Deposition, Coating, Cleaning and Etching Vacuum Processing Equipment
Compiled by Terrence Thompson, Contributing EditorProduct Descriptions
, with a water-cooled stainless steel housing. All AIXTRON systems are fitted with horizontal laminar flow reactors. The laminar flow principle guarantees extremely precise heterojunctions and unequalled control of deposition rates at the monolayer level. The combination of this principle with AIXTRON’s unique multiple substrate carrier rotation, known as gas foil rotation (GFR), ensures excellent deposition homogeneity regarding layer width, composition and doping. In addition, the special reactor inlet valve, which allows the separation of certain gases, ensures a uniform outward radial flow and optimum distribution adjustment. The reactors are heated via infrared (850°C) or inductively (1200°C to 1700°C in the case of silicon carbide) and can be equipped with a wide range of in-situ sensors, including the EpiRAS exclusive to AIXTRON reactors. AIXTRON’s current MOCVD product portfolio, including the CRIUS® II-XL (Close Coupled Showerhead® ) and the AIX G5 HT (Planetary Reactor® ) systems, are aimed at today’s and anticipated future market needs.
Our systems feature fast ramp rates, automatic recipe execution, excellent uniformity and reproducibility for nanomaterial growth. The systems are based on the highly scalable showerhead concept and are available for wafer-sizes from 50mm to 300mm in diameter.
and right angle configurations are also available. Both process chambers are designed to achieve 10-10 Torr base vacuum with integral bakeout jackets. The sputtering system accommodates 3” substrates and features 1000°C heating, rotation, RF biasing and (4) AJA Super A315 (1.5”) UHV sputtering sources with in-situ tilting, and (1) 4” UHV sputtering source located on-axis for direct, high rate deposition onto the substrate. The Nitridization chamber is equipped with a water-cooled, RF biased substrate holder, ICP RF plasma source and a J.A. Woollam ellipsometer.
right angle layout. In-line configurations, individual load-locks, and common docking stations with cassettes are also available. Each system is fitted with an 850°C substrate heater. The PLD side features in-situ Staib RHEED, a (6) material, target carousel with azimuthal rotation and programmable positioning/wobble to facilitate uniform target erosion. A shielded, laser beam safety tunnel with beam positioning is also included. The Magnetron Sputter side features up to (8) sources with in-situ tilt in a confocal geometry and up to (3) additional sources in a direct sputter configuration. These features allow for co-deposition, combinatorial depositions, precision ultra thin film depositions and high rate direct depositions.
Tool designed for 100 mm to 200 mm Si wafers can be configured for single wafer use or be fitted with a 6-substrate cassette for pilot scale production. The wafer cooling is accomplished by backside He or Ar gas. Computer control is standard and auto-loading is optional. Both systems are load-lock compatible. Oxide etch rates of 30 nm/ minute are achievable with ± 2% etch uniformity.
for gold coating, CV dot matrix aluminum deposition, sil- icon dioxide deposition; DC sputter of metals and RF sputter of insulators and metals up to 8-inch diameter substrates.
loop co-deposition control, recipe storage and a unique clamshell chamber for improved accessibility. If your process requires controlled atmosphere integration, the Covap II is design ready to be built into a new or existing glove box. If your process requires glove integration the Covap II can be mounted beneath your glove box making it a zero-footprint addition.
With its large, hinged front door, working with and cleaning the machine could not be easier. Offering custom flexibility in a compact footprint at an economical price, our Nexdep system can be built to meet your needs. Whether your process requires resistive evaporation, sputter deposition or electron beam evaporation, the Nexdep is highly capable. Its large hinged front door makes working with and cleaning the machine incredibly easy. Process capabilities include resistive thermal evaporation, sputter deposition, electron beam evaporation, ion-assisted deposition and custom configurations are available.
Our in-house developed control software smoothly integrates the various system components, keeping the right information at your fingertips. The Åmod line of thin film deposition tools was designed to meet the advanced process requirements of today’s thin film researcher. Our flagship line is fully customizable and can even be combined as part of a multi-system configuration. Our inhouse developed control software smoothly integrates the various system components, keeping the right information at your fingertips.
Process capabilities include resistive thermal evaporation, sputter deposition, electron beam evaporation, ion-assisted deposition and custom configurations are available.
By maintaining the uniformity performance and particle control required to achieve high production yields, the AKT-55KS PECVD system provides a rapid, easy to implement path for manufacturing high-quality MO displays. The AKT-PECVD platform deposits insulating films on large-area glass substrates for the fabrication of LCD screens. AKT-PECVD systems offer processes for both amorphous silicon (a-Si) and metal oxide (MO) backplane technologies. Available films include both doped and undoped (a-Si), silicon oxide, silicon oxynitride (SiON), silicon nitride, and in-situ multi-layer depositions. Applied’s advanced PECVD technology provide a rapid, cost-effective path to bring metal oxide transistor technology to market, an emerging technique for manufacturing next-generation ultrahigh-resolution displays. Applied’s PECVD silicon oxide films provide a dielectric layer interface for metal oxide transistors that minimizes hydrogen impurities to improve transistor stability and provide optimized screen performance. Proprietary process chamber technology enables AKT-PECVD systems to deliver excellent film uniformity and electrical properties over the complete range of glass sizes used in the display industry from Gen 2 (2m2 ) all the way up to Gen 10 (9m2 ).
system sizes available. Ideally suited for numerous applications as durable IR coatings, durable visible AR coatings, iDLC, high laser damage coatings, ophthalmics, electrochromics and solar absorbers. Also works very well for oxides, nitrides, carbides or pure metals. Our patented optical Closed Field Magnetron (CFM) sputtering technology is one of the most advanced optical coating technologies yet devised. It takes optical coating into a new era of precision coatings with near-bulk film densification and allows productivity from pilot to full production scalability. CFM is of “cold” deposition standards. It now allows single or multilayered film coatings onto sensitive polymer substrates or plastics which other deposition technologies would consider prohibitive. See www.applied-multilayers.com for coater and application data.
These are highly reliable tools, with a small footprint.
Ion Etch (DRIE). The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch and deposition bottom electrodes available for easy installation into the chamber unit. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing of the BENCHMARK 800-III® unsurpassed by any other plasma product in the market. In the research and development of plasma processing, there has always been a great need for a highly versatile and reliable tool. With the ever-changing requirements in plasma research, the system selected must offer the widest range of process parameters and a high degree of repeatability for process verification. It also must be easily modified for new process requirements.
The PLD System offers a variety of built-in and custom features such as: optimized 3-target carousel, substrate heater, pressure adjustment, and is designed for easy integration with a variety of other deposition techniques and sources such as sputtering, thermal evaporation, CVD, E-beam, and more. The process chamber is a customizable 12” diameter spherical stainless steel chamber. It has multiple (six 8” and 18” CF and one 6” CF) flange ports for mounting optical windows and other accessories. Base pressure compatibility better than 5E-2 Torr. The system is capable of reaching ultra high vacuum(UHV) levels greater than 5E-7 Torr with a cryopump addition. Maximum baking temperature of 300°C when fitted with copper baskets. It is electro-polished inside and out for enhanced mechanical properties and corrosion protection.
The model BWS-EBE Electron Beam PVD System offers a variety of built-in and custom features such as an optimized chamber design, wafer temperature control, gas flow ratios, process pressure adjustment, and is designed for easy integration with a variety of other deposition techniques and sources such as Pulsed Laser Deposition, E-beam, and more. The process chamber is a custom, cylindrical stainless steel chamber with over 10 various sized flange ports for optical windows, mounting accessories, and internal access. A crystal monitor is used for deposition thickness measurement. The pneumatic shutter is for substrate shielding during running processes. The Evaporation Source is a rotatable multi-pocket source rated for 10kW of power with a water-cooled electron beam gun and a 600W max filament power resistance. The Gas Flow System has full-scale flow ranges available from 10 sccm up to 1000 sccm and repeatable flow control to as low as 0.2 sccm. Gas shut-off valves are used for over-pressure safety. It has 1% F.S. accuracy and 1% of reading for most flow ranges. Digital flow meters with fine electronic control are available.
traditional system design include higher pumping conductance, water trapping capability and support for ion source applications. The improvements to the pumping assembly efficiency affords users 50% higher throughput then competing systems. State-of-the-art control technology and superior integration of sub-assemblies makes the cost of buy in and ownership very low. The CA-50 can handle the toughest processes and can meet the requirements of your current qualified processes. The CA-50 will handle wafers and substrates up to 8.0” diameter in a tri-dome configuration that is easy to load and unload.
