate “smart head” RGA technology from Microvision 2 with a closed ion source and close-coupled inlet. This state-of-the-art RGA technology is integrated with Process Eye™ Professional control platform, a recipe-based, user-configurable software program. The combination of closed ion source and automated inlet allows seamless monitoring of the complete CVD or Etch process cycle, from base vacuum to process pressures of up to 700 Torr.

 

MKS Instruments, Inc.

Andover, MA

www.mksinst.com

Contact: MKS Applications Engineering

Tel: 1-800-227-8766 (USA) or 1-978-645-5500 (worldwide)

E-Mail:  mks@mksinst.com

 

 

Layer Thickness Measurement Package

 

The m·u·t GmbH’s Layer Thickness Measurement Package consists of the TRISTAN® spectrometer, a special reading head and our proprietary software. The system is able to measure transparent layers with a thickness of 0.1 µm to 20 µm under the pre-condition where the base material is transparent or intensely reflective. It is also able to detect up to three different layers on one sample. The reading head can be adapted to special customer needs (e.g. shape, handling, etc.). A special table for desktop measurements of layer thicknesses is available.

 

m·u·t GmbH

Wedel, Germany

www.mut-group.com

Tel.: +49-0-4103-9308-0

E-mail:  info@mut-gmbh.de

 

 

NanoScan – 3D Nanoindenter Advanced Quantitative Characterization & Robust Performance in an Affordable Package

 

The NanoScan 3D Nanoindenter instrument has several measurement modes: imaging in contact dynamic scanning mode (topography/modulus mapping); nanoindentation/nanoscratch; force spectroscopy; instrumented nanoindentation; mapping local conductivity simultaneously with surface topography and elasticity imaging; measuring Current during instrumented indentation and scratchtest; measuring C-V curves at the predefined normal load/indentation penetration of the indentor; and lateral force during scratching and tribological tests. The SPM imaging module has a XY imaging range of 100µm × 100µm or larger. It also has a Z imaging range of 10µm or larger with a displacement nonlinearity of 1% or less.

 

 

 

Nanoscan BEC

San Jose, CA

www.nanoindentation-nanomechanical.com

Tel: + 1 408 624 1222

E-mail:  info@bec-sales.com

 

 

1500 Series Analyzer Accurately Measures Thickness of Diamond-Like Coatings (DLC)

 

n&k Technology, Inc. has a software module that adds the capability to the n&k 1500-D Analyzer of characterizing DLC on perpendicular recording media. The software package enables the 1500-D user to effectively characterize the latest magnetic media that are substantially more complex than older generation media and allow much higher recording densities. The data storage industry is rapidly moving to significantly higher recording densities in response to competition from FLASH memory and an increased penetration of the consumer market with such products as game boxes, DVR, incar navigation, and various music and video players. Combined with the n&k 1500-D Analyzer that is used to characterize the latest giant magnetoresistive (GMR) heads for next generation disk drive metrology.

 

 

Olympian Metrology System

 

The n&k Technology, Inc. Olympian utilizes n&k’s patented optical design that generates optimized reflectance data (optimized signal-to-noise) covering DUV-Vis-IR wavelengths from 190 nm to 15,000 nm to determine the optical properties (n and k), and thicknesses of ultra-thick and thin films, plus depths, CDs and profiles of complex 2-D and 3-D structures. This fully-automated system has a very low COO and can be configured for various size wafers (12”, 8”, 6”) to expand the semiconductor applications of n&k’s UV-Vis-NIR system (the n&k 5000-CD) to include ultra-thick films such as Epi-Si and very thick photoresists and polymers (>1000nm), as well as complex 2-D and 3-D structures with ultra-high aspect ratios. On the software end, a valid physical model combines the Forouhi-Bloomer Dispersion Equation for n and k and Rigorous Coupled Wave Analysis (RCWA) to analyze raw reflectance data. The Forouhi-Bloomer (FB) model describes the Refractive Index, n, and the Extinction Coefficient, k as functions of wavelength l, and was derived based on first principles quantum mechanics.

 

n&k Technology, Inc.

