Deposition/Coating Systems for End Product Substrates

Product Descriptions

in size and consist of quartz and easily replaceable graphite components, with a watercooled stainless steel housing. All AIXTRON systems are fitted with horizontal laminar flow reactors. The laminar flow principle guarantees extremely precise heterojunctions and unequalled control of deposition rates at the monolayer level. The combination of this principle with AIXTRON's unique multiple substrate carrier rotation, known as Gas Foil Rotation (GFR), ensures excellent deposition homogeneity regarding layer width, composition and doping. In addition, the special reactor inlet valve, which allows the separation of certain gases, ensures a uniform outward radial flow and optimum distribution adjustment. The reactors are heated via infrared (850°C) or inductively (1200°C to 1700°C in the case of silicon carbide) and can be equipped with a wide range of in-situ sensors, including the EpiRAS exclusive to AIXTRON reactors. AIXTRON’s current MOCVD product portfolio, including the CRIUS® II-XL (Close Coupled Showerhead® ) and the AIX G5 HT (Planetary Reactor® ) systems, are well suited for today’s and anticipated future market needs.

 

AIXTRON SE

Herzogenrath, Germany

www.aixtron.com

Contact: Dr. Bastian Marheineke, Vice President Sales

Tel: +49-241-8909-143

E-Mail:  marcom@aixtron.com

 

 

ATC Orion 8-U DEEP UHV Sputter Tool – Up To 13 Sources

 

AJA International, Inc. has developed, manufactured and delivered the new ATC Orion 8-U. This system can accommodate up to (10) con-focal 1.5” magnetron sputter sources and can deliver exceptional uniformity over 3” wafers. The ATC Orion Series Deposition Systems are very affordable and are built to the highest standards. This particular version is guaranteed to reach a 10-10 Torr base vacuum, is fully metal sealed and includes full system bake-out and turbo-pumped load-lock. 1000°C, SiC substrate heating or water/LN2 cooling are available. The large central port is available for either (3) 1” sources, (1) 2” or 3” source, a thermal source or an ion source.

 

 

 

 

ATC-D Dual Chamber UHV Thin Film Deposition Systems

 

AJA International, Inc. has delivered numerous dual-chamber sputtering tools with load locks and cassettes for substrates up to 200 mm diameter. System chambers can be fitted with heated or cooled substrate holders, UHV magnetrons with insitu tilt, thermal sources, e-beam sources and ion beam sources. The dual chamber configuration is ideal for incompatible processes and can be easily adapted to photovoltaic R&D with 156 mm2 substrates.

 

 

 

 

 

Nb Superconductor R&D Systems with Short Working Distances

 

AJA International, Inc. has delivered a number of ATC and ATC Orion Series Sputtering tools optimized to allow high rate, short working distance, niobium superconductor deposition “within the plasma”. The traditionally heated, rotating, biasable substrate stages can be lowered to within a few centimeters of a large, centrally located, UHV, magnetron sputter source. A number of other, radially positioned, con-focal sources are added to facilitate the deposition of other materials at very high uniformity and very precise thickness control. The system pictured also includes a programmable “wedge” film shutter for combinatorial chemistry applications.

 

 

 

AJA International, Inc.

N. Scituate, MA

www.ajaint.com

Tel: 1-781-545-7365

E-Mail:  topgun@ajaint.com

 

 

Hummer 8 Series Planar Magnetron Sputter Systems for Thin-Film Deposition

 

The AnatechUSA Tabletop thin-film deposition systems (Hummer 6.6 with tilt/rotate stage and thickness monitor shown here) are sized for Scanning Electron Microscopy sample preparation, research and development, failure analysis and quality assurance applications may be configured for sample preparation for gold coating, CV dot matrix aluminum deposition, silicon dioxide deposition; DC sputter of metals and RF sputter of insulators and metals up to 8-inch diameter substrates.

 

 

 

 

Roll-To-Roll Plasma Systems

 

The ever expanding need for system flexibility in both the R&D and manufacturing sector has resulted in the development of a AnatechUSA 24-inch aluminum box system capable of running in both fixed shelf mode as well as offering a convenient and easily convertible roll-to-roll design. This design allows for the use of single or multiple (variable spaced) shelf sets or the roll-to-roll drive system. The system comes with multiple mass flow controllers, on/off variable speed drive and an advanced RF supply capable of operating in both steady state and pulse modes.

 

AnatechUSA

Union City, CA

www.anatechusa.com

Tel: 1-510-401-5990

E-Mail:  info@anatechusa.com or  tawatts@anatechusa.com

 

 

Covap II Series Deposition Tool

 

The Angstrom Engineering Inc. Covap II series offers a compact, economical solution suitable for many process applications. Its small size will ensure you will find space in your lab and in your budget. Built to our high quality standards, the Covap II is available with closed loop co-deposition control, recipe storage and a unique clamshell chamber for improved accessibility. If your process requires controlled atmosphere integration, the Covap II is design ready to be built into a new or existing glove box.

 

 

 

 

 

Nexdep Series Deposition Too

 

The Angstrom Engineering Inc. Nexdep system can be built to your needs with custom flexibility, in a compact footprint and at an economical price. Whether your process requires resistive evaporation, sputter deposition or electron beam evaporation, the Nexdep is highly capable. With its large, hinged front door, working with and cleaning the machine couldn’t be easier.

 

 

 

 

 

Åmod Series Deposition Too

 

The Angstrom Engineering Inc. Åmod line of thin film deposition tools was designed to meet the advanced process requirements of today’s thin film research. Our flagship line is fully customizable and can even be combined as part of a multi-system configuration. Our in-house developed control software smoothly integrates the various system components, keeping the right information at your fingertips.

 

 

 

 

 

Angstrom Engineering Inc.

Kitchener, ON, Canada

www.angstromengineering.com

Tel: 1-519-894-4441

E-Mail:  acampbell@angstromengineering.com or  sales@angstromengineering.com

 

 

Endura ALPS Co PVD System

 

As geometries continue to shrink, silicidation of the gate, source and drain regions becomes more challenging due to the density and higher aspect ratios of transistor gate stacks. Excellent step coverage and thin film uniformity must be achieved on smaller, higher aspect-ratio features. In addition, the silicide material must provide low resistivity and gate leakage. The Applied Materials Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance silicide solution for gate and contact applications in high aspect ratio structures. Using the proprietary ALPS technology, Endura ALPS Co provides superior bottom coverage with no plasma damage to the device and best-of-breed defect performance to extend cobalt to • 90 nm technology nodes. Endura ALPS Co addresses the challenges of Ti agglomeration, contact resistance change, and dopant suction by providing excellent performance for resistivity, leakage current, and thermal stability.

 

 

Aristo Flat Panel Display Deposition

 

Applied Materials provides thin-film deposition solutions for a broad range of applications in the electronics as well as in the functional glass and in the food and beverages industries. A leading supplier of in-line thin-film deposition systems for the Flat Panel Display (FPD) manufacturing industry, Applied builds on over 20 years of experience in this market segment. The Aristo thin-film technologies are focused on flexibility, reliability and high performance in applying conductive, optical and barrier coatings with excellent film properties for liquid crystal displays and other FPD applications. Because most of the applications of FPD involve high speed production processes, the proven in-line sputtering system design enables our customers to gain improved economies of scale in production and thus reduce production costs. In addition, we continuously enhance the entire range of deposition processes in use by our customers through constant research and development.

 

 

TOPMET Vacuum Web Deposition System for Modern Packaging Needs

 

Applied Materials’TOPMET roll-to-roll coating system provides the latest production solutions for the packaging industry. Utilizing a thermal evaporation process, thin layers of aluminum are metallized onto flexible substrates, like plastic or pre-coated paper, for production of protective packaging or decorative materials. TOPMET offers state-of-the-art engineering, equipped with advanced high rate evaporation sources, closed-loop automatic layer control, self-diagnostic out of range monitoring, and high performance pumping systems. As the industry leader for innovative production solutions, this system is available in various coating widths ranging from 650 mm to the world’s largest system at 4,500 mm in width, with an astonishing speed of up to 17 meters per second. Efficient use of raw materials and power, fully automated process control and ease of operation ensure lowest overall operation costs. The award winning in-line layer thickness monitoring systems offers consistent coating uniformity along with the in-line plasma pre-treatment to improve bonding strengths and gas permeability.

 

 

Applied Materials

Santa Clara, CA

www.appliedmaterials.com

Tel: 1-408-727-5555

E-Mail:  web_sales@amat.com

 

 

BENCHMARK 800-III® ICP Deposition and Etch System

 

AXIC, Inc.’s BENCHMARK 800-III® Inductively Coupled Plasma (ICP) Processing System is an affordable high-performance low temperature PECVD and DRIE plasma processing system. The BenchMark 800-III defines low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (PECVD) plasma processing and Deep Reactive Ion Etch (DRIE). The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch and deposition bottom electrodes available for easy installation into the chamber unit. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing of the BENCHMARK 800-III® unsurpassed by any other plasma product in the market. In the research and development of plasma processing, there has always been a great need for a highly versatile and reliable tool. With the ever-changing requirements in plasma research, the system selected must offer the widest range of process parameters and a high degree of repeatability for process verification. It also must be easily modified for new process requirements.