The new chamber design will accommodate many tooling configurations and a variety of deposi- tion sources and combinations of sources. Control is achieved via a touch screen PC/PLC. The vacuum Chamber is water-cooled stainless steel that measures 23” D × 20” W × 26” H with a volume of 190L or 6.6ft3. The inlet flange is NW 80 with a source distance of 18”. Tooling options are lift-off dome capacity (examples, 5 × 150mm/ 7 × 125mm/ 9× 100mm/19×75mm). Planetary dome capacity examples are 9 × 150mm/12 ×125mm/ 18 x 100mm/ 36 × 75mm. Pumping options are diffusion (1550 liters/sec), turbomolecular (1450 liters/sec) and cryo 1500 (liters/ sec). Systems control options are manual with Autotech sequencer or PLC with Siemens touch screen. Vapor source options are electron beam gun (4 × 25cc/4 × 40cc/ 6 × 15cc/ 6 × 25cc), resistance source or swing source. Power requirement options are domestic (120VAC/60Hz, 208VAC/60Hz) or International (220VAC/50Hz). Ultimate vacuum levels are system 10-9 Torr and chamber 10-8 Torr.
stage fixture without disturbing the process vacuum) and completing the product line with an etch module, easily configured with a single wafer load lock or a robotic front end with vacuum cassette load locks (allowing cluster etch modules configuration). 4Wave’s ion beam etch system family includes a wide variety of RF ion sources, substrate stages and fixtures – tailored to best meet specific application needs. Our etch systems are configured with SIMS end point detection, integrated for sensitive end point detection at a variety of etch angles.
control, interface control, alloy composition control and materials flexibility in a small, cost-effective package.
The process environment supports the sequential deposition of six different materials and/or the simultaneous deposition of two or three different materials, with each material deposition rate independently controlled from the other one or two material rates. Load lock substrate fixturing, with substrate heating capability, supports the deposition of crystalline material.
Several options are available including low energy ion assist, high energy ion etching, heated substrate stage and magnetically biased substrate stages. Typical applications include spin valves/AMR/GMR/TMR, magnetic tunnel junctions, dielectric interference coatings, rugate filters, high-K materials, shaped memory alloys, optoelectronic materials, vanadium oxide and uncooled IR detectors. Available system features include closed-loop control of film properties, substrate plasma precleaning, oxidation, nitridation, water cooling, tilting, rotating, shuttering and robotic loading via load lock with up to 25 wafers.
Various fixturing arrangements offer increased uniformity and flip-over tooling is available for coating both sides of a substrate. The Integrity has been supplied in chamber sizes from 20 to 80 inches for applications as diverse as ophthalmic coating, laser bar facet coating, precision optics and optical filters. The Explorer series offers small-scale manufacture and R&D application with various configurations in a small footprint. A single electron-beam gun can be configured with IAD and sputtering cathodes for development applications. Denton Vacuum is celebrating well over 40 years as a leading supplier of thin-film coating equipment with an established range of systems offering flexibility and performance to meet the most demanding applications. Denton offers a unique combination of hardware configuration, automation and controls, and process assistance to create powerful depositions systems for industry and research.
with over 80 units installed worldwide. Cathodes from 2 to 4 inches are standard. Systems can easily be upgraded in the field to add additional cathodes. DC and RF power are offered, along with a selection of loadlocks for single or multiple substrate transfer. Denton offers both confocal and perpendicular cathode arrangements. This allows the user to select between enhanced uniformity on single samples or for lift-off applications. The Discovery has been supplied in chamber sizes from 18 to 35 inches. The Discovery 550 is available with increased clean-room compatibility. The Explorer series offers small-scale manufacture and R&D application with various configurations in a small footprint. A choice of up to three cathodes can be configured.
leads, which are integral components of pacemakers and defibrillators. An aging world population is driving double digit growth in the global CRM market and CRM product makers increasingly require the ability to reliably coat complex 3-D components with thin films that meet demanding criteria for biocompatibility, wear, electrical impedance, uniformity and other properties. Denton provides robust, production-scale systems that answer medical implant manufacturers’ unique needs. The Altor™ platform takes its name from a Latin term for “protector.” satisfies the diverse set of needs. The Altor series sputtering platform supports a wide range of medical implant applications requiring protective, biocompatible coatings for products like cardiac leads, cardiac stents, and orthopedic implants. As a production platform, the Altor™ series includes custom-engineered material handling systems that enhance factory productivity and film uniformity. Denton’s standard ProcessPro® control software supports manufacturing operations with detailed production tracking, in-depth system diagnostics, and network access for remote monitoring, control and service.
Systems are offered in sizes ranging from 30” to 120” and are available with a wide variety of process options for evaporation and sputtering. Choose from single rotation, planetary mechanism or custom-engineered fixturing for optimal uniformity and throughput. Dynavac’s Spectrum-Pro Optical Monitoring System combines the strengths of a precision optical photometer with a quartz crystal monitor to provide a new level in precision end-point detection of optical coating. Dynavac Optical Coating Systems are part of a complete platform of resources to support you from initial design through everyday operation. Process development support is available through our team of process engineers and our dynamic customer support team ensures that your investment is protected throughout the life of your equipment.
types of deposition methods to produce highly efficient, uniform thin films for even the most complex applications. The Odyssey’s base system comes well equipped with a 450mm vacuum chamber, pumping system, and Dynavac’s LabVIEW-based supervisory control system, all housed in a portable, modular cabinet. Choose just the right process equipment from a comprehensive package of deposition sources, tooling configurations, and thickness control methods. The Odyssey’s flexible design platform also makes re-tooling possible to support future process applications, maximizing your investment for years to come. The Dynavac Odyssey 450 is part of Dynavac’s complete platform of resources to support you from initial design through everyday operation.
Vacuum chambers are modular in design to provide flexibility in the manufacturing process and accommodate future upgrades. Equipment is designed, built, and tested in Dynavac’s U.S. facility. Key features include sputtering, evaporation, or PECVD processes, a wide range of pre and post-deposition processes, load locks and automated transport systems, robotic handling of substrates for loading and unloading, integrated control systems for complete automation of production sequence and global installation and startup support services.
efficiency electron beam metallization system for lift-off compound semiconductor applications. The UEFC-5700 is the first Temescal system to incorporate the Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity while delivering up to 40% increases in material collection efficiency, resulting in significant cost savings on process materials like gold and platinum compared to traditional box coaters. The Temescal UEFC-5700 is designed for compound semiconductor production environments that use lift-off electron beam evaporation processes. The UEFC-5700 has a unique conical shaped vacuum chamber that reduces volume and surface area, significantly reducing pump-down time. The system also features a patent-pending High-Uniformity Lift-off Assembly (HULA) design that uses a dual-axis motion to optimize collection efficiency. With its unique conical shaped load-locked chamber and 44,000 liters/ second of installed cryogenic pumping capacity, the UEFC-5700 reaches process pressures significantly faster than most conventional box coaters. Systems have reached 5E-07 Torr in under 10 minutes, improving production cycle times and the number of batches that can be run per shift or day.
The system incorporates Temescal’s Auratus deposition process enhancement methodology. Auratus is a patent-pending proprietary optimization methodology for lift-off electron beam evaporative coating that incorporates patent pending technology to achieve unprecedented levels of uniformity, precision, and collection efficiency.
automotive components of R&D. Combinations of many deposition technologies (e.g. arc evaporation, (dual) magnetron sputtering or plasma enhanced chemical vapor deposition) are available in one machine. Upgrading with new technologies at a later stage is always possible. Job coaters praise the machine for its short cycle times and new tool coating technology CARC+ that is characterized by highly efficient target use and extremely smooth coatings and R&D departments use this machine because several technologies can be combined and upgraded. Manufacturers of tools and components like the fact that the system is robust and has a small footprint. The machine comes with a full range of excellent coatings needed for different applications, such as tribological or tool coatings.
dies and broaches are some examples of actual use in the market. Reproducibility of coating properties is guaranteed at lowest cost of ownership. Manufacturers and job coaters use this machine 24 hours a day, 7 days a week. Hauzer provides more than 30 years of expertise in PVD (Physical Vapor Deposition) and PECVD (Plasma Enhanced Chemical Vapor Deposition) coating technologies. In this machine all available PVD technologies, such as arc evaporation and (dual) magnetron sputtering can be combined with PECVD technology. Diamond Like Carbon (DLC) coatings are often deposited on automotive components in this machine. Upgrades of technologies are guaranteed possible, to give flexibility for future business.
together in one Metalliner® becomes possible. The modular design of the machine makes it possible to add process chambers for increased productivity. Furthermore, the inline solution is characterized by high uptime and low cost of ownership. Hauzer provides more than 30 years of expertise in PVD (Physical Vapor Deposition) and PECVD (Plasma Enhanced Chemical Vapor Deposition) coating technologies. At this moment the inline machine is developed for metallization of decorative products and the plasma coatings are combined with lacquer as a replacement of electroplating, but coatings for other applications are possible as well. Upgrades of coating technologies are guaranteed possible, to give flexibility for future business.