San Jose, CA

www.nandk.com

Tel: 1-408-513-3800

E-mail:  inforequest@nandk.com

 

 

Atlas® II Advanced Metrology System

 

The Nanometrics Atlas II metrology system accommodates both 200- or 300-mm wafer metrology. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The Atlas also features robust pattern recognition, improved thickness reproducibility and superior SR (135 WPH for five-site measurement) and SE (90 WPH for five-site measurement) throughput. The N2000 software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. The NanoNet feature, a network component of Nanometrics’ N2000 Analysis Platform software provides system-to-system matching and seamless recipe transferability. The Nanometrics Atlas system can be configured with any combination of the following metrology modules: spectroscopic reflectometer (SR); spectroscopic ellipsometer (SE); optical critical dimension (OCD); diffraction based overlay (DBO) and wafer stress/bow. n&k Analyzer solutions are distinguished by an excellent signal-to-noise ratio over the entire deep-UV to near-IR (190 to 1,000 nm) wavelength range. This is a result of our patented all-reflective optics design and is essential for many applications. Metrology tools with a limited wavelength range, or increased noise suffer in terms of capabilities and measurement stability.

 

 

 

Lynx™ Metrology System

 

Nanometrics Inc.’s Lynx™ metrology platform is a compact 300mm cluster metrology platform to enable thin film, optical critical dimension (OCD) and overlay measurements in a single system. The Lynx’s versatility provides for a range of custom configurations, from a streamlined single metrology platform to an expanded, high-productivity, multi-metrology platform. Modules can be easily installed or upgraded to extend system capabilities. Productivity of the Lynx system is optimized by Nanometrics’ proprietary cluster control software that allows for sequence and recipe customization in a high-volume production environment. The Lynx’s compact and versatile cluster architecture typically provides a 30% smaller footprint in the fab, a 30% reduction in tool-to-tool wafer transportation and a 50% reduction in installation and facilities costs.

 

 

NanoSpec 9200 Advanced 200mm Film Analysis System

 

The Nanometrics NanoSpec 9200 thin film measurement system provides DUV-visible spectroscopic reflectometry in a high throughput, small footprint platform for the highest level of equipment utilization and the most comprehensive analysis pos- sible of film thickness and material optical constants. The system is capable of handling 150mm and 200mm wafers. This system builds on technologies from the NanoSpec 9000 integrated film thickness system to provide users with a compact tool with high wafer throughput. The NanoSpec 9200 provides IC manufacturers with the fastest, most reliable, compact and cost-effective tool available for volume production, featuring the latest generation spectroscopic reflectometer, flawless pattern recognition, auto-focus, and auto-positioning stage and robotic wafer handling capabilities. This workhorse system is capable of measuring 200 wafers per hour

 

Nanometrics Inc.

Milpitas, CA

www.nanometrics.com

Tel: 1-408-435-9600

E-mail:  sales@nanometrics.com

 

 

Deposition Monitors

 

Nor-Cal Products’ deposition monitors measure film thickness or rate using crystals as the sensor device. Independent channels monitor different films or average different sensors together to provide a more uniform deposition measurement. The CM-2 model will monitor one or two sensor inputs, while the CM-6 will monitor up to six sensor inputs. These monitors are Class 1 Equipment CE approved. Included are a RS-232 cable and Windows software. This software will allow you to change the monitor’s parameters, save process readings in Excel formatted files, and operate the monitor remotely. Mounting brackets are included and rack-mount extenders are available on request. Nor-Cal also provides crystal sensors, feedthroughs, cables, oscillators and replacement crystals to round out the product offering. Our complete product line includes vacuum chambers, isolation and pressure control valves and other components for the thin film deposition market.

 

 

Crystal Sensors

 

Nor-Cal Products offers the thin film coating market crystal sensors and feedthroughs, along with vacuum chambers, isolation and pressure control valves and other components. Sensors are either single, with, or without, water cooling or dual with a pneumatically actuated shutter and water cooling. Single sensors are also available with an integrated 2.75 CF feedthrough flange or separate feedthroughs are available with 1 inch bolt, 1.33 CF or 2.75 CF flanges sizes. Nor-Cal also provides deposition monitors for up to six sensors to round out the product offering.

 

 

 

Nor-Cal Products, Inc.

Yreka, CA

www.n-c.com

Tel: 1-800-824-4166

E-mail:  ncsales@n-c.com

 

 

Coating Thickness Measurement & Materials Analysis with X-Ray Fluorescence (XRF)

 

The Oxford Instruments’ X-Strata is a compact, rugged and reliable quality control XRF benchtop system for simple, rapid, non-destructive coating thickness measurement and materials analysis. It performs excellent coating thickness analysis and characterisation of multi-layer analysis across a wide range of industrial markets, including electronics, metal finishing, alloys and precious metals assay.