 

Axic, Inc.

Santa Clara, CA

www.axic.com

Tel: 1-408-980-0240

E-Mail:  info@axic.com

 

 

Precision Edge Welded Bellows for Vapor Deposition Applications

 

BellowsTech, LLC edge welded metal bellows are a reliable mechanical seal for Ultra High Vacuum (UHV) chambers. Edge welded bellows are constructed by stamping metal diaphragms with the inside and outside diameters held to tight tolerances. The inside diameters of two diaphragms are welded together. The process is continued for as many diaphragms as required by the application. Then, the welded assemblies are stacked for outside diameter welding. End pieces are added as required by the customer to create the final metal bellows assembly. Bellows mechanical seals, lifter assemblies, and feedthroughs add motion, sealing and protection to vapor deposition. Metal bellows for vapor deposition applications are typically manufactured from stainless steel or AM350. These metals can withstand ultra-high vacuums and low leak rates. Certain cleaning processes can be added to the bellows assembly before shipment to ensure that the process does not become contaminated.

 

 

BellowsTech, LLC

Ormond Beach, FL

www.bellowstech.com

Contact: James Barkand, Business Development Manager

Tel: 1-386-615-7530

E-Mail:  bellows@bellowstech.com or  jbarkand@bellowstech.com

 

 

DMC Multi-Layer Thin Film Coater

 

Darly’s pre-engineered coating systems have the design-flexibility necessary to maximize production rates of coating process. A wide range of accessory options and custom designs provide a cost-effective coater for applications to improve the process and results. Ten standard sizes give the most cost-effective system options. All systems all feature large capacity chambers constructed of 304 stainless steel mounted on very compact vacuum systems. Darly will help you select the appropriate chamber and accessories for your application to progressively enhance your process. Chambers are guaranteed to pump down to 5 × 10-5 Torr in less than 10 minutes, with an ultimate vacuum of less than 10-6 Torr. The result is a clean vacuum system that won’t contaminate your substrates. Each pumping system is specifically designed for the chamber size and is automatically controlled. All coaters facilitate access to various parts for quick, easy loading, low maintenance and easy installation. The systems can be free-standing or through-wall, depending upon your space, noise and clean room requirements. Most thin-film deposition requirements can be met from Darly’s standard range of systems and accessories. Standard applications vary widely from microelectronics, optics, and photonics applications. However, if you have specific processing needs requiring a unique custom design, our engineers will develop a special unit to accommodate your specialized requirements. Microprocessor based control instrumentation provides consistent quality in high-volume production diffusion, turbomolecular, or cryopumps.

 

Darly Custom Technology, Inc.

Windsor, CT

www.darlytech.com

Tel: 1-860-243-5518

E-Mail:  sales@darlytech.com

 

 

Altor™ Series Sputter Deposition Platform

 

Denton Vacuum’s new Altor™ series sputter deposition platform addresses the needs of medical implant manufacturers who face unique coating challenges and operate in government-regulated manufacturing environments. Equipped with a variety of magnetron cathode designs and supporting both standard and reactive sputtering, the Altor platform can coat a wide range of complex 3D components including stents, cardiac leads and orthopedic implants. Altor also utilizes Denton Vacuum’s ProcessPro® production operations software, which has now been configured to support users operating in FDA registered facilities. Equally important, Altor includes ergonomic and safety features that enable high volume manufacturing in factories that employ a diverse mix of manufacturing and assembly processes. Barriers become breakthroughs with Denton Vacuum’s new Altor series sputter deposition platform.

 

Denton Vacuum LLC

Moorestown, NJ

www.dentonvacuum.com

Contact: Vince McGinty, Vice-President, Sales & Marketing

Tel: 1-856-439-9100 or 1-856-380-5234

E-Mail:  info@dentonvacuum.com or  vmcginty@dentonvacuum.com

 

 

Sputter Deposition Systems

 

Dynavac builds sputter deposition systems for a wide variety of applications. We're able to deposit metal films such as aluminum, silver, molybdenum, and chromium on glass, metal, plastic, or foils. Additionally, we sputter a wide range of semiconductor materials and dielectrics including transparent conductive oxides. Dynavac optimizes the type of sputter source and power supply for the process requirements, to ensure that sputtered films are smooth, dense, and adherent. We also design systems to sputter up, down, or sideways to simplify the handling of parts to be coated. Systems are available to accommodate small-parts and small-quantity applications, using batch systems. Dynavac uses inline systems to deposit on large sheets of glass for production of solar cells, display panels, and other applications. We use glass heating to 300-500 °C, coupled with continuous or intermittent motion, to obtain desired film properties. Our process can achieve production rates to one sheet per minute while depositing three or more layers. Web-coating systems for sputtering on plastic films and large, batch-style systems for high-volume production are also available.

 

 

CVD Thermally-Activated or Plasma-Driven Process Systems

 

Dynavac builds systems for chemical vapor deposition (CVD) using either thermally activated or plasma-driven processes. Plasma processes can be excited by DC, RF, or mid-frequency AC power supplies. These systems allow us to produce extremely hard, smooth films of diamond-like carbon (DLC) or carbides for coatings on optical windows, wires and fibers, metal parts, and a wide variety of other items. We also use plasma processes for the etching and milling of electronic components, and for surface treatment of plastics to enhance bonding.

 

Dynavac

Hingham, MA

www.dynavac.com

Tel: 1-781-740-8600

Email:  sales@dynavac.com

 

 

Electron Beam Emitter Assemblies and Replacement Parts for Temescal and Telemark Electron Beam Guns

 

Fil-Tech, Inc. supplies complete electron beam emitter assemblies and replacement parts for Temescal and Telemark electron beam guns. Fil-Tech supplies individual emitter parts including filaments, insulators, beam formers, anodes, electromagnetic coils, and OFHC copper crucibles and covers from stock. In addition, Fil-Tech supplies graphite, molybdenum and titanium crucible liners. Fil-Tech also supplies replacement parts for Veeco Commonwealth and Veeco Ion Tech, and Satisloh Ion Sources. Fil-Tech supplies tungsten filaments, insulators, gas distributors in graphite, stainless steel and titanium, anodes, and cathode tips. Fil-Tech also supplies all Mark I and II ion source replacement parts. Fil-Tech also supplies Quality Crystals® in 6MHz and 5MHz styles with Gold, Longer Life Gold® , Stress Relieving Alloy® , and introducing Advanced Ad-hesion Alloy™ coatings. Choose the electrode material that best fits your deposition process. Gold offers low contact resistance and high chemical stability. Longer Life Gold offers low contact resistance and stress relieving qualities of alloy. Stress Relieving Alloy dissipates the stress from deposited dielectric materials to offer longer and steadier, jump free oscillation. Advanced Adhesion Alloy promotes greater film adhesion of deposited material on the crystal surface and works with alloy to dissipate stresses from dielectric materials. Contact Fil-Tech at 800-743-1743 or visit us at www.filtech.com for Delivery from Stock.

 

 

Fil-Tech, Inc.

Boston, MA

www.filtech.com

Contact: G. Paul Becker

Tel: 1-617-227-1133 or toll free 1-800-743-1743

E-Mail:  paul@filtech.com

 

 

AOCS Advanced Optical Coating System

 

4Wave’s Biased Target Deposition Advanced Optical Coating System incorporates over 20 years of Ion Beam and Biased Target Sputtering experience, producing dense, smooth, stable, low absorption and particle free films. The system can sputter on substrates up to 300mm Ø, with less than 0.5% optical uniformity at deposition rates comparable to magnetron deposition rates. The load locked stage enhances these superior film properties while the run-to-run repeatability is further enhanced when using an Optical End Point Detection system. The system can also be used to deposit a wide array of metallic and nitride films. The system is designed for 24/7 production operation, but can also be configured with smaller targets - enabling the user to undertake R&D while attaining the same quality films.

 

 

 

Single Wafer Load Lock Etching Systems

 

4Wave’s Single Wafer Load Lock Etching Systems addresses the needs of customers seeking a flexible, cost-effective, smallfootprint, ion-etching/ ionpro-cessing workhorse for general-purpose research and production applications. 4Wave’s single wafer load lock etching system can be configured with a variety of stages, fixtures and ions sources to best meet you application's need.

 

 

 

 

 

 

Cluster Module Deposition Systems

 

4Wave’s deposition systems address the needs of users in depositing dielectric, metallic, magnetic, superconducting and semiconducting thin films, in production environments. Users can deposit multi-layers on substrates up to 200mm diameter, using either biased target deposition or ion beam sputter deposition technologies. Several options are available including low energy ion assist, high energy ion etching, heated substrate stage and magnetically biased substrate stages. Typical applications include spin valves/AMR/GMR/ TMR, magnetic tunnel junctions, dielectric interference coatings, rugate filters, high-K materials, shaped memory alloys, optoelectronic materials, vanadium oxide and uncooled IR detectors. Available system features include closed-loop control of film properties, substrate plasma precleaning, oxidation, nitridation, water cooling, tilting, rotating, shuttering and robotic loading via load lock with up to 25 wafers.