We offer new Auto306 systems for sample preparation and R&D applications with a range of chambers and process accessories including 3kW electron beam with deposition control options. Has your Auto306’s original vacuum controller failed or requires spares or support? We can provide the answer in the form of our PLC upgrade kit which brings the Auto306 control circuit up to ‘as new’ specification complete with new Touch screen and Active vacuum gauges which should keep your Auto306 running for another lifetime. See also our new accessories and full range of spares.
RF and/or DC sputter sources and 3kW or 6kW electron beam and ion gun sources. Sputter systems can be configured for sputter up or sputter down. A range of work holders covers rotation through heating, biasing and options for z-shifting for use with HHV’s load lock and transfer systems. Systems can be specified with PLC vacuum control and manual process accessories through deposition rate controllers to full computer process control according to wishes and budgets.
The fully computer controlled high and mid temperature systems allow single and multilayer coatings of various materials including TiN, TiC, TiBN, TiCN, Al2 O3 and TiAlN. The Systems are available in various sizes to suit the users capacity needs.
are non-conductive and chemically inert. Primary applications include engine and machine components. Other applications are decorative coatings for fashion and luxury goods. Ionbond has developed a proprietary coating removal process which allows de-coating without damaging the substrate.
CVA (Chemical Vapour Aluminizing) is a variant of CVD technology, where aluminum is used to diffuse into the substrate to form intermetallic compounds, e.g. nickel aluminides. Most of the applications of CVA technology are aimed at production of bond coats on the parts of the hot section of gas turbines and jet engines. This technology offers an environmentally friendly alternative to conventional methods to produce bond coats. In addition, CVA is one of the very few ways to deposit the coating onto the inner surfaces of the airfoils.
12” (300mm) and contains three process zones. Deposition technologies include magnetron sputtering, magnetically confined Plasma Enhanced Chemical Vapor Deposition (PECVD) and CVD. Compatible substrates include polymer webs (PET, PEN, PI, BOPP, others), metal webs, textiles and even flexible glass webs. All of our web systems include precise tension and speed control, as well as thermal management using cooled and/or heated drums and radiant heating. We also offer advanced options such as web paths without front side contact, interleave (mask) removal and application in vacuum, and gas-isolated coating zones allowing multiple reactive sputtering zones with excellent independent process control. Production systems to 55” (1.4m) width are also available. To learn more, visi www.intelli-vation.com .
and ease of operation, the NCI-LL systems is an ideal choice for pilot projects and research. The NCI-LL system incorporates a clamshell style chamber, which gives you easy access to all parts of the chamber. It can be designed for a number of different substrate holders such as: flat plate planetary, flip fixture planetary, or a planetary dome. Substrate revolution and rotation ensures an even coating. Inside the NCI-LL, you’ll also find quartz halogen lamp heaters and fully automated shutters for total process control.
: flat plate planetary, planetary domes, flip fixtures, and “lift off.” The system can be configured with a variety of thin film deposition sources such as electron beam guns, magnetron sputter cathodes, and thermal sources. Turn key process support from Intlvac’s in house experts can develop and tailor your deposition process, from diamond-like carbon (DLC) coatings, to AR coatings. The load-lock on the NCII-LL allows for fully automatic transfer of the substrate to the substrate holder in the chamber.
multiple sputter targets, and reactive gas handling to perform inert or reactive etching and ion beam deposition. Key to the systems operation is a direct water-cooled substrate stage that provides rotation and tilt during deposition and etching. Ion beam sputtering can deposit insulators and conductors during the same run.
Positioned in the load lock above the main chamber, the carousel is separated by an isolation gate valve. The automated cycle pumps down the load lock and opens the isolation gate valve, thereby exposing the rotating samples to the gun. Upon completion of the evaporation process, the load lock is vented while the main chamber remains at UHV. The unit also has automated pumping and venting, mimic panel displaying system status, atmosphere to UHV in 30 minutes, a motorized multi-sample carousel, slide out bottom flange for easy maintenance, ± 0.25% uniformity over 3-inch diameter samples, and a compact self-enclosed frame.
it enough capacity to load glass panel substrates up to Gen 3.5. The new 844i system is also now coupled with KDF’s PAT (pallet assist tool). The KDF designed pallet manipulator allows operators to safely handle pallet payloads of up to 150 lb., and its horizontal and vertical movements allow for easy substrate loading as well. The standard tool is integrated and interlocked for both operator and system safety. The new 844i has also been redesigned specifically for thru the wall clean room compatibility as well as having a completely shielded internal chamber area allowing for faster chamber cleaning and less clean room contamination. A user-friendly mobile operator interface cart allows for complete control and system accessibility from any point around the tool. The tool features four 30-inch cathodes that can be chosen from the complete KDF family of in house designed cathodes including the KDF Inset™ and patented full-face erosion LMM™ cathodes. The tool features two processing pallets allowing for instantaneous changes of wafer sizes and the ability to process both the front and backside of the wafer.
and shapes. This type of sputter down application increases and simplifies the uses for the tool since special substrate fixturing is generally not required. Uniformity and utilization are not compromised as KDF maintains the proper pallet to cathode ratio as in all our systems. The base tool is configured with a high vacuum cryo pumped load lock along with heat, allowing for pre heating and faster cycle times. This load lock arrangement coupled along with the four 24” cathodes allows for an array of diversified processes and higher throughput offered in a single tool. The 974i is also available with a host of options to make it even more production specific, available options include but not limited to an integrated process RGA, back side gas cooling in RF etch mode, ERPP™ KDF’s planetary pallet operation, upstream and down stream gas control, as well as pulsed DC bias. All KDF systems utilize the latest in communications control and protocol this along with. KDF’s software Recipe Manager allows for the user to have complete access and control of all the hardware features associated with the tool. The 974i is compatible with and utilizes KDF’s full compliment of 744 specialty cathodes, including the Inset Cathode™ , Magterial Cathode™ , Mark II Cathode™ along with standard planar cathodes.
has gained recognition of being a superior tool supplier. With a 12 x 12 inch pallet area this tool allows simple orientation to substrates with next to no fixturing or holders, this makes this tool extremely simple for odd or irregular shaped substrates. The 943i is a perfect fit for R&D or full production needs, with extensive recipe manager and overall tool configuration possibilities this system can perform any task. The tool is standard equipped for both up and down stream process gas controls, it is plug and play for additional gas’s in the field, or just changing gas ranges. KDF software platform is like no other with an OEM configuration page that builds the system as per the customers needs. The standard software package allows the customer such attributes of choosing KW voltage or current control for DC operation, or by letting the user choose kW, kV or Load Power control for RF operation. KDF maintenance screens allow total automation in Target burn in, while keeping complete track of all KW hours. To take full advantage of suppliers hardware KDF incorporates R3232, RS485 and Ethernet IP to allow full interfaces to products and being able to view and change parameters interactively. KDF’s large Cathode selection allows this tool to be extremely versatile, KDF also offers our exclusive ix Series of cathodes with measures 5 × 17 inches, allowing for more improved uniformities without shields or apertures. KDF’s Inset Cathodes™ , Planer Mag, Planer Diodes, Magterial™ , and LMM™ [full face erosion] cathodes are all offered in this size as well. The ERRP™ or planetary pallet offers uniformities better then 1% and 0.5% run to run.