The coating thickness measurement analyser X-Strata range offers non-destructive analysis: no sample preparation; field-proven technology and reliability; easy to use, with minimal user training required; analysis in only three simple steps; and precision and accuracy of analysis. Coating thickness measurement with the powerful and easy to use XRF spectrometer guarantees quality and reduces costs.

 

 

 

 

LayerProbe™ Measures Layer Thicknesses Non-Destructively

 

Oxford Instruments NanoAnalysis, a world leader in microanalysis software and systems, has announced the launch of LayerProbe™ , an exciting new software tool for the characterisation of thin layers on a substrate. An option for the Oxford Instruments’ AZtec® EDS microanalysis system, LayerProbe is faster, more cost-effective and higher resolution than dedicated film measurement tools.

LayerProbe analyses the composition and thickness of the surface and sub-surface layers of a specimen by X-ray microanalysis of the surface alone. Unlike traditional SEM-based thin film measurements based on cross-sectioning of the specimen, LayerProbe analysis is non-destructive. Features only 200 nm wide and layers between 2 nm to 2000 nm thick can be characterised in seconds. LayerProbe is an extension of the AZtec® microanalysis system and can be fitted to most SEMs and FIBs. LayerProbe turns the SEM into a high performance thin film and coating analyser. Comparable non-destructive techniques would require considerable additional investment in dedicated equipment. Applications include the measurement of thickness and composition of metallisation and dielectric layers in semi-conductors, characterising the active layers in thin film solar cells, industrial coating analysis and an array of nanoscience research areas, such as graphene.

 

Oxford Instruments NanoAnalysis, USA

Concord, MA

www.oxford-instruments.com

Tel: +1-978-369-9933

 

 

Epsilon 3 and Epsilon 3 XL EDXRF Instruments

 

Epsilon 3 instruments from PANalytical combine the latest excitation and detection technology with state-of-the-art analysis software. They are reliable, deceptively simple, benchtop energy dispersive X-ray fluorescence (EDXRF) spectrometers that offer analytical performance that can match, and in some cases surpass, that of larger, more powerful spectrometers. Selective excitation and careful matching of the X-ray tube output to the capabilities of the detection system underlie system performance. Available in Epsilon 3 and Epsilon 3 XL versions, both instruments feature a high-performance ceramic tube and the latest in silicon drift detector technology. They deliver accurate, precise and extremely reliable analysis across the full range of elements, from fluorine (F) to uranium (U). Advanced spectrum processing and state-of-the-art correction and quantification algorithms ensure accuracy and precision. The result is cost-effective instruments with outstanding analytical performance; truly a viable and capable alternative for many applications. The analytical performance (including light elements), full data traceability and a variety of software options for state-of-the-art standardless analysis, rapid identification fingerprinting or regulatory compliance characterize the range and make Epsilon 3 ideal for routine applications in cement production, mining, mineral beneficiation, petroleum, polymers and related industries. Epsilon 3 can handle solid, pressed and loose powder, liquid and filter samples weighing from a few grams to larger bulk samples. Everything about the sample preparation and measurement process has been designed to be as easy as possible. When compared to other analytical techniques, XRF requires little or no sample preparation. You can also measure large or irregular shaped objects in complete safety as Epsilon 3 has no open source high-energy X-rays.

 

 

2830 ZT Wafer Analyzer Advanced Wavelength Dispersive XRF Analysis

 

The PANalytical 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm. The 4 kW SST-mAX X-ray tube features groundbreaking ZETA technology that eliminates the effects of X-ray tube aging. ‘New tube’ performance is maintained throughout the tube’s lifetime. Together with high sensitivity, ZETA Technology ensures that rapid analysis and short measurement times are maintained across the lifetime of the tube. ZETA technology strongly reduces the need for drift correction and recalibration that increases productivity and uptime of the instrument. Key features for maximizing sensitivity and stability of 2830 ZT for light elements include a 4 kW output SST-mAX, operating at a high current of 160 mA; dedicated high-performance channels for light elements in the range from boron to magnesium; and dry (oil-free) pumps maintaining a clean, sub-Pascal vacuum within the measurement chamber. The 2830 ZT is supplied with PANalytical’s advanced SuperQ software, which includes FP Multi. The intuitive user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.