 

4Wave

Sterling, VA

www.4waveinc.com

Contact: Trey Middleton,VP Business Development

E-Mail:  sales@4waveinc.com

Tel: 1-703-787-9283 Ext. 100

 

 

Speedflo Integrated Reactive Sputtering Solutions

 

For customers who do not require a complete turnkey facility, but would like a package of critical pre-configured components for their process needs, Gencoa has options. By combining the Speedflo reactive gas controller with Gencoa dual magnetrons, a customer has the components needed for success—just add the chamber, pumping and power. The integrated packages include sputtering hardware, process monitoring, process control software, reactive gas distribution and training. The package is preconfigured for the specific process needs to create the uniformity, process speed and performance you require. Typical applications include web coating of dielectric stacks, precision optics/ opthalmics, hard/low friction coatings, architectural glass and flat panel displays. Any material combination can be used with single or multi-channel gas control. Process monitoring can be via plasma emission or target voltage and the gas system is designed for fast feedback and uniformity adjustment. The magnetic design in the sputter cathodes is tuned to create the optimum plasma conditions for the process environment as a critical feature of the package.

 

 

Multi-functional Linear Ion Source

 

Gencoa’s flexible ion source satisfies the needs for both highenergy and low-energy cleaning of substrates. For aggressive cleaning, the source can be operated at 3kV to produce a highenergy bombardment of glass and metal substrates. For temperature sensitive and web type substrates, the discharge voltage can be reduced to less than 500 volts to prevent damage. The sources come with a wide range of mounting options and have low cost, long-life and quick-change anode/ cathode parts. The anode material can be interchanged between metals and graphite. The use of a thick graphite anode allows high current densities to be used as result of the low sputter yield of carbon. Metal and alloy anodes can be used to provide sub-plantation (high-energy mode) or seed layers (low energy mode) on the cleaned surface.

 

 

Gencoa Ltd.

Liverpool, United Kingdom

www.gencoa.com

Tel: +44-0151-486-4466

E-Mail:  sales@gencoa.com

 

 

Auto306 Thin Film Deposition System

 

Auto306 is probably one of the world’s favorite 12” coaters. Comprehensive and versatile, these systems are now offered and supported worldwide by HHV Ltd under exclusive license from Edwards, the original manufacturer. We offer the Auto306 for electron microscopy sample preparation and R&D applications with a range of chambers and process accessories including 3kW electron beam with deposition control options. Has your Auto306’s original vacuum controller failed? We can provide the answer in the form of our PLC upgrade kit which brings the Auto306 control circuit up to ‘as new’ specification complete with new Active vacuum gauges which should keep your Auto306 running for another lifetime. See also our new accessories and spares.

 

 

 

CT100 PECVD System.

 

HHV Ltd introduces the CT100 PECVD cluster tool for research. The CT100 is used for the deposition of amorphous and microcrystalline silicon-based, doped and undoped materials plus dielectrics, metal nitrides, metal oxides, pure metals and compounds. Substrates can be accommodated in the PECVD process chamber, dry etch chamber and the sputtering chambers. Individual process chambers are connected to the central transfer and isolation chamber and entry/exit lock by magnetically-coupled transfer arms. Robotic transfer can be specified. The CT100 offers a choice of plasma power supplies, plus sample heating to 1000C and options for residual gas analysers.

 

 

 

 

TF500, TF600 and TF800 Thin Film Deposition Systems

 

The HHV TF-family of deposition systems are designed for 500mm/19” to 800mm/30” chamber applications. The flexible chamber arrangements allow researchers and production users to specify a range of resistance, RF and/or DC sputter sources and 3kW or 6kW electron beam sources. Sputter systems can be configured for sputter up or sputter down.A range of work holders covers rotation through heating, biasing and options for z-shifting for use with HHV’s load lock and transfer systems. Systems can be specified with PLC vacuum control and manual process accessories through deposition rate controllers to full computer process control according to wishes and budgets.

 

HHV Ltd

Crawley, West Sussex, United Kingdom

www.hhvltd.com

Tel: +44 (0) 1293 611898

E-Mail:  info@hhvltd.com

 

 

New R&D Roll To Roll (R2R) Coater

 

Introducing the Intellivation line of affordable Research and Development scale turnkey vacuum coating tools. Pictured here, the Intellivation R&D roll to roll (R2R) coater is capable of substrate widths up to 8" with three process zones which may be configured with deposition sources and plasma pretreatment sources as appropriate for your application. Deposition technologies available include sputter magnetrons (DC, pulsed DC, mid frequency, and RF); Chemical Vapor Deposition (CVD); and Plasma Enhanced Chemical Vapor Deposition (PECVD). Infrared substrate heating is available as an option, as well as chill drum cooling. Intellivation also offers an affordable R&D scale Rigid Substrate (RS) coater line, featuring the same array of deposition sources as the R2R line plus ion beam assisted deposition for optical and other high resolution applications. Options for the RS line include substrate heating up to 800C, substrate transport, and a load lock chamber.

 

 

Intellivation LLC

Fort Collins, CO

www.intelli-vation.com

Contact: Mike Simmons, P.E., president

Tel: 1-970-692-2335

E-Mail:  msimmons@intelli-vation.com

 

 

Nanochrome I Load Lock R&D/Pilot Electron Beam Evaporator

 

Intlvac’s Nanochrome™ I Load Lock system (NCI-LL) is a high-precision R&D/Pilot Electron Beam Evaporator. Numerous configurations are possible, all tailored to your specific application. With it’s small footprint, low cost, and ease of operation, the NCI-LL systems is an ideal choice for pilot projects and research. The NCI-LL system incorporates a clamshell style chamber, which gives you easy access to all parts of the chamber. It can be designed for a number of different substrate holders such as: flat plate planetary, flip fixture planetary, or a planetary dome. Substrate revolution and rotation ensures an even coating. Inside the NCI-LL, you’ll also find quartz halogen lamp heaters and fully automated shutters for total process control.

 

 

 

Nanoquest I Ion Beam Sputtering System

 

The Intlvac Nanoquest Research Ion Beam Sputtering system is a flexible, low cost platform for advanced ion beam materials processing research. Utilizing a compact chamber configuration and a choice of vacuum pumping options, the Nanoquest can be configured with single or dual ion beams, multiple sputter targets, and reactive gas handling to perform inert or reactive etching and ion beam deposition. Key to the systems operation is a direct water-cooled substrate stage that provides rotation and tilt during deposition and etching. Ion beam sputtering can deposit insulators and conductors during the same run.

 

 

 

Intlvac

Niagara Falls, NY

www.intlvac.com

Tel: 1-716-284-0830

E-Mail:  mpereira@intlvac.com

 

 

Next Generation PVD Platform For Tailored Coatings

 

Ionbond is a global, full range supplier of PVD, CVD, CVA and PACVD equipment and services. Taking the best practices from years of experience in the PVD market, Ionbond has developed a new platform: The RoadRunner. The machine can be tailored to specific coating applications such as inserts, round shank tools and forming and molding dies. The RoadRunner incorporates numerous advances allowing for the deposition of more complex, smoother and thicker coatings. Some of the key features are the state-of-the-art module for smooth and efficient etching, the ability to mix arc and sputter technology and the utilization of both round and planar targets for deposition of up to six materials simultaneously. These features have all been built around a platform emphasizing ease of use and rapid deposition rates to maximize productivity. The user is able to choose a solution most suitable to the exact requirements. Forty Ionbond’s service centers in Europe, Asia and North America offer PVD, CVD, CVA and PACVD coatings for tools and components used in a wide variety of industries.

 

 

 

Plasma Assisted Chemical Vapor Deposition (PACVD) Coating Equipment

 

Ionbond’s Plasma Assisted Chemical Vapor Deposition (PACVD) coating equipment allows for the deposition of extremely smooth Amorphous Diamond Like Carbon (ADLC) coatings at temperatures under 200°C. ADLC coatings have an extremely low coefficient of friction, are non-conductive and chemically inert. Primary applications include engine components and machine parts. Ionbond has also developed a proprietary coating removal process that means recoating is possible without damaging the substrate.