the LAS-150 load lock assembly. The innovative rotary transfer arm eliminates wasted cleanroom space by removing the traditional linear transfer device. KJLC’s newly designed eKLipse software control package allows user friendly recipe creation along with a reliable, uninterruptible processing module that allows process completion, regardless of the state of the computer user interface. The newly redesigned PVD 75 is the first system to earn the PRO Line designation. Look for future additions to this line of systems and the all new LAB Line dedicated technique systems within the next few months. For more information on this intuitive, unique, and reliable system, please visit us at www.lesker.com/PVD75.
species. During a typical ALD process, at least two gas-phase precursors are pulsed sequentially into a reaction space where a substrate is located. A complete sequence (or cycle) is made up of a series of pulse and purge steps. Pulse steps are separated by purge steps to remove any remaining precursor and/or volatile reaction by-products from the reaction space between pulses. Thus, a complete cycle requires a minimum of four steps. The Kurt J. Lesker Company® manufactures two ALD systems: the ALD150LE and the ALD150LX. Each of the ALD systems that we manufacture has a variety of features and options suitable to tailor a platform for your particular process needs. These options include glove boxes, various reactant delivery options, plasma source, and pumping options.
and production applications and feature magnetron sputtering deposition techniques. They are purpose-built for hollow cathode sputtering sources, yet based on existing, proven KJLC system platforms. Pumping options include: wet or dry rough pumping, diffusion, or turbo pump high vacuum. Simple PLC-based touch screen system control and full computer controlled automation are available. Contact us for more information.
organic materials, and when loading/unloading sources it is usually desirable to control the surrounding environment through a glove box. The Kurt J. Lesker Company manufactures three standard system platforms for organic material deposition, Mini-SPECTROS, SPECTROS, and Super-SPECTROS. Each of the SPECTROS® systems has a variety of features and options suitable to tailor it for your particular process needs. These options include: glove boxes; various deposition sources; mask transfer and storage; wedge tool; pellet feeder; substrate handling options such as heating and cooling; and pumping options. SPECTROS® Systems are fully computer controlled, ensuring precise repeatable results. For more information on SPECTROS® systems please visit us at www.lesker.com.
are a common feature of all the KS sputtering systems. The models are the KS Horizontal (sputter down) series, KS 500 H Dual chamber, KS Vertical series and KS confocal series. Features and options are vertical or horizontal design, DC/RF high deposition rate magnetron cathodes, automatic shutters, substrate RF or DC bias, turbomolecular or cryogenic pumping system, new generation control and software management uses a PC with touch screen, and a process gas lines with MFC. Typical applications include reactive and multi-cathode co-sputtering processes, single or multi-layers deposition, metallic and dielectric coatings for microelectronics and photonics, optical, tribological, protective and decorative coatings, magnetic films, sensors, actuators, EM shields and anti-static coatings for PC and telephones, aerospace, automotive, defense, energy and environment (catalysis, solar and fuel cells), magnetic films, and safety and health.
flanges to install different sensors and diagnostics, top plate with electrode and mechanical rotary feed through for distance regulation and base plate with connection flange for high vacuum gate valve. The substrates holder is designed to hold substrates of different sizes till Ø 8 inches. The process chamber is in SS 316 L. The base electrode is heated up to 700 C°, thermocouple controlled, with a peripheral pumping port to optimise the gas distribution on the substrates. The upper electrode is RF polarized, water cooled, with a gas shower. The CVD system is equipped with turbomolecular pump and PC for pumping cycles. The RF power generator is a solid-state unit with reading of forward and reflecting power. Automatic Matching Network located near the electrode. The System and Process Control Unit is PLC-PC based and allows full automation of the PECVD unit. The Gas Process control unit consist of flow monitors in the range 0-100, 0-50 or 0-20 sccm, PC controlled, presetting of the operating flow. The RF power generator is a solid-state unit with reading of forward and reflecting power. The Automatic Matching Network is located near the electrode.
the most popular (B)OPP and PET line sizes. The META-M 2900 key characteristics are best in class productivity due to high rate aluminum evaporator and improvement of barrier properties (OTR and WVTR) by advanced pulsed DC Plasma-pretreatment. Substrate type and dimensions are: typical substrates PET 8 - 25 µm, BOPP 10 to 50 µm, and CPP 13 to 60 µm. Other materials are available upon request. The maximum film width is 2920 mm, maximum coating width of 2900 mm and a maximum roll diameter 1250 mm, on 6” core.
the range from 12 to 100 nm (PET). Key components are evaporation sources for the coating of High-Refractive-Index (HRI) materials and metals onto the holographic film. The newly developed high-rate zinc-sulphide (ZnS) evaporator allows a uniform highrate coating of a HRI layer. A uniform coating thickness of 50 nm at a coating speed of 2.5 m/sec can be easily achieved. Most accurate process controls are guaranteed due to the use of several direct heated and individually controlled evaporation crucibles.
The coating of metals, such as aluminum or copper onto the film, is managed by boat-type evaporators with an automatic metal-wire-feeding function. The ISS, In-Situ-Sensor, allows ultra-fast coating-thickness control. An optional flexo-printtype system for the printing of oil prior to the coating allows a precise segmentation of the film. Winding system and vacuum pump package has been adopted from the mass-production proven CAP-M 650 system for the manufacturing of electrical film-capacitors.
Ultimate precision in layer growth control is facilitated by an optical monitoring system (option) for in-situ on-substrate measurements. HELIOS can be used for a wide range of optical coating applications, including edge, bandpass, color and UV/IR cut filters as well as beam splitters and laser mirrors. Besides optical coatings, other dielectric coatings (oxides, nitrides) as well as metallic coatings can be easily produced, depending on the source configuration of the HELIOS. Applications include: precision optics; Optoelectronics; Sensors; and Telecom.
The Leybold Optics SYRUSpro CFM is an innovative and cost-effective thin film coating solution for high performance optical filters, tailored to fulfill current and future requirements in digital optics. The APSpro ensures shift-free UV/IR cut filters (top), and excellent filter performance with high transmission and low ripple (bottom). Outstanding uniformity and reproducibility is demonstrated by the data of five substrate positions distributed over the calotte radius, and 6 consecutive production runs. Note: Measurement without backside AR coating. Today’s filters meet a growing range of performance parameters and must be produced within ever-shorter deadlines. This is why excellent quality is the basis for modern digital optics production. A cost-effective thin film deposition system must also deliver increased productivity through consistently high throughput and high yields. Higher product requirements combined with lower cost of ownership demands all add up to an increasingly challenging business environment for the filter manufacturer. Innovative production technology from Leybold Optics provides mass production solutions with outstanding performance, productivity and reliability.
Leybold Optics USA Cary, NC www.leyboldoptics.com Tel: 1-919-657-7100 E-mail: sales.americas@leyboldoptics.com
RADAK furnaces use a replaceable crucible for the evaporant that can be easily accessed through a twist lock cover. Standard crucibles are made from high purity alumina, quartz, or pyrolytic boron nitride with specialized crucibles and liners available for challenging materials. In addition, Luxel has developed two new specialty crucibles: the Organic-Evap™ for optimized evaporation of organics and Al-Evap™ enabling, for the first time, evaporating aluminum with a RADAK furnace. Both of these new crucibles are backwards-compatible with previously manufactured RADAK furnaces. Mount coupling, power and thermocouple terminals are built into the base. The unique design of RADAK furnaces protects the furnace interior from the vaporized material. A basic feature of the RADAK furnace is the attainment of high vapor flux at low vapor temperatures. This results in minimum thermal decomposition of the evaporant. Four standard models are currently available: RADAK I (1 cc), RADAK II (10 cc), RADAK III (100 cc), and RADAK IV (2,000 cc). All RADAKs are available in low temp (< 600 °C) with the RADAK I and II available in high-temp to 1500°C and the RADAK III to 1200°C. Models can be readily customized for: CIGS photovoltaic depositions; OLED depositions; and aluminum depositions. Luxel’s Power Controller line has been completely revamped, incorporating many new features. Three power controller models are now available, model II, II+, and IIP. All models feature Modbus communications for system integration, programming, parameter control, and output level monitoring via PC-compatible software. The power controllers are furnished in 8.5 × 5.25 ×16.7-inch half-rack cabinets.
for many research groups who have decided to take the first steps in exploring vacuum coating technology. Choosing from a comprehensive set of optional upgrades the MB-EcoVap system can be equipped to meet even more advanced requirements from experienced users. Built according to MBRAUN’s high quality standards the bell jar setup distinguishes itself from other compact solutions with an automatic, electro-pneumatic chamber lifting mechanism. The unique setup combines perfect accessibility of the sources with a space-saving design. In integral design of the MB-EcoVap is the embedded shielding that help prevent the chamber walls to become coated during the vacuum process, thus allowing an efficient cleaning of the interior chamber. Originally designed to be integrated into an MBRAUN glovebox, the MB-EcoVap is available as a standalone unit as well, so that applications which do not require inert conditions can be served. All commonly available sources for RF and DC sputtering, thermal resistance evaporation, organic material coatings and E-Beam processes have been integrated and are successfully used from MBRAUN’s growing global customer base. Other models in the MB-EVAP series include the MB-ProVap and MB-OptiVap that offer additional features. The MB-EcoVap is for substrates up to 70 x 70 mm or 100 mm wafers in a compact, space-saving design. There is an automatic chamber lifting mechanism and a shielded view port for visual process monitoring. Recipe are programmable via PLC control.