 

 

PANalytical Inc., a Spectris plc company

Westborough, MA

www.panalytical.com

Tel: 1-508-647-1100

 

 

TMS-100 TopMap Metro.Lab for Large-Area Flatness, Parallelism & Step Height with 20 nm Resolution

 

The Polytec TMS-100 TopMap Metro.Lab is a telecentric inspection system that is ideal for the measurement of surface parameters such as flatness, parallelity or step height. The large vertical scan range of up to 70 mm allows surfaces to be measured that are separated by large steps or are deeply recessed, such as in drill holes. Fast, precise measurement of large areas make these interferometers the optimum tool for quality control, be it spot tests or in-line measurements.

Thickness measurement: The chromatic confocal sensor’s highly innovative measuring principle allows thickness measurements of transparent materials with extremely high accuracy. The large height range of 70 mm allows measurements of flatness, parallelism and step height to be made on larger objects under test with 20 nm resolution. An excellent price/performance ratio makes the Metro.Lab attractive for companies with limited budgets, lower throughput requirements or fewer measurement applications. The instrument is designed for metrology lab precision and can even replace many tactile measurements or sit sideby-side with them while not negatively impacting a budget. As is the case with all TopMap systems, the open software architecture allows routine tasks or customized user interfaces to be easily programmed. It is a non-contact topography-measuring interferometer for measurements on surfaces near steep edges (e.g. drill holes) with its telecentric optics. It can handle large or small objects under test due to large 70 mm z-dynamic range with its fast measurement over large field of view and enhanced 80 mm x 80 mm field of view using simplified stitching (optional). Its new TopSens Optical Sensors allow precise Surface Profile and Layer Thickness measurements. These new sensors allow fast and efficient characterization of surfaces, the determination of micro/nano-topography and optical surface roughness, and the thickness measurement of transparent samples. The measuring heads have no moving parts and are therefore robust and maintenance free. The TopSens sensor systems measure any surface and any material, whether reflective, polished, rough, opaque or transparent.

 

Polytec, Inc.

Irvine, CA

www.polytec.com/us

Tel: 1-949-943-3033

E-mail:  info@polytec.com

 

 

MetaPULSE System or Advanced Packaging Metrology Applications

 

Dynamic growth in advanced packaging arena drives need for critical process characterization technologies. The Rudolph Technologies MetaPULSE G System provides thin film metrology capability that is critical in the development and control of advanced wafer level packaging processes that use metal structures, such as redirect layers (RDL) and under bump metallization (UBM) to route signals from the chip to the package. In addition to providing the fast and accurate measurements of thickness, density and roughness, its small spot size and ability to measure structures directly on product wafers allow users to see pattern dependent variations that are not detectable with monitor wafers. The MetaPULSE G System delivers superior performance on all metal films, and is optimized for thin single and multilayer applications that are critical in advanced logic, memory and 3D packaging processes. Unlike optical and x-ray techniques, PULSE™ Technology can be used in active die without special test pads. Its 10×10 micron spot size assures measurement capability on product wafers in 30×30 micron or smaller test sites.

 

 

 

 

S3000SX Transparent Thin Film Metrology System for 28nm Node and Below

 

The Rudolph Technologies S3000SX System is a modular architecture with small site measurement capability for transparent films in advanced semiconductor fabrication applications at the 28nm node and below. This latest addition to the S3000 product family uses Rudolph’s proprietary focused beam ellipsometry (FBE) and newly-designed small site measurement optics (SSMO) to measure the thickness of single layer and multi-layer films on product wafers including device area at sites sizes as small as 30×30 µm. Additionally, the S3000SX System continues Rudolph’s flexible modular approach with a selection of new metrology capabilities that customers can tailor to their specific process requirements, optimizing the balance of performance and cost of ownership.

 

Rudolph Technologies, Inc.

Flanders, NJ

www.rudolphtech.com

Contact: Virginia Becker

Tel: 1-952-259-1647

E-mail:  virginia.becker@rudolphtech.com

 

 

SGVacuus Optical Monitor

 

Scalar Technologies Ltd, a developer and manufacturer of non-contact, thin film thickness measurement instrumentation and systems, introduced the SGVacuus, the newest addition to the Scalar family of products. SGVacuus is an in situ broadband optical monitoring system that provides precise measurement and control capabilities for single and multilayer vacuum deposited coating applications.