 

Ionbond LLC, an Ionbond AG Company

Madison Heights, MI

www.ionbond.com

Tel: 1-248-398-9100

E-Mail:  infous@ionbond.com

 

 

E-Beam Evaporation Systems

 

Johnsen Ultravac Inc. E-Beam Evaporation Systems have single button operation and utilizing a two-chamber design, our evaporation system maintains the multi-pocket electron beam gun at UHV within a cryopumped main chamber. Positioned in the load lock above the main chamber, the carousel is separated by an isolation gate valve. The au- tomated cycle pumps down the load lock and opens the isolation gate valve, thereby exposing the rotating samples to the gun. Upon completion of the evaporation process, the load lock is vented while the main chamber remains at UHV. The unit also has automated pumping and venting, mimic panel displaying system status, atmosphere to UHV in 30 minutes, a motorized multi-sample carousel, slide out bottom flange for easy maintenance, ± 0.25% uniformity over 3 inch diameter samples, and a compact self-enclosed frame.

 

 

 

Johnsen Ultravac Inc.

Burlington, ON, Canada

www.ultrahivac.com

Tel: 1-905-335-7022

E-Mail:  hansd@ultrahivac.com

 

 

744i Large Area, Four-Target, Batch-Sputtering System

 

Built on the production workhorse 600 platform, the KDF 744i features full 200 mm wafer capability, this allows the tool to perform the workload of four 603i systems saving a significant cost over multiple systems. The large area vertically oriented 744i system is the perfect solution for those particle sensitive processes such as TiW and TaN which have tendencies to generate device damaging particles. Using a pallet size of 19 × 19 inches, a host of substrate sizes can be accommodated with this system.As in all inline KDF systems the user can easily change substrate sizes at will run to run. Despite its tall chamber and 24.5-inch cathodes the 744i has a shortened mainframe assembly that helps make the system operator friendly and ergonomically correct. A heated and hi vacuum load lock is standard on the 744i system, this setup allows the user to pre-heat process pallets in the load lock while sputtering or etch processing another pallet simultaneously in the main system. All KDF systems have full capability to be connected to a customer’s intranet or to the Internet for complete remote access and control. To help insure statistical process control the system has full data log monitoring and reporting capabilities. The 744i system also utilizes KDF's family of in-housed designed cathodes, which covers the full spectrum of materials to be sputtered. KDF's Inset Cathode™ can achieve up to 60% utilization while delivering better then 4% pallet uniformity. From dielectrics, magnetic materials, or precious metals KDF has a cathode to fit. The KDF 744i is equipped with all the latest in OEM technology like MKS cluster gauges and Advanced Energy Pulsed power supplies. The software features of the tool are extensive, including but not limited too auto cryo regeneration, auto pump and vent, programmable target burn-in, particle test mode, selectable slew modes, multi servo power mode selections, scan profile mode, multipass up to 9999, and repeat recipe mode. With systems installed around the world the 744i is a production proven and reliable tool.

 

 

844i Large Area Sputtering System

 

The all new second generation KDF 844i system is a large area vertical system that has increased its handling size to handle the ever increasing demands of the high density interconnect, 300 mm, OLED and flat panel display markets. Despite its increased handling size the system still requires a compact footprint that is less than one third of its competitors. The 844i now utilizes a pallet size of 26.5” × 30” giving it enough capacity to load glass panel substrates up to Gen 3.5. The new 844i system is also now coupled with KDF’s PAT (pallet assist tool) . The KDF designed pallet manipulator allows operators to safely handle pallet payloads of up to 150 lb., and its horizontal and vertical movements allow for easy substrate loading as well. The standard tool is integrated and interlocked for both operator and system safety. The new 844i has also been redesigned specifically for thru the wall clean room compatibility as well as having a completely shielded internal chamber area allowing for faster chamber cleaning and less clean room contamination. A user-friendly mobile operator interface cart allows for complete control and system accessibility from any point around the tool. The tool features four 30-inch cathodes that can be chosen from the complete KDF family of in house designed cathodes including the KDF Inset™ and patented full-face erosion LMM™ cathodes. The tool features two processing pallets allowing for instantaneous changes of wafer sizes and the ability to process both the front and backside of the wafer.

 

 

974i Sputtering System with Increased 20 × 20 Inch Pallet Size

 

The all-new KDF 974i tool, is another KDF innovation which now provides a larger 20” by 20” sputter area. The 974i is an excellent choice for pilot production solar applications, or scaling up production rates from smaller KDF/MRC systems. The 974i is a horizontal configured tool that allows complete end user flexibility to handle unique substrate sizes, and shapes. This type of sputter down application increases and simplifies the uses for the tool since special substrate fixturing is generally not required. Uniformity and utilization are not compromised as KDF maintains the proper pallet to cathode ratio as in all our systems. The base tool is configured with a high vacuum cryo pumped load lock along with heat, allowing for pre heating and faster cycle times. This load lock arrangement coupled along with the four 24” cathodes allows for an array of diversified processes and higher throughput offered in a single tool. The 974i is also available with a host of options to make it even more production specific, available options include but not limited to an integrated process RGA, back side gas cooling in RF etch mode, ERPP™ KDF’s planetary pallet operation, upstream and down stream gas control, as well as pulsed DC bias.All KDF systems utilize the latest in communications control and protocol this along with. KDF’s software Recipe Manager allows for the user to have complete access and control of all the hardware features associated with the tool. The 974i is compatible with and utilizes KDF’s full compliment of 744 specialty cathodes, including the Inset Cathode™ , Magterial Cathode™ , Mark II Cathode™ along with standard planar cathodes.

 

KDF Electronics

Rockleigh, NJ

www.kdf.com

Contact: Todd Plaisted, Director of Sales and Marketing

Tel: 1-201-784-5005

E-Mail:  todd@kdf.com

 

 

PVD 75 R&D Vacuum System

 

The Kurt J. Lesker Company® PVD 75 is a versatile, value engineered, R&D vacuum system that can be configured to suit a variety of thin-film deposition applications. Standard features include: a front-loading box chamber, turbomolecular pump package, integrated touch screen control, and a fully enclosed “zero” cleanroom footprint when flush wall mounted. Source flange options include magnetron sputtering, electron beam evaporation, thermal evaporation and low temperature evaporation furnaces. To ensure new product reliability, the PVD 75 is built using proven process modules from other standard Kurt Lesker Company thin-film deposition systems.

 

 

 

 

 

ALD-150L Research Scale Atomic Layer Deposition system

 

The KJLC® ALD-150L is a research scale Atomic Layer Deposition system incorporating automated system control and configured for use with raw 150mm substrates (odd sized and smaller substrates can be accommodated by using appropriate adapters). Key features of this high performance tool include remote plasma capability, standard analytical ports for in-situ real time analysis, fast cycle times (typically <10 seconds), and the ability to integrate the ALD tool into a multitool configuration (i.e. a cluster tool). The most significant feature of the ALD-150L is its’ perpendicular flow design. This design incorporates a curtain gas and flow optimized vessel design to concentrate the reaction at the substrate for maximum contact, uniformity, and fast cycle times while minimizing unwanted side reactions and deposition on chamber walls. A large variety of options are available with this tool including load locks, transfer vessels and connection to PVD tools.

 

 

 

 

TORUS® Magnetron Sputtering Sources

 

KJLC® ’s TORUS® Magnetron Sputtering Sources have 20 years of proven reliability and performance. These TORUS sputtering sources have a long history of success in the sputtering of magnetic materials, insulators, semiconductors, and metals. With a wide variety of cathode styles including Circular R&D, Circular and Linear Production, and UHV Magnetrons, TORUS sputtering sources fit into virtually any application. We provide sputtering solutions, installation, service, and training. Complete packages including power supplies are shown at www.lesker.com. Contact  sputter@lesker.com for more information.

 

 

 

 

Kurt J. Lesker Company®

Clairton, PA

www.lesker.com

Contact: David Collins, Product Manager

Tel: 1-412-387-9004 or 1-800-245-1656

E-Mail:  pvd_vtc@lesker.com or  sales@lesker.com

 

 

Vacuum Coating of Flexible Holographic Products

 

The Leybold Optics FLEX-M 650 is a newly developed machine for the vacuum coating of flexible holographic security products. Precise process control, mass production reliability and optimized cost of ownership are the main characteristics of this production solution. The machine allows the roll-to-roll vacuum coating of PET and OPP film with a maximum width of 670 mm and a film thickness in the range from 12 to 100 m (PET). Key components are evaporation sources for the coating of High-Refractive-Index (HRI) materials and metals onto the holographic film. The newly developed high-rate zinc-sulphide (ZnS) evaporator allows a uniform high-rate coating of a HRI layer. An uniform coating thickness of 50 nm at a coating speed of 2.5 m/sec can be easily achieved. Most accurate process controls are guaranteed due to the use of several direct heated and individually controlled evaporation crucibles. The coating of metals, such as aluminium or copper onto the film, is managed by boat-type evaporators with automatic metal-wire-feeding function. The ISS, In-Situ-Sensor, allows ultra-fast coating-thickness control. An optional flexo-print-type system for the printing of oil prior to the coating allows a precise segmentation of the film. Winding system and vacuum pump package has been adopted from the massproduction proven CAP-M 650 system for the manufacturing of electrical film-capacitors.