The chamber has internal welds and is polished to minimize outgassing. Numerous ports are provided for deposition components, with emphasis on below-horizontal alignment to accommodate instruments that use crucibles to contain evaporant, such as effusion cells. The chamber can optionally be equipped with removable cross-contamination shielding in applications where high rates of deposition are required. The system uses turbodrag pumps with dry backing pumps as standard, enabling pressures in the low 10-9 or 10-10 Torr to be achieved (after bakeout). An alternative pumping system can be incorporated on request. The Nanosys500 is fitted with a nanoparticle source NanoGen50 that allows controlled nanoparticle deposition onto the sample. Nanoparticles can be generated from any metal as well as from many compound materials (oxides, nitrides, carbides, etc.) and alloys. The size of the particles is highly controlled with a mean between ~0.5nm and 20nm with a narrow size distribution of ±15%. E-beam evaporators are installed for thin film deposition of refractory metals or high-temperature ceramics. These systems feature integral flux monitoring for all pockets, independent high-voltage lines, efficient structural cooling and co-deposition of up to four materials.
of sputtering in two, three or four target positions, DC magnetron, RF magnetron and RF diode sputtering mode capabilities at each target position, an RF etch platform which can also function for substrate cooling. Pre-heating of substrates via a quartz radiant heater array is available in the load lock chamber to aid in the removal of substrate water vapor and volatile contaminants. The unique design of the dual level load lock functions to permit the simultaneous processing of two nominal 12” × 12” pallets (one pallet can be undergoing process in the main process chamber, while a second pallet is being pumped down in the load lock). Single, and bi-directional substrate scanning modes are featured for the utmost process control under the control of a new state of the art motor/speed control system and optical encoder for precise positioning. Cathodes choices available to cover every conceivable sputtering application consist of MRC type DC magnetron w/ clamp on target designs, RF/DC planar magnetron, RF magnetron Model II and RF diode. A modern RF automatic matching network provides excellent, stable RF tuning capabilities for RF sputtering and RF etching. Advanced Energy solid-state RF power supplies are available in 1250 and 3000 watts. The MAT-VAC design employs vacuum relays to switch between RF and DC modes and cathode selection.
available in 
multi pocket 2cc or fixed pocket from 2cc to 15cc. Cannot decide on fixed or multi-pocket, not a problem. The modular design allows the user to upgrade without replacing the source. The same unique design also applies to our large sources. You can choose from standard Fixed pocket, 4 pocket and 6 pocket versions or request a special version to meet your specific needs. All sources are modular so you can always update to a different configuration at any time. Standard large sources are available with crucible volumes from 7cc to 400cc. All MeiVac e-Vap sources use the latest magnetic and emitter designs. MeiVac provides the ultimate performance with economical pricing and fast delivery. Most common sizes are in stock. We also offer the latest power supplies and controls. Our new line of high voltage power supplies and controllers offer modern interfaces and unrivaled performance. Power supplies and controls are also available with short lead times with many items available from stock. For components or complete packages contact our technical sales staff.
of processing up to 4 each 200 mm wafers. Systems can be customized to address customer specifications for wafer sizes, load sizes, alternate materials and/or specific processes. RF bias is standard for stress reduction, improved uniformity and edge coverage. Helium backside cooling of wafers is standard, allowing higher deposition rates. Process characterization/optimization is also offered. Hardware upgrades and/or retrofits associated with wafer sizes, pumping, deposition power sources, control systems etc. are routinely offered to extend tool lifetimes. Recent process enhancements on the 2480 deliver uniformities for certain materials of <1% sigma/mean.
employing helium backside wafer cooling to increase throughput, these tools can handle wafers up to 200 mm. Process chamber configurations are tailored to customer requirements. RF bias for stress reduction, improved uniformity and edge coverage is standard. Process optimization and characterization of alternate materials maximize the flexibility and life of this tool in an ever-changing technology. Hardware upgrades and/or retrofits associated with wafer sizes, pumping, deposition power sources, control systems, etc. are routinely offered to further extend tool lifetimes. Recent process enhancements on the 602 deliver uniformities for certain materials of <1% sigma/mean.
(incl. steered arc, magnetron sputter, HIPIMS, electron beam/thermal evaporation and plasma assisted CVD) in combination with DC, pulsed DC, AC & RF power. These systems allow the widest range of film architectures, including monolithic, multi-layer, nano-layer and nano-composites, at leading throughput levels. Coating types include: Binary metal nitride, carbide & oxide (e.g., TiN, CrN, ZrN); Ternary & Quaternary metal & alloy nitride (e.g., AlTiN, AlCrN, TiAlCN, ZrCN); Grain refined & high temperature oxidation resistant films (e.g., AlTiN-TiN, TiAlN-CrN, TiAlCrYN); Nano-composite structured coatings (e.g., AlCrSiCN, AlTiSiN); Low friction coefficient Diamond-Like Carbon (DLC) films and dry lubricant systems (MoS2 , etc); Thick multi-layered & gradient films; Customer specified /proprietary coating compositions & architectures.
delivering greater efficiency and productivity. Mustang’s revolutionary roll-to-roll vacuum deposition systems deposit uniform thin-film coatings onto a rolling substrate as it passes through the vacuum chamber. Available for a wide range of industries, Mustang’s Orion Series is making a difference. The Orion has been a stellar player in solar/ photovoltaics, utilized to greatly improve the solar cell manufacturing process. Our technologies are designed to optimize your manufacturing process with the results you are looking for-- excellent uniformity, shorter production times and minimum waste.
single-chamber, double-door design for increased productivity and versatility, a typical 3.5 minute cycle includes in-chamber pretreatment, sputtering and topcoat. The result is an unsurpassed, highly uniform, high quality coating. Featuring High Power Processes, High Power PVD Magnetron Sputtering, up to six Mustang patented 6” × 54” cathodes can be configured with a range of power configurations to provide the optimal platform for small batch fast cycle sputtering.
It’s fast, flexible, easy to use, and available in multiple languages. The Colt offers network compatibility, onboard diagnostics, and a multi-user system interface that is simple to learn and operate. Our optimal system layout provides a robust, high-throughput, easy to maintain, compact solution.
vacuum. The system also allows the use of each chamber independently with automatic loading and unloading of substrates to each chamber directly. Base pressure typically is 5 10-7 Torr. It is PC controlled, recipe driven, fully safety interlocked system with small (46”D × 44”W) footprint.
are ideal for high-resolution patterning and deep trench etching because of their unique capability of substrate cooling. These systems are offered as tabletop or stand alone units with optional auto load/unload capability, and tilted and rotated platens.
system is fully automated includes up to 10kV source power supply, user programmable sweep control, individual substrate and source shutters, thickness monitor, auto source pocket indexer, and rotating substrate holder. The heated or cooled or tilted substrate holders, RF or DC magnetron sputtering sources, thermal evaporation sources, and auto load/unload capability are available as options.
including the vacuum system that is entirely made up of Oerlikon Leybold Vacuum pumps and components. OLV can configure these systems with whatever pumping system you require including diffusion, turbo molecular or cryopump. Whether it’s RF/DC sputtering, electron-beam deposition, thermal resistance evaporation, ion-beam assisted deposition or any combination thereof, OLV can design a system for your particular needs. We also offer a wide variety of substrate holders and accessories.
The systems are scalable from R&D to batch production in one tool.