 

 

Scalar Technologies Limited

Livingston, West Lothian, UK

www.scalartechnologies.com

Tel: +44 1506 414 806

E-mail:  enquiries@scalartechnologies.com

 

 

FilmTek 1000M Thin Film Measurement System at an Affordable Price

 

Scientific Computing International’s FilmTek 1000M is a microscope-based film characterization system that offers high accuracy and small spot size at a very affordable price. This system measures the reflection in the wavelength range of 400nm–1000nm, and uses SCI’s superior FilmTek film modeling algorithm to accurately determine thickness, index of refraction (vs. wavelength), extinction coefficient (vs. wavelength), and multi-layers. Typically, films from 20nm to 150µm in thickness can be routinely measured by FilmTek 1000M. The X-Y stage can handle substrates up to 200mm in diameter. The spot size can be controlled via the use of four available objective lenses, and can be made to be as small as 7um. An upgrade option can provide for transmission measurements as well.

 

 

 

FilmTek 2000SE Spectroscopic Ellipsometry with 0.03 Å Repeatability on Native Oxide

 

Scientific Computing International’s FilmTek 2000SE is an affordable optical film metrology system that combines spectroscopic ellipsometry with normal angle spectroscopic reflectometry to make it ideally suited for full characterization of very thin to thick films. Thickness, index of refraction (vs wavelength), extinction coefficient (vs. wavelength), energy band gap, roughness, crystalinity, constituents and void fraction, film gradient, and multi-layers can be measured. Basically, any unknown film from 1 angstrom to tens of microns in thickness can be measured by FilmTek 2000SE as long as light can travel through the film. Using a rotating compensator design, and benefiting from Multi-Angle Differential Polarimetry (MADP) technology, FilmTek 2000SE can measures film thickness and index of refraction independently from each other.

 

 

Scientific Computing International

Carlsbad, CA

www.sci-soft.com

Contact: Kambiz Farnaam, Ph.D., V.P. of Marketing

Tel: 1-510-301-6128

E-mail:  kambiz@sci-soft.com

 

 

Next Generation FTIR Spectrophotometer

 

Combining high speed, sensitivity and resolution with enhanced expandability and easy-to-use software, Shimadzu’s IRTracer-100 FTIR quickly and easily obtains high-quality data for samples in such fields as foods, chemicals and electronics. The IRTracer-100 offers best-in-class 60,000:1 S/N ratio, which allows researchers to quickly and easily obtain high-quality data of ultra-small contaminants. Resolution of 0.25 cm-1 provides for highly accurate quantitation and identification. In addition, a rapid scan function allows rapid sample acquisitions of 20 spectra per second. This enables analysis of reactions occurring within a few seconds, and kinetic studies occurring in less than one second. The IRTracer-100 features a stable, airtight interferometer that incorporates a built-in automatic dehumidifier, protecting the unit against moisture and other environmental influences. In addition, the patented Advanced Dynamic Alignment system, sampling at over 5,000 times per second, works in combination with a smooth-moving mirror to ensure optimum performance, enhanced stability and shorter warm-up times. The IRTracer-100 can be customized with a variety of software and hardware options to meet specific application requirements. These include contaminant analysis and identification test programs, time-course analysis and 3-D mapping software, an infrared microscope, and a variety of ATR accessories.

 

Shimadzu Scientific Instruments

Columbia, MD

www.ssi.shimadzu.com

Tel: 1-800-477-1227

E-mail:  webmaster@shimadzu.com

 

 

XRF Thick-800 XRF Analyzer

 

X-ray Fluorescence (XRF) is one method of obtaining accurate coating thickness measurements. XRF analyzers provide a versatile, non-contact method to obtain measurements of thin films, single layer and multi-layer coatings on large to small components with high precision (common coatings include gold, silver, copper, nickel, tin and zinc). XRF testing equipment offers accuracy over a wide elemental range and provides simple-to-use record and report tracking to meet quality control requirements.

The Skyray Instrument Inc. Thick-800 is a non-destructive testing solution for organizations that need accurate quality control of printed circuit boards and electronics. Testing capabilities include multi-layer thickness measurements and RoHS testing of solder joint. The Thick-800 is specifically developed for coating thickness measurements. Skyray XRF is the North American sales agent of Skyray Instrument.

 

Skyray Instrument Inc.