 

 

HELIOS Innovative Sputtering System

 

The Leybold Optics HELIOS sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. Its specialty are high quality optical coatings featuring very low absorption and scattering. Excellent optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Ultimate precision in layer growth control is facilitated by an optical monitoring system (option) for in-situ on-substrate measurements. HELIOS can be used for a wide range of optical coating applications, including edge, bandpass, color, and UV/IR cut filters as well as beam splitters and laser mirrors. Besides optical coatings, other dielectric coatings (oxides, nitrides) as well as metallic coatings can be easily produced, depending on the source configuration of the HELIOS. Applications include precision optics; Optoelectronics; Sensors; and Telecom.

 

 

 

 

SYRUSpro CFM High Performance Coatings for Digital Optics

 

Optical thin film coatings are a key enabling technology for digital optics. Constantly increasing demands on image resolution, contrast, color definition, and brightness place exacting requirements on the optical filter performance. The Leybold Optics SYRUSpro CFM is an innovative and cost-effective thin film coating solution for high performance optical filters, tailored to fulfill current and future requirements in digital optics. The APSpro ensures shift-free UV/IR cut filters (top), and excellent filter performance with high transmission and low ripple (bottom). Outstanding uniformity and reproducibility is demonstrated by the data of five substrate positions distributed over the calotte radius, and 6 consecutive production runs. Note: Measurement without backside AR coating. Today’s filters meet a growing range of performance parameters and must be produced within ever-shorter deadlines. This is why excellent quality is the basis for modern digital optics production. A cost-effective thin film deposition system must also deliver increased productivity through consistently high throughput and high yields. Higher product requirements combined with lower cost of ownership demands all add up to an increasingly challenging business environment for the filter manufacturer. Innovative production technology from Leybold Optics provides mass production solutions with outstanding performance, productivity and reliability.

 

Leybold Optics USA

Cary, NC

www.leyboldoptics.com

Tel: 1-919-657-7100

E-Mail:  sales.americas@leyboldoptics.com

 

 

Series PB3 Educational and Training Plasma System

 

Manitou Systems Inc. addresses the Systems Series PB3 Plasma System need for a flexible and low cost educational/proof of concept tool. This modular system is available with either a sputtering or high-density plasma source and includes only basic features. The chamber consists of a 6-inch cross, 4-inch diameter substrate holder, O-ring sealed door with view port and provisions for connecting a vacuum pump and pressure/flow measurement components. An integrated 13.56 MHz RF generator and manual impedance matching network module complete the package. To keep the selling price low, the user can populate the PB3 with a vacuum pump, valves and other process related components from their own stock or by purchasing new components from their favorite vendor.

 

 

 

HELIUS™ RF Generator with ACCU-MATCH™ Impedance Matching Network

 

Manitou Systems Inc.’s has two RF power system components: the Helius RF power generator and the Accu-Match automatic impedance matching network. These components comprise a complete, full-featured RF power delivery system designed to power all types of plasma processes. Both units are available in various output power ratings. The platform concept enables this system to also be easily configured with (other than 13.56 MHz) operating frequencies to accommodate today’s plasma process requirements. An embedded high-speed microprocessor controller enables the Helius to provide enhanced operating controls in addition to advanced internal diagnostic reporting. All hardware is compliant with industry-accepted regulations. Please see the product data sheets for additional information and specifications.

 

Manitou Systems Inc.

Danbury, CT

www.manitousys.com

Tel: 1-203-733-2110

E-Mail:  sales@manitousys.com

 

 

SunSource™ GEN II High Utilization Narrow Width Sources

 

A new line of Materials Science, Inc. SunSource™ GEN II magnetron sputtering sources with 90mm wide targets featuring 40wt% utilization during the useful target life has been developed. They are ideal for sputtering precious metals and expensive, hard to fabricate materials used in the production of photovoltaic devices. Good target utilization can be achieved even at very low power levels. An important benefit is that there is virtually no center material redeposition. These sources are a cost-effective alternative to rotary magnetrons in many applications. The plasma discharge is confined to the region above the target surface due to the highly balanced magnetic design. No strong stray electromagnetic fields are generated that promote arcing, substrate damage and heating from electron and ion bombardment and sputtering of the source itself. They are ideally suited for small vacuum web coaters – Distribution from the source is more easily matched to the circumference of the drum. Flange mount, internal mount and retrofit configurations are available with a variety of feedthrough and utility connection possibilities.

 

 

 

SunSource™ GEN II Linear Sputtering Sources with Kamlok™ Fast Target Exchange System

 

Materials Science, Inc. SunSource™ GEN II magnetron sputtering sources include the Kam-Lok™ (patent pending) fast target change mechanism that eliminates target fasteners prone to galling and seizure – targets are exchanged quickly regardless of length. Gas injection through the cathode body & efficient cooling ensure uniform distribution, high rates and low pressure operation. A wide uniform target erosion area results in stable reactive sputtering, high target utilization and virtually no center material re-deposition. They can be used in DC, pulsed DC, AC and RF modes. They are available in internal and flange mount configurations in lengths up to several meters in a variety of target widths.

 

 

 

SunSource™ High Target Utilization Sputtering Sources [MSI Eroded_Targets_03.jpg]

 

Materials Science, Inc. SunSource™ round and rectangular sputtering sources feature the highest real target utilization of any planar magnetron available. Utilization varies from 40-45 wt% during the useful target life depending upon the target width and thickness. An active plasma discharge on nearly entire target surface significantly reduces insulating film growth and arcing and promotes stable operation. Target erosion is uniform throughout the target lifetime without significant changes in distribution uniformity as the target erodes. There is virtually no center re-deposition and the active plasma is confined to the target surface - target clamps and shields are not sputtered and consumed. There are no “wiggles” down the length of the racetrack and no premature burnthrough at the ends of linear sources.

 

 

Materials Science, Inc.

San Diego, CA 92109

www.msi-pse.com

Tel: 1-858-483-3223

E-Mail:  sales@msi-pse.com

 

 

MDC e-Vap® and Re-Vap™ E-Beam Thin Film Vacuum Coating Equipment

 

MDC produces state-of-the-art thin film vacuum coating equipment, and offers a wide range of choices and options in both, standard off-the-shelf components and customize designs. MDC’s e-Vap® and Re-Vap™ product lines fully support electron beam or thermal evaporation methods. Featured products include the super economical and compact, 4 pocket, 3 kW, e-Vap® Mighty Source™ . Specifically tailored for pilot production, lab/R&D and the university marketplace, the Mighty Source™ provides the ideal deposition solution for your evaporation needs. Contact MDC now and request your free, Thin Film Product line brochure.

 

MDC Vacuum Products Corporation

Hayward, CA

www.mdcvacuum.com

Contact: Maarten Kramer,VP Sales& Marketing

Tel: 1-510-265-3500 or toll free 1- 800-443-8817

E-Mail:  mkramer@mdcvacuum.com

 

 

RF Diode Dielectric Sputtering Tools

 

MeiVac (Comptech) production dielectric sputtering systems are standards in the Magnetic Storage Industry, with more than 250 installed worldwide. The flagship 2480 system offers batch processing with a 20 × 20-inch target/substrate carrier that is capable of processing up to 4 each 200 mm wafers. Systems can be customized to address customer specifications for wafer sizes, load sizes, alternate materials and/or specific processes. RF bias is standard for stress reduction, improved uniformity and edge coverage. Helium backside cooling of wafers is standard, allowing higher deposition rates. Process characterization/optimization is also offered. Hardware upgrades and/or retrofits associated with wafer sizes, pumping, deposition power sources, control systems etc. are routinely offered to extend tool lifetimes. Recent process enhancements on the 2480 deliver uniformities for certain materials of <1% sigma / mean.

 

 

 

 

602 Cluster Dielectric Sputtering Tools

 

MeiVac 602 multi-chamber tools are available with single, double or triple chamber configurations employing RF Diode deposition sources. These tools have become the workhorses of many 24/7 hard disk drive thin film head production fabs. Fully automated and employing helium backside wafer cooling to increase throughput, these tools can handle wafers up to 200 mm. Process chamber configurations are tailored to customer requirements. RF bias for stress reduction, improved uniformity and edge coverage is standard. Process optimization and characterization of alternate materials maximize the flexibility and life of this tool in an everchanging technology. Hardware upgrades and/or retrofits associated with wafer sizes, pumping, deposition power sources, control systems, etc. are routinely offered to further extend tool lifetimes. Recent process enhancements on the 602 deliver uniformities for certain materials of <1% sigma/mean.

 

Meivac Inc.