The Ion Beam range offers functionality in multiple modes: ion beam etching (IBE), reactive ion beam etching (RIBE), reactive ion beam deposition (RIBD), chemically assisted ion beam etching (CAIBE), ion beam sputter deposition (IBSD), ion assisted sputter deposition (IASD) and ion source. Grids are designed to suit specific applications: high uniformity, high rate, & low energy. Specific deposition grid sets to suit multiple targets, offer superior utilization of target material. A full range of etch source options up to 35cm. Dual beam configurations (etch plus deposition source) offer the possibility to add capping layer immediately after etch, without exposing the process chamber or wafer to atmosphere
Increased deposition rates by using etch source as a plasma radical source (IASD). Typical applications include IR detectors, CdHgTe (CMT) etch, VOx deposition and etch, metal contact and track etch, diffraction gratings, SiO2 ‘blazed’ etch, spintronics and MRAM, AR and HR coatings for laser bars, telecom filters, III-V photonics etching, and thin film magnetic hard disk heads (TFMH).
samples (1” and 2”) and the Omicron standard sample plates. The carefully designed chamber with up to 12 effusion cells shows excellent thickness uniformity for all substrate sizes. The large effusion cell capacity of to 130 cm3 for layer growth significantly increases the uptime of the system. The fast and reliable sample transfer together with the excellent performance results in a low cost of ownership. The optional available easy & intuitive to operate growth control software and the possibility to add standard Omicron analysis equipment makes this a unique MBE system for researchers.
commonly-used silane (SiH4 .) The complete TEOS PECVD system enables high quality, conformal deposition of SiO2 for photonics, dielectric layers and other structures together with control of film stress, deposition directionality and degree of step coverage by controlling oxygen radicals. The TEOS delivery module offers an integrated purpose-designed solution with optimized heated delivery lines to ensure efficient, high-uniformity SiO2 PECVD processes and an easy source access and changeover. There is an optional glove box that can be fitted onto the module for maximum safety and the module can be connected into a clean-room extraction system if required.
n with less down time and more profit; the industry’s best uniformity with tighter process control, the widest widths with more application possibilities and engineering strength with designs to precisely meet your needs. Like all BroadBeams, they employ a series of filament and grid modules to create a continuous shower of electrons across the entire product width. Each BroadBeam is configured to match the customer’s needs for product width, dosage level, accelerating voltage and product handling. BroadBeams are self shielded. All of the shielding interlock devices and sensors required for safe operation are included with the machine. BroadBeams are offered as complete, integrated systems. Auxiliary devices matched to the EB system such as exhaust blowers, cooling water control units, motors and drives, and defect marking systems, can also be provided by PCT. The EP series specifications are web width up to 130 inches (3300 mm); voltage of 80 kV to 300 kV; throughput up to 5000 MRFPM (1500 MRMPM), dose uniformity better than ± 8.0%; line speeds up to 2000 FPM (600 MPM); and beam orientation can be horizontal, vertical, or angled.
eliminates the need for CF4 gas that is presently used by PCB manufacturers using plasma etching systems for desmear and etch back processing.
is great for plasma sterilization and surface modification.
surface modification. The PE-25-JW is user friendly and produces consistent results every time.
of applications.
The LAPECVD™ platform can be used to deposit a variety of thin film materials with its parallel-plate plasma deposition system. Hardware includes cassette-to-cassette handling, multi substrate batch processing, dual cassettes, platen heating up to 350°C, upper electrode RF power at 13.56 MHz with optional MFD, Up to 8 channels with digital MFCs, Thermally managed reactor design—up to 175°C for internal walls and shower head, and Endpoint Integrated multifunctional endpoint capability with EndpointWorks. The unique OEI application provides real-time film thickness and rate monitoring.
can be etched from entry level 250µm technology to < 32nm production with ICP high density plasma etch systems. Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher® excels in CD uniformity and linearity well below 5 nm.
include: DLC, SiC, SiN, metals, semiconductors and TCOs, as well as other reactive or nonreactive processes. The compact size and versatility of the system make it ideal for small batches and fast changeovers between materials in R&D and process development. It uses a patented magnetron sputtering process to deposit premium quality coatings with exceptional density and durability. The system uses a highly optimized plasma source to provide excellent in-situ plasma cleaning while also providing in-process ion bombardment. The system incorporates a vacuum load lock for high throughput and low maintenance while maintaining vacuum conditions suitable for precise, high quality deposition.
combinatorial films. With PVD capabilities and facilities at your disposal, deposition needs can be solved in a prompt and economical manner. Pulsed Laser Deposition (PLD) Systems use a laser beam to vaporize a solid target material in order to produce a thin film with exactly the same chemical composition as the original target material. The PLD process enables the deposition of many materials over a wide range of background gas compositions and pressures. PVD Products offers PLD systems for substrates ranging in size from 50 mm up to 200 mm in diameter. We will be glad to assist in the selection of the proper pulsed laser deposition system for your particular application.
meet the highest standards.
options and custom formats. Created and developed by engineering talents at Semicore, a Silicon Valley based manufacturer, this innovative advance extends capabilities while generating high levels of performance. It delivers a range of accurate coatings for a variety of materials and hybrid substrates used by electronic, optical, solar energy, medical, automotive, military, aerospace and related “high-tech” industries. The vacuum chamber is cylindrical 304 stainless steel with a typical 18-or 24-inch diameter, scaled to match the specific application. The innovative design and cathode orientation supports sputter up, sputter down or side sputtering technics. Single or multi substrate load lock. The TriAxis substrate holder can accommodates small samples of various shapes and sizes or a single substrate up to 200 mm in diameter. Substrate holders are available with features, such as, heating, cooling, bias, rotation and adjustable angle tilting. System controls is via PC/PLC based process automation with a graphical user interface including, recipe control, data logging and remote e-support. In-situ monitoring and control is accomplished with quartz crystal monitoring, optical monitoring, residual gas analyzer, reactive sputtering control and other industry proven methods. The ion source provides substrate pre-cleaning assisted deposition, nanometer-scale modification of surfaces. The Tri-Axis® depostion techniques are magnetron sputtering RF, DC, or Pulsed-DC; electron beam evaporation; thermal evaporation; organic evaporation for OLED/ PLED and organic electronics; glancing angle deposition (GLAD) cathodic arc plasma deposition and pulsed laser deposition (PLD).
, it features a Stainless Steel, Water Cooled, Vacuum Chamber with Front Opening Door, a 16” Cryogenic Pump and Water Cooled Baffle, Water Chilled Chamber Walls and a Dry Roughing Pump.
Deposition Equipment and Key Tooling consist of: Multi Pocket Electron Beam Guns, Co-Evaporation, Automatic & Manual Operation, Electron Beam P/S, Programmable Beam Sweep, ION Source Cleaning & IBAD, Rotating/Tilt Substrate Holder, 16kW IR Heater, and 3 Mass/Flow Meters.
Utilities (Variable) are: Electrical 480V/3-Phase/60 Hz/5wire. Demonstrations, Viewing and Capabilities of the SC 3500 as well as a broad range of Custom and Standard Vacuum Deposition Equipment are available at the firms Livermore, CA headquarters.
engineering talents at Semicore Equipment, a Silicon Valley based manufacturer, CAPOS™ provides Sputtering, Evaporation and PVD Deposition resulting in a range of accurate, thin film coatings for a variety of uses. Exceptionally versatile, it incorporates a number of innovative features to extend capabilities for special needs. These include a Stainless Steel Box Chamber scaled to match individual requirements; Cryogenic or Turbomolecular Pumping; Load Lock for manual or automatic transfer; PC/PLC based process control automation plus options; In Situ Monitoring & Control options; heated, cooled or biased Substrate Holders; standard and optional Substrate Fixtures; Ion Source Substrate pre-cleaning assisted deposition.
A variety of uses are projected for electronic, optical, solar/ energy, medical, automotive, aerospace, military and other “high tech” industries.
system is designed to address the technical challenges customers face as they scale power PVD processes up to 300mm wafer size. In a discrete MOSFET power device, current passes through the silicon substrate so electrical contacts are required on both sides of the wafer. Due to the high currents involved, thick aluminum alloy layers are deposited on the frontside of the wafer (typically > 4µm rather than <1µm for mainstream silicon interconnects). However, depositing thick films puts unusually large heat loads on process chamber hardware, potentially resulting in film contamination from outgassing chamber furniture. This contamination can lead to the formation of aluminum whiskers/extrusions in the growing film that can ultimately result in device killer defects. In traditional front-end fab deposition equipment, a common technique to mitigate this issue is to reduce film deposition rates with a corresponding reduction on system productivity. However, the Sigma® fxP design overcomes that challenge without compromising throughput. Sigma® fxP users routinely deposit thick Al layers at rates >1.4 µm/min without any yield destroying whiskers or extrusions. With frontside processing complete, wafers are thinned down to 50µm or less to reduce ‘on-state’ resistance and solder metal layers are deposited on the backside. No supporting carrier substrates are used and the ultra-thin, large area wafer will deform under the influence of uncontrolled film stresses, with miss-handling a potential consequence. The Sigma® fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow.