Braintree, MA

www.skyrayxrf.com

Tel: 1-716-438-8542

E-mail:  sales@skyrayxrf.com

 

 

AccuTemp™ In-Situ 4000 Process Monitor

 

SVT Associates’ AccuTemp In-Situ 4000 Process Monitor is used for closed-loop monitoring and control of multilayer MBE, MOCVD, and CIGS thin film growth applications for source monitoring. The AccuTemp system provides real-time accurate information on the substrate temperature, film thickness, and growth rate using a single normal incidence view-port. Temperature is measured using a two color infrared pyrometer insensitive to window coating and alignment errors. The radiometer compensates for changing emissivity and corrects the pyrometry measurements. An optional Bandgap Module allows for monitoring of low substrate temperatures, and calibration of the pyrometer. Two independent optical reflectometer signals are analyzed to provide thickness, growth rate, and refractive index. Typical application materials for the AccuTemp include GaN, GaAs, ZnO, CIGS, Si, ZnTe, SiC, MCT, and STO, etc. The AccuTemp is used to collect temperature and growth rate data for reproducibility in R&D and production environments. The Bandgap Module allows for temperature monitoring at temperatures below the range of a pyrometer.

 

 

 

SVT Associates Inc.

Eden Prairie, MN

www.svta.com

Contact: Leslie Price, Marketing

Tel: 1-952-934-2100

E-mail:  sales@svta.com

 

 

STM-100/MF Thin Film Deposition Thickness Monitor

 

The Model STM-100/MF Thickness/Rate Monitor from Sycon Instruments, Inc. is a precision mass and film thickness measurement instrument for thin film deposition processes and other quartz crystal microbalance applications. The STM-100/ MF has proven very tough and reliable. Easy to setup and use, the STM-100/MF has a history that makes it the one to have for deposition monitoring. Features include Multi-Film Program Storage and with a high resolution and high-speed measurement engine. It has 1 Å thickness resolution with 0.1 Å/s rate resolution. It can make 4 measurements per second and has a multiple function high readability back-lit LCD. Analog output of rate or thickness is ±0 to 10V with 12-bit resolution. It has a low maintenance sensor design and an industry standard 6 MHz sensing crystal. The unit has a RS-232 Interface and a LabVIEW™ front panel interface. In Multi Mode Operation includes Thickness/Rate Monitor, Negative Thickness Monitor and Sensor Frequency Monitor. Its high speed makes four measurements per second. Resolution is 0.1Å per second. High Accuracy is ±0.5% thickness ±1 count and the measurement range is 500 kÅ aluminum equivalent. Relay Outputs are four 1.5 amp SPST N.O. contacts with Shutter Control, Thickness Set point, Timer Set point and Crystal Failure. Remote inputs include four TTL compatible inputs with Open Shutter, Close Shutter, Zero Thickness and Zero Time functions. Setpoints monitor End Thickness of 0.000 to 9999 kÅ and setpoint thickness of 0.000 to 9999 kÅ.

 

Sycon Instruments Inc.

East Syracuse, NY

www.sycon.com

Tel: 1-315-463-5297

E-mail:  info@sycon.com

 

 

In-Situ Spectroscopic Optical Monitoring/Control and DES System

 

The Telemark NVision optical monitoring system is designed for applications in the Optical Coating, Web Coating and Large Area Flat substrate markets. It provides full spectrum, real-time analysis and control of reflectance and transmittance during thin-film deposition in dedicated systems for large area flat-web coating and optical coating. Regardless of the process application, the NVision Optical Monitor will allow monitoring of coatings and/or plasma to reduce cost while increasing the performance of the coating process. Customer specific statistical analysis of a run, a group of runs or even years of data is possible from data stored in the system’s data base.

 

 

 

 

 

 

In-Situ Spectroscopic Optical Monitor/Control and OES System for Large Areas

 

Optical monitoring in large area deposition systems requires a new innovative method to reduce cost and yet increase measurement performance. The Telemark NVision Optical Monitor represents that breakthrough in distributed monitoring techniques that both reduces cost and improves performance. This instrument is built upon an open SQL data base containing all the run and setup data allowing the user to easily configure the system, run it and access the run data either from the operating computer or from any computer on the network in real time. This provides full spectrum, real-time analysis and control of reflectance and transmittance during thin-film deposition in dedicated systems for large areas. The NVision optical monitoring system is designed for optical coating, web coating and large area flat substrate markets. Regardless of the process application, the NVision Optical Monitor will allow monitoring of coatings and/or plasma to reduce cost while increasing the performance of the coating process. Customer specific statistical analysis of a run, a group of runs or even years of data is possible from data stored in the system’s data base.