San Jose, CA

www.meivac.com

Contact: Mike Menetto

Tel: 1-408-362-1000

E-Mail:  Mike.Menetto@meivac.com

 

 

elite™ RF Power Generator

 

MKS Instruments has introduced the elite™ RF Power Generator for amorphous Si PV, LED and MEMS applications. The elite™ generator's integrated, single PCBA design offers exceptional reliability, and its air cooled, compact, lightweight design provide a cost-effective, easy-to-install solution for RF deposition and etch needs. The elite™ RF generator is available in 2U full rack and 3U half rack enclosures to allow for rack mounting and is available in power levels of 300W, 600W and 750W. The robust, full rack design eliminates cables and connectors, while the patented inductive clamp technology protects the generator from adverse VSWR load conditions. The air-cooled, single phase, efficient 13.56MHz generator results in low cost-of-ownership. The elite™ RF generator can be used for amorphous thin film solar manufacturing, LED passivation and etch, MEMS and semiconductor processes including PVD,CVD, ALD, strip and etch. The elite generator can also be applied for cleaning, surface treatment and coating of medical components; and back end electronic packaging.

 

 

 

Custom Manufactured Vacuum Chambers

 

The MKS, HPS® Products team are specialists in the fabrication of precision machined vacuum chambers, components and electromechanical assemblies to UHV (Ultra High Vacuum) standards for the scientific, semiconductor and medical industries. The MKS, HPS® dedicated team of engineers, machinists, welders and production personnel have the expertise and experience in vacuum chamber design and fabrication to take process requirements from 3D CAD models to the final product. Our large vacuum chamber design experience allows us to offer modifications that often result in cost savings and increased system performance. As a leading manufacturer of vacuum instruments and components, the MKS, HPS Products team can deliver finished systems as stand-alone chambers, add-on components or ready-to-pump vacuum chambers with UHV metal-sealed CF flanges, valves, gauges, and specialized ports. MKS has designed and manufactured UHV vacuum chambers and systems for a wide variety of customers and applications, meeting the difficult demands of advanced processes and stringent specifications. Our equipment plays a key role in markets such as Deposition and Coating Systems for Semiconductor and related industries, High Energy Physics, Medical, Alternative Energy and Environmental and National Laboratories.

 

 

Vision 2000-C™ and Vision 2000-E™ RGA

 

MKS Instruments Process Monitor products are innovative, in-situ process monitoring instruments that are fully integrated, application-specific packages, including component residual gas analyzers (RGAs), analytical equipment, and control software. Process mass spectrometers are used in varied applications, including CVD, PVD and Etch for process gas analysis. The MKS Spectra™ Products Vision 2000-C™ and Vision 2000-E are™ designed to track levels of various gas species during etch processes and the chamber clean, passivation sequences, and deposition steps for various CVD processes including Titanium nitride (from TDMAT), Tantalum oxide (from tantalum precursor), Copper (from CupraSelect® ), HDP of low-k dielectric films, Atomic Layer Deposition, Atomic Layer Epitaxy and MOCVD. Vision 2000-C™ and Vision 2000-E™ incorporate "smart head" RGA technology from Microvision 2 with a closed ion source and close-coupled inlet. This state-of-the-art RGA technology is integrated with Process Eye™ Professional control platform, a recipebased, user-configurable software program. The combination of closed ion source and automated inlet allows seamless monitoring of the complete CVD or Etch process cycle, from base vacuum to process pressures of up to 700 Torr.

 

MKS Instruments, Inc.

www.mksinst.com

Contact: MKS Applications Engineering

Tel: 1-800-227-8766 (USA) or 1-978-645-5500 (worldwide)

E-Mail:  mks@mksinst.com

 

 

UNIVEX 450C Cluster Tool

 

The UNIVEX 450C from Oerlikon Leybold Vacuum is a cluster tool solution that features a central load lock system, central transfer chamber with vacuum robot, separate pump systems for each chamber and PLC-controlled fully-automated system operation. The UNIVEX 450C is ideal for coating sequences in pilot production and R&D applications, including nanotechnology, opto-electronics, semiconductors, sensor technology, solar and materials research. Best-suited to RF/DC sputtering processes, it also performs well in flexible coating sequences requiring unusual layer combinations and material compositions, efficient wafer throughput and complex processes. Advantages include customized system design, programmable control of process sequences, low residual gas contamination and easy operation with a colorful, user-friendly touchscreen.

 

 

 

UNIVEX 450B RF/DC Modular Rack Sputtering System

 

The UNIVEX 450B from Oerlikon Leybold Vacuum features a modular rack system, high vacuum pump connection at the chamber’s rear and PLC-controlled system operation. The UNIVEX 450B is ideal for automated coating operations in pilot production and R&D environments, including nanotechnology, opto-electronics, semiconductors, sensor technology, solar and materials research. Best-suited to RF/DC sputtering processes, the UNIVEX 450B offers flexible coating sequences for the most complex layer combinations, material compositions, wafer throughputs and manufacturing applications. Advantages include flexibility, compact modular design, customizable to any system configuration, ability to integrate with any process components and easy operation of a colorful touchscreen with user-friendly graphics. The UNIVEX 450B is considered the “big brother” of Oerlikon Leybold Vacuum’s UNIVEX 350.

 

 

 

 

UNIVEX 350 Deposition System for Pilot Production or R&D including Nanotechnology, Opto-Electronics, Semiconductors and More

 

The UNIVEX 350 from Oerlikon Leybold Vacuum features a front-loading chamber for easy access to deposition sources, making it easy to load and unload substrates. Available in turbomolecular and cryopump options, the UNIVEX 350 is ideal for cleanrooms and similar environments requiring manually controlled or automated batches for pilot production or R&D, including nanotechnology, opto-electronics, semiconductors, sensor technology, solar and materials research. It can perform thermal evaporation and electron beam deposition, as well as evaporation and RF/DC sputtering as single or combined processes on substrates with diameters up to 320mm. Key system components include a box coater with a 350mm wide vacuum chamber, modular rack system, high vacuum pump connection at the chamber’s rear and PLC-controlled system operation. Advantages include flexibility, compact modular design, customizable system configuration, ability to integrate with any process components and easy operation.

 

Oerlikon Leybold Vacuum USA

Export, PA

www.oerlikon.com

Contact: Brett A. Rock, Market Support Manager

Tel: 1-724-493-2654

E-Mail:  brett.rock@oerlikon.com

 

 

PRO-75/100 MBE Systems Professional Top-of-the-Line MBE Systems

 

The Oxford Instruments Omicron PRO-75/100 MBE-Systems are dedicated growth systems with a loadlock chamber and with an optional preparation/storage chamber. The substrate sizes are either 3” (PRO-75) or 4” (PRO-100). The systems of course also accept smaller samples (1” and 2”) and the Omicron standard sample plates. The carefully designed chamber with up to 12 effusion cells shows excellent thickness uniformity for all substrate sizes. The large effusion cell capacity of to 130 cm3 for layer growth significantly increases the up-time of the system. The fast and reliable sample transfer together with the excellent performance results in a low cost of ownership. The optional available easy & intuitive to operate growth control software and the possibility to add standard Omicron analysis equipment makes this a unique MBE system for researchers.

 

 

 

 

Delivery Module Enables TEOS-based SiO2 PECVD

 

Using the Oxford Instruments’ Plasmalab® System100 and Plasmalab® System133 process tools, TEOS (tetraethoxysilane, tetraethyl orthosilicate) offers an alternative PECVD precursor to the commonly-used silane (SiH4.) The complete TEOS PECVD system enables high quality, conformal deposition of SiO2 for photonics, dielectric layers and other structures together with control of film stress, deposition directionality and degree of step coverage by controlling oxygen radicals. The TEOS delivery module offers an integrated purpose-designed solution with optimized heated delivery lines to ensure efficient, high-uniformity SiO2PECVD processes and an easy source access and changeover. There is an optional glove box that can be fitted onto the module for maximum safety and the module can be connected into a clean-room extraction system if required.

 

Oxford Instruments

Witney, Oxfordshire, UK

www.oxinst.co.uk

Contact: Lynn Shepherd, Corporate Communications Manager

Tel: +44 (0)1993 880005

E-Mail:  lynn.shepherd@oxinst.com

 

 

PE-200 Plasma Etching Benchtop System

 

Plasma Etch, Inc.’s welded aluminum vacuum chamber encloses 500 square inches of active plasma processing surface. Surface modification with plasma etching yields increased bond strength and cleanliness of most any surface material. Often purchased by small production facilities, research and development labs, testing facilities and universities. Industry users include biomedical, dental, electronics, light industrial, medical, plastics, optical, and solar panel. Etching with our plasma cleaner rather than with chemical baths can eliminate expensive hazardous chemical waste. It is simple to use with an intuitive touch screen interface controls every aspect of the plasma process ensuring repeatability. We will custom configure the chamber and electrode configuration to suit your product or process including custom sized horizontal electrodes, RIE (Reactive Ion Etch) and Semiconductor Lead Frame magazines.

 

Plasma Etch, Inc.