(Axis IV) target configurations. RF magnetron, RF diode and DC magnetron cathodes are available at each cathode position. Two styles of cathodes are offered: planar and inset, the latter allowing for three distinct target shapes: Axis Sputtering System Chambers; Load-Lock; and Process Chambers. The Axis processes one pallet at a time, but the addition of a two-level load-lock allows for simultaneous loading and unloading of pallets while sputtering and etching takes place in the process chamber. This horizontal sputter system has multipass scanning capability – if a particular cathode cannot deposit enough material on the substrate on one pass as called for in a particular process, the system has the capacity to reverse direction, and continue as often as needed. The cathodes are all equipped with cross contamination shields that prevent adjacent target contamination during sputtering. The RF etch station is standard, and contained inside the process chamber thereby reducing the substrates’ exposure to atmosphere. The etch platform is water-cooled and pneumatically actuated. It operates by lifting the pallet off the pallet carrier for etching. A shutter, placed directly above the pallet, acts as an etch catcher and a ground plane. The RF generator and the DC power supply are housed under the chamber within the system’s frame. A 10kW DC power supply is standard, with an option for 20 kilowatts. For RF magnetron or diode operations, standard power is 1.5kW, with 3kW optional. SCT provides as a standard a PLC control system that includes ladder logic software with required programming for the SCT Axis, written specifically to accommodate customer specifications. The operator/engineer computer interface includes a touch screen display, HMI, and all required software programming. The control system also can perform data logging of all key process variables.
measures 24-inches diameter x 30-inches high (with a usable internal volume of 7.88 cubic feet) and the bell jar chamber and all its components are manufactured from 304L stainless steel with a number 4 electro-polished finish on all inner and outer surfaces. The jar’s true “dual wall” design ensures the vacuum chamber receives 100% uncompromised water-cooling with no risk of leak from damaged cooling channels or tubing lines. Each bell jar system is mounted to a stainless steel “O” ring-sealed base plate that incorporates all necessary pumping ports and feedthroughs required for operation. 4-inches ports with manually operated shutter assemblies provide viewing access. The Smart-Jar Series bell jar features a main, “self-centering” split seal located in the center of the jar that divides the jar in half for more efficient cleaning and foiling. The lower portion of the jar rests on the base plate during operation and can be lifted by an integrated hoist when cleaning and/or maintenance is required. Single or multiple source electron-beam, thermal evaporation, magnetron sputtering and cathartic arc coating sources are available along with a choice of single or multiple cryogenic, turbomolecular or ion sublimation vacuum pumps to achieve high vacuum process environments.
kW system designed for medium to large vacuum coaters of up to and greater than 3 meters. All power supplies are controlled by a touch screen interface that can be tilted for ease of use. The digital power supplies provide multi-mode system operation for continuous (DC), Pulse Mode, Gas Purge and Substrate Pre-clean functions – all available at a touch of the screen. Save regularly used procedures to memory for instant recall. Remote control is via the RS232 protocol. Two options are available, the Dual Gas option provides facility to control and deliver either of two installed gases as pure gas or in any mixed ratios. The Dual Filament option provides a second filament for extended depositions. The power supply detects first filament failure and quickly auto-changes to second filament
maintain and cost-effective to purchase and own. Our systems will always meet these core expectations: becost effective, are simple to maintain, easy to operate and perform repeatable processes every time. We include the highest quality of support, documentation and a comprehensive video training program to minimize any errors in operation and maintenance. TES has most recently completely re-engineered the Perkin-Elmer 4400 Series sputtering systems to meet today’s current technology. Every aspect of operation and functionality has been updated. From the way the systems are manufactured to the workings of individual sub-systems themselves, the Perkin-Elmer sputtering system series has been simplified, upgraded, and redesigned for consistency, reliability, ease of use, and maintenance simplicity. What remains is the proven process flexibility of the 4400 series sputtering tool. The new TES-44 series system is capable of meeting the needs to process both uniquely shaped substrates and large quantities of wafers. Up to 200mm diameter wafers are possible with ±5% uniformity. Combined with a robotic loader, high throughput production can be achieved. For the cost of one larger cluster system, multiple TES-44’s can be purchased. Between the simplicity of design and exceptional uptime, your production line is more likely to stay moving than when relying on a single larger and more complex tool. Our systems are effective solutions to high volume production needs.
of seven inches in diameter primarily designed for R&D applications. The multitude of options available on the VCT system makes it one of the most versatile thin film deposition systems on the market today. To build the most reliable thin film equipment we incorporate GE Fanuc system automation control software and hardware. The system automation package allows the process engineer to develop a complex recipe. Once the recipe has been developed the operator can load the substrates and press start. The system software will run a repeatable process every time. The fast cycle, low volume load lock eliminates the need to vent the process chamber to load substrates thereby reducing the pump down time and reducing contamination of targets and interior chamber surfaces. Typically the VCT-1800 system will be able to automatically transfer the substrates from atmosphere to the process chamber and achieve a base pressure of 5 × 10-7 torr in less than four minutes.
polymer films to Custom-built multi-target sophisticated systems for special applications. We also manufacture Thermal and E-Beam Evaporation systems to suit customers’ needs and specialize in Etching systems with different configurations for corrosive and standard applications. We serve a worldwide market in the areas of thin film deposition and etching as well as high vacuum technology. We also supply all the accessories needed for thin film deposition work.
of applications: multi-layer optical coatings, sensor devices, solar cells, fuel cells, thin film research, superconductor research, ASICs, MEMs, magnetic devices, biomedical research, and CV dot mapping. Since targets can be changed quickly, the MagSput™ series system is easily reconfigured for applications requiring a different series of deposited materials. The system processes wafers up to 12-inches in diameter, and accommodates odd-size substrates. Further, due to multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum, and reactive sputtering (with active gas mixtures) are possible, leading to a lot of versatility. The stand-alone guns with special mounting enable angular adjustment. The Labview™ based software brings a state-ofthe-art, user-friendly computer control to the tabletop-sputtering realm. The software’s automatic process control ensures a more efficient deposition as well as ease of operation. The manual option enables easy start-up and troubleshooting.
expertise. Cambridge Nanotech Inc. has become a division of Ultratech, Inc., under the name Cambridge Nanotech ALD. Ultratech, Inc., is a major manufacturer of equipment for use in microfabrication including lithography, annealing, and deposition. Our Savannah Series of thin film deposition tools exemplifies these competencies. Savannah has become a preferred system for university researchers worldwide engaged in ALD and looking for an affordable yet robust platform. We have delivered hundreds of these systems in the past decade. Savannah’s efficient use of precursors and power-saving features substantially reduces the cost of operating a thin film deposition system. Savannah is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode for thin film deposition on Ultra High Aspect Ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. Savannah is available in three configurations: S100, S200, and S300. Savannah is capable of holding substrates of different sizes (up to 300mm for the S300). Each of our Savannah thin film deposition systems are equipped with heated precursors lines and the option to add up to six precursor lines. Savannah is capable of handling gas, liquid, or solid precursors.
accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design, plus numerous automation options, makes Phoenix the practical choice for those with batch production ALD requirements Key features include precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates. Get up to 4000 hours mean time between failures for maximum uptime. The patented ALD Shield vapor trap prevents build-ups of deposits and prohibit excess gases from being exhausted into the environment. The process chamber coats up to ten GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects. There is a low cost of ownership with minimal startup and operational costs. Its compact footprint that conserves valuable clean room space and standard recipes and ALD materials are readily available. Comprehensive support and services worldwide is from our team of PhD scientists. The system is CE, FCC and CSA compliant with many built-in safety features.