 

 

 

Model 880 Deposition Controller

 

Telemark’s Model 880 Controller is based on a multi-microprocessor design, which provides the best combination of resolution (high) and update speed (fast) on the market. The unit has four slots for I/O cards that can house either an input card (8 optically isolated inputs) or an output card (8 form-C SPDT relays). The sensor-head/source-control modules provide two channels each for crystal frequency measurement and two separate, isolated, analog 0 to 10 volt (plus and minus) outputs for source control. The 880 can house four such modules, supporting up to eight channels of sensor input and 8 analog outputs, and enabling averaging and co-deposition functions. Advanced measurement technique provides high accuracy at constant 100 ms measurement period. RS232/485 interface standard, industrial fields busses optional. Flash memory removable module option for transferring process recipes, and for back-up in case of failure. Thickness display is 0.000 to 999.9 kÅ and the rate display is 0.0 to 999 Å/s. Source outputs are ±2.5, 5 or 10 volts @ 10 mA with 4 user definable function keys.

 

Telemark

Battle Ground, WA

www.telemark.com

Tel: 1- 360-723-5360

E-mail:  sales@telemark.com

 

 

High Speed Compact Ellipsometer

 

The ULVAC UNECS-2000/UNECS-3000 Spectroscopic Ellipsometers measure thin film thickness and optical constants faster and more efficiently than conventional mechanically controlled rotating optical devices. The compact UNECS design with built-in light source and controller is simple and inexpensive to operate and maintain. The emitter and sensor heads are small with built-in light source and controller. UNECS comes with the computer control and analysis software. Using parallel measurement, the thickness of up to six individual film layers are measured simultaneously. Measurements at 20 ms/point permit fast inspection of samples. The UNECS-2000 motor stage can handle samples up to 200 mm in diameter. The UNECS-3000 features an automatic mapping function to measure thickness distribution across a 300 mm substrate.

 

 

ULVAC Technologies

Methuen, MA

www.ulvac.com

Tel: 1-978-686-7550

E-mail:  sales@ulvac.com

 

 

MS-60 Portable Dual Sector Mass Spectrometer Helium Leak Detector

 

The MS-60 series quickly and accurately detects leaks for a broad range of applications and is the most advanced portable helium leak detector in the industry, offering highest sensitivity and fastest test-time. The MS series utilizes VIC’s own stateof-the-art dual magnetic sector helium mass spectrometer for error-free operation in a complete range of industrial, dry, and clean room models. The Touch-Screen GUI allows for greater system control and monitoring during system startup and operation. Displays include system status, accept/reject status, system health, setup, calibration and other diagnostic functions. The standard 7 cfm direct drive foreline/ roughing pump permits faster cycle times with an optional 10.6 cfm available. Internal or external calibration is included for flexibility. It has Digital Input/Digital Output, is fully automatic with a dual magnetic sector high-resolution mass spectrometer with three modes of operation.

 

Vacuum Instrument Corporation

Ronkonkoma, NY

www.vicleakdetection.com

Tel: 1-631-737-0900

E-mail:  sales@VicLeakDetection.com

 

 

SD1024G Series of Spectrometers

 

The Verity Instruments’ SD1024G Series spectrometers are optical spectrum emission monitors that integrate sophisticated embedded processors and software for plasma process monitoring. The SD1024G Series uses common electronics, application software and enclosures. The differences between the SD1024G, the SD1024GH, the SD1024GL, and the SD2048GL are the charge coupled device (CCD), optical platform and embedded software parameters. The SD1024G was designed for demanding semiconductor process applications. The advantages of the SD1024G include excellent ultraviolet (UV) response (down to 200nm), stability against degradation under UV exposure, high sensitivity, wide dynamic range and superior output linearity. The unique optical platform results in highly efficient imaging of spectral information at the image plane of the two-dimensional detector array. The SD1024GH incorporates special high throughput optics and lower systematic noise as compared to the SD1024G. The optics used in the SD1024GH increase optical throughput by about 75%. Accordingly, the SD1024GH is recommended for applications that require maximum signal to noise, especially when measuring relatively low intensity signals. The SD1024GL uses a general purpose CCD and was designed for general purpose semiconductor process applications. The SD2048GL is nearly identical to the SD1024GL, but has better resolution and lower sensitivity.

 

 

Verity Instruments, Inc.

Carrollton, TX

www.verityinst.com

Tel: 1-972-446-9990

E-mail:  generalinfo@verityinst.com