Carson City, Nevada 89706

www.plasmaetch.com

Tel: 1-775-883-1336

E-Mail:  sales@plasmaetch.com

 

 

Sputtering and Evaporation Systems All In One Chamber

 

PVD Products can provide sputtering and evaporation systems all in one chamber. Shown here is a system with four UHV magnetron sputter sources with in-situ tilt along with a UHV threepocket e-beam evaporation source with auto indexer. Included in this UHV cryo pumped system are a turbo pumped loadlock, multiple MFCs, all pneumatic valve package, closed loop pressure control, a RHEED gun, RGA, and an in-situ ellipsometer. The system provides heating to 850°C for wafers up to 4” in diameter along with an RF bias. DC, pulsed DC, and RF power supplies are included. Full software is provided for multilayer film growth. PVD Products can provide a wide array of sputtering tools or PVD combination tools to meet your specific needs.

 

 

 

 

Sputter Combo 4000 System

 

PVD Products’ Sputter Combo 4000 provides the ability to grow multiple test pads on a single wafer of slightly different compositions with a well-defined size and field array. Four sputter sources along with associated DC and RF power supplies are provided for growing binary, ternary, or quaternary compounds of slightly different chemical compositions. This system is fully programmable with multiple MFCs, pressure control, source selection, power supply control, step and repeat distances, and provides the customer with a very quick and simple means of exploring compositional libraries and find thin films with the exact composition that meets their needs. Test pad size and shapes can be easily changed. Systems with optional loadlocks for single or multiple wafers from 75 up to 300 mm in diameter are all available.

 

 

 

 

PLD/MBE Deposition Systems for the Growth of a Wide Variety of Oxide or Other Multi-Component Materials

 

PVD Products provides a full line of PLD/MBE deposition systems for the growth of a wide variety of oxide or other multicomponent materials. These systems can include High Pressure RHEED and incorporate multiple magnetron sputter sources, ion or atom sources, and/or effusion cells. Systems come complete with MFCs, pneumatic valves, closed-loop pressure control, multi-target assembly with six 2-inch diameter targets, rotating substrate, complete optical train with laser beam rastering, an appropriate excimer laser, and full multilayer film growth software. Optional loadlocks and UHV versions are also available.

 

PVD Products, Inc.

Wilmington, MA

www.pvdproducts.com

Contact: Jim Greer

Tel: 1-978-694-9455

E-Mail:  sales@pvdproducts.com

 

 

Ion Current Monitor

 

The Saintech Ion Beam Systems Ion Current Monitor has been developed to provide essential deposition information for any ion-based process such as IAD, IBAD, IBS, etc. The ICM monitors the flux of positive ions and outputs the ion beam current in units of microamps or milliamps per square centimetre. Three amplifier ranges are provided to cover a wide range of flux densities from only a few microamps to 10 mA per square centimetre. An adjustable bias voltage is provided to reject negatively charged particles (electrons). Three auto-ranging ion current ranges provided: 10 µA/volt, 100 µA/volt and 1000 µA/volt.

 

 

 

Saintech Ion Beam Systems

Gladesville, New South Wales, Australia

www.saintech.com

Tel: +612-9817-0466

E-Mail:  info@saintech.com or  sales@telemark.com

 

 

Tri-Axis PVD System

 

Semicore Equipment, Inc.’s TriAxis systems utilize a cost-effective “open platform” design that is easily configured to suit a variety of thin film deposition applications, typically for R&D or small batch production. The TriAxis offers unequaled versatility by being the first to offer all three axes of sputter deposition arrangements (up, down or horizontal) in a single platform configured at time of order. A comprehensive list of standard options is available to configure the TriAxis to suit your specific requirements. TriAxis deposition techniques include confocal magnetron sputtering (RF, DC, or Pulsed-DC), electron beam evaporation, thermal evaporation, and organic evaporation. Chose from a variety of load lock options, substrate holders and process control features.

 

 

 

SC 4000 Large Chamber Volume Deposition Systems

 

The Semicore SC 4000 is large volume deposition system. This unit interior is almost 2 × 2 × 2 meters for large area coatings or high throughput applications, such as solar PV, optical, military, automotive, etc. It supports common deposition techniques including electron beam evaporation, resistance evaporation and ion beam assisted deposition. The system supports various substrate tooling configurations, including planetary, adjustable angle, flip, or your custom engineered aperture. It comes with a choice of several pumping packages and deposition configurations. The SC 4000 also comes with a wide range of controls and software that easily interface with other large material handling applications.

 

 

 

 

SC1500 In-line Sputtering System

 

Custom and standard designs allow a variety of turnkey solutions. The Semicore SC1500 is a scalable configuration accommodating pilot or high volume production requirements. Load locks with multi-pallet handling deliver continuous tip-to-tail processing for optimal throughput and target usage. Various size and shape substrate processing saves costly re-tooling. Dual sided sputtering is accomplished in a single process without venting to atmosphere. Target isolation is minimized to avoid cross contamination. Application specific tooling is available in a range of factory options engineered for individual needs. Precision sputtering and evaporation systems are Semicore’s specialty. Our extensive technical know-how and experience help solve the most difficult projects.

 

Semicore Equipment, Inc.

Livermore, CA

www.semicore.com

Tel: 1-925-373-8201

E-Mail:  sales@semicore.com

 

 

Orion Series Evaporation System

 

System Control Technologies designs and manufactures physical vapor deposition (PVD) thin film coating systems and components. Core technologies include thermal, and electron beam evaporation, RF/DC sputtering, ion plating, ion-beam sputtering, plasma deposition and ion-assisted (otherwise known as “IAD” or “IBAD”) deposition. We serve a wide variety of markets including precision optics, fiber optics, displays, electronic devices, flat panel semiconductors, functional and decorative coatings, flexible circuits, electro-optics, storage media, MEMS and nano-fabrication, photovoltaics, compound semiconductors and defense industry applications. The Orion Series Evaporation System can handle optical, semiconductor or low temperature organic applications. Chamber sizes range from 500 mm to 1500 mm with multiple electron beam and thermal sources. Ion-assisted deposition and substrate pre-cleaning, plasma deposition and substrate pre-cleaning and a completely automatic system are featured.

 

System Control Technologies

Santa Clara, CA

www.systemcontroltechnologies.com

Tel: 1-408-988-0400

E-Mail:  sales@systemcontroltechnologies.com

 

 

Smart-Jar Load Lock System for Sputtering

 

T-M Vacuum Products’standard line of Super Series™ Smart-Jar Bell Jar and Collar-Type Coating Systems are available with internal chamber sizes ranging from 18 to 48 inches diameter and up to 48-inches high. Our base size Smart-Jar bell jar measures 24-inches diameter × 30-inches high (with a usable internal volume of 7.88 cubic feet) and the bell jar chamber and all its components are manufactured from 304L stainless steel with a number 4 electro-polished finish on all inner and outer surfaces. The jar’s true “dual wall” design ensures the vacuum chamber receives 100% uncompromised water-cooling with no risk of leak from damaged cooling channels or tubing lines. Each bell jar system is mounted to a stainless steel “O” ring-sealed base plate that incorporates all necessary pumping ports and feedthroughs required for operation. 4-inches ports with manually operated shutter assemblies provide viewing access. The Smart-Jar Series bell jar features a main, “self-centering” split seal located in the center of the jar that divides the jar in half for more efficient cleaning and foiling. The lower portion of the jar rests on the base plate during operation and can be lifted by an integrated hoist when cleaning and/or maintenance is required. Single or multiple source electron-beam, thermal evaporation, magnetron sputtering and cathartic arc coating sources are available along with a choice of single or multiple cryogenic, turbomolecular or ion sublimation vacuum pumps to achieve high vacuum process environments. All sources incorporate independent shutter systems and each electron beam source is mounted on an adjustable “stage” assembly located at the base plate of the bell jar chamber. The stage assembly allows each source to move freely in a 90° arc and can be raised or lowered to allow true source-to-substrate distance characterization for a more uniform coating. Multiple sputtering sources can be configured for sequential or co-deposition film processes in a vertical, horizontal, up, down and/or conical sputtering configuration.

 

T-M Vacuum Products, Inc.

Cinnaminson, NJ

www.tmvacuum.com

Tel: 1-856-829-2000

E-mail:  info@tmvacuum.com

 

 

Combination Electron Beam and Thermal Evaporation Deposition System

 

Torr International’s Combination Electron Beam & Thermal Evaporation Deposition System is practical and highly reliable. The system is standard with a rotating multi-pocket Ebeam source varying in crucible volume. The Ebeam power supply output can vary, dependent on both crucible size and source material. There are two resistive thermal evaporation sources that adapt to industry standard available sources. The resistive thermal power supply is a phase angle operated thyristor power controller used to operate a low-voltage, high-current power supply. All sources are appropriately positioned to maximize deposition rate and uniformity while also being shielded from each other to avoid cross contamination. There are different available deposition control options as well as full PCcontrolled availability.

 

 

 

 

CRTE, Compact Research Thermal Evaporator

 

Torr International’s CRTE, Compact Research Thermal Evaporator, is our latest system introduced to the research and industry community. Its small footprint and simplistic design will cater to institutions in need of updating their outdated deposition equipment. There are up to three resistive thermal evaporation sources that adapt to industry standard sources. The resistive thermal power supply is a phase angle operated thyristor power controller used to operate a low-voltage, high-current power supply. All sources are appropriately positioned to maximize deposition rate and uniformity while also being shielded from each other to avoid cross contamination. With available state of the art deposition controllers and software, the Torr International, CRTE, is a welcome addition for your Lab.