ALD system capable of performing thermal and plasma-enhanced deposition. We apply advanced computational fluid dynamics analyses to optimize the Fiji reactor, heater, and trap geometry. The system’s intuitive interface makes it easy to monitor and change recipes and processes as needed. Fiji can also be configured with an optional loadlock or glovebox. The Fiji is available in several different configurations, including Dual Chamber and Load Lock. Each chamber can be configured with up to six precursor lines that can accommodate solid, liquid or gas precursors, and five plasma gas lines, offering significant experimental flexibility in a compact and affordable footprint.
combination of deposition sources. The SPW-030 can be equipped with up to four sputtering cathodes, and an electron beam evaporation source, for depositing materials of varying compositions. The main deposition drum can be either heated, or cooled, and the system can be equipped with a pre-treatment ion (bombardment) source. The system can be also equipped with additional cooling rollers and a film thickness monitor.
The anode layer is formed by evaporating lithium metal in an evaporation system (model ei-5). The sealing/packaging layer is formed using a cluster-type evaporator-polymerization system (model PME-200). This Thin Film Battery integrated production system has been jointly developed by ULVAC, Inc. and ULVAC Materials, Inc. A combination of process chambers and deposition sources were selected from ULVAC’s broad product range to provide a suite of equipment ideally suited for TFB applications. In collaboration, Ulvac Materials has developed the appropriate high-density targets (lithium cobalt oxide and lithium phosphate) that optimize the performance with these systems.
optical properties will allow you to produce the most demanding filters. This provides excellent process stability, paired with in-situ optical monitoring to enable achieve the future in optical coating. Process technology produces metal oxide layers with high and low refractive indices and they are deposited with pulsed DC-magnetron sputtering in combination with a reactive-assist process using a low energy RF plasma source. Thin metal layers are deposited by DC-Magnetron sputtering and get fully oxidized by passing through an oxygen plasma created by the plasma source. The ARGUS also offers Co-Sputtering of high and low index materials that enables the creation of any refractive index between the two materials. The stability of the Pulsed DC-Magnetron Sputtering process is ideal for high volume production of all types of optical filters. The transfer from filter designs into production is rapid since calibration runs are not needed. A planetary system with six 16-inch diameter planets is installed in the ARGUS. The thickness uniformity across each planet is ±0.25%. Three round magnetrons are installed to optimize rates. The deposition rates are comparable to IAD processes.
production for less downtime, more scheduling flexibility; Modular designs adapt to future product demands; and Less sensitivity to humidity results in better, more predictable yields. VPT can meet your needs. VPT’s experience with all types of multi-chamber systems and processes insures that you will get an optimum solution for your unique application that meets your unique needs. Please visit www.vptec.com for more information about VPT’s ADVANTAGE Inline Evaporation Systems for precision optics and Model CCS3 Modular Inline Sputtering systems. VPT is integrated vertically in order to command strategic capabilities – the local and total control of all key fabrication, programming, integration, development, and testing steps. Know-How Transfer plays a special role in satisfying the needs of a diverse customer base, the systems in VPT’s Coating Development Laboratory continue to play an absolutely essential role in the design of thin films, their process development, and on-going process support.
in diameter and is ideal for cutting edge research on a wide variety of materials including GaAs, nitrides, and oxides. The GENxplor uses Veeco’s proven GEN10™ growth chamber design and features unmatched process flexibility, ideal for materials research on emerging technologies such as UV LEDs, high-efficiency solar cells, and high-temperature superconductors. Its efficient single frame design combines all vacuum hardware with on-board electronics to make it up to 40% smaller than other MBE systems, saving valuable lab space. Because the manual system is integrated on a single frame, installation time is reduced. The open architecture design of the GENxplor also improves ease-of-use, provides convenient access to effusion cells, and allows easier serviceability when compared to other MBE systems. When coupled with Veeco’s recently introduced retractable sources, the GENxplor system represents the state-of-the-art in oxide materials research.
CPP devices. It is also ideal for MRAM applications. The NEXUS IBD is designed to improve inboard/outboard symmetry, significantly reducing side-to-side imbalances. In addition, sharper takeoff angles and reduction of overspray increase sensitivity. Best of all, the NEXUS IBD can be integrated on a cluster platform with IBE, PVD and other technologies, and is compatible with the current installed base of Veeco deposition and etch cluster tools.
the highrate and reliability requirements of thick overcoat applications. The system is 200mm capable. Designed to provide arc-free and pinhole-free films, the PVD-HR incorporates “bestin-class” technology on a small footprint for a lower cost of ownership. As part of Veeco’s NEXUS family, it can be integrated on a common hardware and software platform with complementary Veeco technologies, such as ion beam deposition, ion beam etch, and reactive sputtering.
quality and cost efficiency. Choose from any combination of three deposition sources: sputtering, thermal evaporation, or CatArc® cathodic arc. Modular design, allowing extensive custom configurations, combined with one of the smallest footprints of any industrial PVD coating system on the market today, make the HC2500 a revolutionary solution for coating line optimization. Water-cooled, the HC2500 stainless steel chamber measures 22” (559 mm) × 20” (508 mm) × 20” (508 mm). Applications for the HC2500 include depositing wear resistant coatings for metal working tools such as drills, mills, punches, reams, gear cutters, hard cutting, dry machining, high speed machining, and more. When you purchase a VTI coating system you benefit from over twenty years of engineering refinement. Built into each system is the know-how only achieved by designing, manufacturing, installing, and operating hundreds of vacuum coating systems globally.
unprecedented speed and reliability. As part of this redesign, the PS4000SL high-vacuum circuit was improved to allow faster evacuation times and shorter cycles. Alternatively, deeper base-pressures can be achieved without cycle-time penalty if desired. The new twin cryo-traps were re-engineered for more effective water-vapor removal, without risking contamination of the high-vacuum circuit. The vacuum valves for the cryo-traps were also changed to pendulum-style designs. When compared with the previous poppet valves, these pendulum valves allow greater exposure to the cryo-coils, while improving the overall reliability. The internal volume of the vacuum chamber was reduced without changing the processing capacity of the system. The aggregate effect of all these improvements is a cycle-time well below 4 minutes for the most common coatings. In addition to the performance improvements described above, the layout of key components with respect to the unique mono-frame structure has improved. The new layout allows for easier access to all major components. It also reduces the overall height allowing the PS4000SL to be transported in standard box-truck trailers, or standard containers if transported by sea. These changes simplify logistics as well as freight charges, which can be significant depending on the installation location. Since the system requires less disassembly for shipping, the installation time has been reduced as well. Often, the PS4000SL can be up and running in one day upon arrival. The entire Press-Side® line of Rapid Cycle Metallizers are designed for keeping synchronous pace with medium to high volume injection molding operations.
analysis. It can be used as an in-situ solution, cleaning EUV and X-ray optics. The Evactron® Decontaminator is a general purpose RF plasma asher capable of external mounting on most vacuum chambers and electron microscopes. Low power prevents instrument damage. The Evactron® De-Contaminator can use air, oxygen gas, oxygen gas mixtures or hydrogen gas for gentle cleaning and decontamination without damage.
and other analytic instruments by removing carbon contamination. The system monitors operation of either PRS unit, has internal memory, and is designed for routine operation with minimal operator training. Onboard control allows for changing the cleaning modes between external and internal PRS with just the flip of a switch. This system is compatible with rotary vane pumps without the worry of oil backstreaming. A dry nitrogen purge feature keeps specimens clean after a plasma cleaning, and a storage mode allows you to continue dry nitrogen purging a sample while the external PRS is in use. The system features a microprocessor with embedded software to regulate a leak valve and control the chamber pressure by a MicroPirani gauge. The microprocessor also regulates the RF power, has a clock to time the downstream plasma cleaning and nitrogen purging cycles, and records the operational and fault log. Cleaning with the Evactron CombiClean System may be setup from either the front panel or a remote computer.
that design integrity as the system is being constructed. We also integrate customer-supplied equipment as requested. Systems are available in bell jars, box coaters, load-lock, in-line and batch configurations. A wide variety of sources can be installed, i.e., electron beam sources, thermal sources, ion sources, and magnetron or diode cathodes (RF or DC). YTI offers in-house automation technology to assure consistent performance with low start-up costs and yielding a higher throughput and superior product. YTI offers a competitive price to performance ratio. YTI’s services include high quality in new PVD, CVD, and PECVD vacuum systems as well as bell jar, box coater, loadlock, inline and batch system capabilities with maximum pumping efficiencies. Customized processes are available for exotic requirements that meet uniformity and film parameters.