 

 

 

 

MagSputTM Magnetron Sputtering Deposition System

 

The Torr International MagSput™ series, the next generation Magnetron Sputtering Deposition system, is practical, inexpensive, expandable and highly reliable, ushering in the future of research. System options are only limited to the imagination of the researcher and clinical investigator. Customizable solutions are available for most circumstances. We also offer a Table Top solution, our CRC series, Compact Research Coater. There are different available deposition control options and full PC controlled availability in our Magnetron Sputtering Deposition Systems.

 

Torr International, Inc.

New Windsor, NY

www.torr.com

Tel: 1-845-565-4027 or 1-845-565-6637

E-Mail:  torr@torr.com

 

 

Roll-Coating Equipment for R&D and Pilot-Scale Applications

 

ULVAC’s model SPW-030 roll-coating system is designed for R&D and Pilot-scale production applications. Capable of processing a 300 mm-wide web, of various substrate compositions; either thingauge metal rolls, or various polymeric materials, the coater can be equipped with a combination of deposition sources. The SPW-030 can be equipped with up to four sputtering cathodes, and an electron beam evaporation source, for depositing materials of varying compositions. The main deposition drum can be either heated, or cooled, and the system can be equipped with a pre-treatment ion (bombardment) source. The system can be also equipped with additional cooling rollers and a film thickness monitor.

 

 

 

 

SME-200J Thin-Film Battery Fabrication Equipment

 

ULVAC has developed a unique equipment suite for depositing all layers of materials required for the fabrication of thin-film batteries (TFB). The cathode solid electrolyte layer and cathode current collector layers are formed using the cluster-type sputtering system (model: SME-200J). The anode layer is formed by evaporating lithium metal in an evaporation system (model: ei-5). The sealing/packaging layer is formed using a cluster-type evaporator-polymerization system (model PME-200). This Thin Film Battery integrated production system has been jointly developed by ULVAC, Inc. and ULVAC Materials, Inc. A combination of process chambers and deposition sources were selected from ULVAC’s broad product range to provide a suite of equipment ideally suited for TFB applications. In collaboration, Ulvac Materials has developed the appropriate high-density targets (lithium cobalt oxide and lithium phosphate) that optimize the performance with these systems.

 

ULVAC Technologies, Inc.

Methuen, MA

www.ulvac.com

Tel: 1-978-686-7550

E-Mail:  sales@us.ulvac.com

 

 

Sputtering and Evaporation Inline

 

VPT’s Inline and Multi-Chamber Vacuum Systems provide tremendous competitive advantages over conventional batch processing. Operating sequential process steps in parallel unleashes design flexibilities and a long list of advantages, including higher throughputs, lowered costs; Mixed production for less downtime, more scheduling flexibility; Modular designs adapt to future product demands; and Less sensitivity to humidity results in better, more predictable yields. VPT can meet your needs. VPT’s experience with all types of multi-chamber systems and processes insures that you will get an optimum solution for your unique application that meets your unique needs. Please visit www.vptec.com for more information about VPT’s ADVANTAGE Inline Evaporation Systems for precision optics and Model CCS3 Modular Inline Sputtering systems. VPT is integrated vertically in order to command strategic capabilities – the local and total control of all key fabrication, programming, integration, development, and testing steps. Know-How Transfer plays a special role in satisfying the needs of a diverse customer base, the systems in VPT’s Coating Development Laboratory continue to play an absolutely essential role in the design of thin films, their process development, and on-going process support.

 

Vacuum Process Technology, Inc.

Plymouth, MA

www.vptec.com

Tel: 1-508-732-7200

E-Mail:  sales@vptec.com

 

 

New Suite of GaN MOCVD Systems to Extend Industry Leadership in LED Manufacturing

 

Veeco Instruments Inc. introduced three new models of its market-leading TurboDisc® metal organic chemical vapor deposition (MOCVD) systems for the production of high brightness light emitting diodes (LEDs): TurboDisc MaxBright®, TurboDisc MaxBright MHP and TurboDisc K465i HP .The MaxBright MHP provides as much as 20% within-wafer wavelength uniformity improvement over MaxBright. MaxBright M is a modular and more compact version of Veeco’s multi-reactor system. The MaxBright M provides easier serviceability and up to 15% improved footprint efficiency compared to MaxBright. It also features improved layout configuration flexibility to accommodate various fab spacing requirements. The MaxBright MHP is a high performance version of the new modular “M.” The MaxBright MHP provides as much as 20% within-wafer wavelength uniformity improvement over MaxBright. Higher yields are achieved from technology advancements that result in improved thermal and flow capability. The MaxBright MHP also provides lower cost of ownership as compared to MaxBright. The K465i HP is a high performance option for Veeco’s single-reactor MOCVD system which delivers up to 20% within-wafer wavelength uniformity improvement compared to the K465i and lower cost of ownership. These new systems are available in 2, 4, 6 and 8” configurations. Existing MaxBright and K465i systems are easily field-upgradeable to the high performance HP option. All of Veeco’s MOCVD systems feature its low maintenance TurboDisc technology that enables highest system availability and throughput.

 

 

Third-Generation NEXUS Ion Beam Deposition (IBD) System

 

The third-generation NEXUS Ion Beam Deposition (IBD) system incorporates Veeco’s award-winning deposition technology to help data storage manufacturers dramatically increase yield, as well as meet the needs of multiple generations from current CIP to advanced CPP devices. It is also ideal for MRAM applications. The NEXUS IBD is designed to improve inboard/outboard symmetry, significantly reducing side-to-side imbalances. In addition, sharper takeoff angles and reduction of overspray increase sensitivity. Best of all, the NEXUS IBD can be integrated on a cluster platform with IBE, PVD and other technologies, and is compatible with the current installed base of Veeco deposition and etch cluster tools.

 

 

 

 

NEXUS Physical Vapor Deposition System

 

Veeco’s high-rate alumina NEXUS® PVD-HR Physical Vapor Deposition System offers superior thickness uniformity and wafer-to-wafer repeatability without target poisoning. The system provides the flexibility and process tune-ability of ion-assisted deposition with the high-rate and reliability requirements of thick overcoat applications. The system is 200mm capable. Designed to provide arc-free and pinholefree films, the PVD-HR incorporates "best-in-class" technology on a small footprint for a lower cost of ownership. As part of Veeco’s NEXUS family, it can be integrated on a common hardware and software platform with complementary Veeco technologies, such as ion beam deposition, ion beam etch, and reactive sputtering.

 

Veeco Instruments Inc.

Plainview, NY

www.veeco.com

Contact: Fran Brennen, Senior Director of Marketing Communications

Tel: 1-516-677-0200 Ext. 1222

E-Mail:  fbrennen@veeco.com

 

 

Evactron® RF Plasma Cleaner

 

The XEI Scientific, Inc. Evactron® RF plasma cleaner improves electron microscope imaging and analytical performance by removing contamination. It cleans and breaks down oils and other hydrocarbons in most vacuum chambers resulting in high-quality images and carbon-free analysis. It can be used as an in-situ solution, cleaning EUV and X-ray optics. The Evactron® Decontaminator is a general purpose RF plasma asher capable of external mounting on most vacuum chambers and electron microscopes. Low power prevents instrument damage. The Evactron® De-Contaminator can use air, oxygen gas, oxygen gas mixtures or hydrogen gas for gentle cleaning and decontamination without damage.

 

 

XEI Scientific, Inc.

Redwood City, CA

www.evactron.com

Tel: 1-650-369-0133

E-Mail:  information@evactron.com

 

 

Thin Film Systems

 

Yeagle Technology, Inc. (YTI) Thin Film Products and Services builds and rebuilds new and used vacuum systems for PVD, CVD and PECVD in configurations customized to specific applications. In addition, YTI offers a variety of vacuum components including a complete line of electrical, fluid, and rotary feedthroughs. An extensive inventory of new, used and rebuilt mechanical, rotary vane and diffusion vacuum pumps are available and in stock. Also offered are power supplies, controllers, process integration components, and Intellitrol® automatic valve controllers. The company also stocks many commodity items. YTI has an exceptional staff of fully trained service engineers to provide comprehensive field service. A complete array of test equipment in each service vehicle allows us to diagnose any vacuum system or electronics problem from air leaks to Zener failure (and everything in-between). Our staff is factory trained on vacuum equipment and support instrumentation.YTI also offers 24 hours/7 days a week emergency service and, inmost cases, can provide 24-hour response time. YTI provides installation, preventative maintenance, or customized service contracts to meet any equipment, facility, or application needs.

 

Yeagle Technology, Inc

Ashford, CT

www.ytionline.com

Contact: Bobbie Ross, Vice President

Tel: 1-860 429-1908

E-Mail:  bobbie@ytionline.com